CN102033343B - 阵列基板及其制造方法 - Google Patents
阵列基板及其制造方法 Download PDFInfo
- Publication number
- CN102033343B CN102033343B CN200910093194A CN200910093194A CN102033343B CN 102033343 B CN102033343 B CN 102033343B CN 200910093194 A CN200910093194 A CN 200910093194A CN 200910093194 A CN200910093194 A CN 200910093194A CN 102033343 B CN102033343 B CN 102033343B
- Authority
- CN
- China
- Prior art keywords
- film
- overlayer
- circuit pattern
- electrode
- underlay substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 60
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 239000000203 mixture Substances 0.000 claims abstract description 29
- 239000012528 membrane Substances 0.000 claims abstract description 14
- 239000010408 film Substances 0.000 claims description 62
- 230000004888 barrier function Effects 0.000 claims description 52
- 230000000452 restraining effect Effects 0.000 claims description 42
- 238000005516 engineering process Methods 0.000 claims description 38
- 239000000463 material Substances 0.000 claims description 31
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 21
- 239000010949 copper Substances 0.000 claims description 21
- 229910052802 copper Inorganic materials 0.000 claims description 20
- 230000008021 deposition Effects 0.000 claims description 17
- 229910052782 aluminium Inorganic materials 0.000 claims description 15
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 15
- 239000004411 aluminium Substances 0.000 claims description 14
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 10
- 229910052750 molybdenum Inorganic materials 0.000 claims description 10
- 239000011733 molybdenum Substances 0.000 claims description 10
- 239000010936 titanium Substances 0.000 claims description 10
- 229910001257 Nb alloy Inorganic materials 0.000 claims description 9
- 229910001069 Ti alloy Inorganic materials 0.000 claims description 9
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 9
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims description 9
- 239000012212 insulator Substances 0.000 claims description 9
- DTSBBUTWIOVIBV-UHFFFAOYSA-N molybdenum niobium Chemical compound [Nb].[Mo] DTSBBUTWIOVIBV-UHFFFAOYSA-N 0.000 claims description 9
- ZPZCREMGFMRIRR-UHFFFAOYSA-N molybdenum titanium Chemical compound [Ti].[Mo] ZPZCREMGFMRIRR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052719 titanium Inorganic materials 0.000 claims description 9
- 238000004062 sedimentation Methods 0.000 claims description 8
- 230000001681 protective effect Effects 0.000 claims description 7
- 239000012787 coverlay film Substances 0.000 claims description 5
- 229910000838 Al alloy Inorganic materials 0.000 claims description 4
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 4
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 claims description 4
- 238000000151 deposition Methods 0.000 abstract description 13
- 238000000034 method Methods 0.000 abstract description 13
- 229910052751 metal Inorganic materials 0.000 abstract description 12
- 239000002184 metal Substances 0.000 abstract description 12
- 238000009792 diffusion process Methods 0.000 abstract description 6
- 238000009413 insulation Methods 0.000 description 10
- 230000015572 biosynthetic process Effects 0.000 description 9
- 238000005530 etching Methods 0.000 description 8
- 238000002360 preparation method Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 229910052581 Si3N4 Inorganic materials 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 238000002161 passivation Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- JUZTWRXHHZRLED-UHFFFAOYSA-N [Si].[Cu].[Cu].[Cu].[Cu].[Cu] Chemical compound [Si].[Cu].[Cu].[Cu].[Cu].[Cu] JUZTWRXHHZRLED-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910021360 copper silicide Inorganic materials 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136286—Wiring, e.g. gate line, drain line
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/45—Ohmic electrodes
- H01L29/456—Ohmic electrodes on silicon
- H01L29/458—Ohmic electrodes on silicon for thin film silicon, e.g. source or drain electrode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/4908—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET for thin film semiconductor, e.g. gate of TFT
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1343—Electrodes
- G02F1/134309—Electrodes characterised by their geometrical arrangement
- G02F1/134372—Electrodes characterised by their geometrical arrangement for fringe field switching [FFS] where the common electrode is not patterned
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136286—Wiring, e.g. gate line, drain line
- G02F1/13629—Multilayer wirings
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136286—Wiring, e.g. gate line, drain line
- G02F1/136295—Materials; Compositions; Manufacture processes
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
- G02F2201/50—Protective arrangements
- G02F2201/501—Blocking layers, e.g. against migration of ions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer, layered thin film adhesion layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0753—Insulation
- H05K2201/0769—Anti metal-migration, e.g. avoiding tin whisker growth
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Nonlinear Science (AREA)
- Ceramic Engineering (AREA)
- Mathematical Physics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- Thin Film Transistor (AREA)
- Liquid Crystal (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
Description
Claims (12)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200910093194A CN102033343B (zh) | 2009-09-25 | 2009-09-25 | 阵列基板及其制造方法 |
US12/887,698 US8487347B2 (en) | 2009-09-25 | 2010-09-22 | Array substrate and manufacturing method thereof |
JP2010213510A JP5827795B2 (ja) | 2009-09-25 | 2010-09-24 | アレイ基板及びその製造方法 |
KR1020100092933A KR101270484B1 (ko) | 2009-09-25 | 2010-09-24 | 어레이 기판 및 그 제조 방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200910093194A CN102033343B (zh) | 2009-09-25 | 2009-09-25 | 阵列基板及其制造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102033343A CN102033343A (zh) | 2011-04-27 |
CN102033343B true CN102033343B (zh) | 2012-09-19 |
Family
ID=43779300
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200910093194A Active CN102033343B (zh) | 2009-09-25 | 2009-09-25 | 阵列基板及其制造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8487347B2 (zh) |
JP (1) | JP5827795B2 (zh) |
KR (1) | KR101270484B1 (zh) |
CN (1) | CN102033343B (zh) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101953215B1 (ko) * | 2012-10-05 | 2019-03-04 | 삼성디스플레이 주식회사 | 식각 조성물, 금속 배선 및 표시 기판의 제조방법 |
CN102956713B (zh) * | 2012-10-19 | 2016-03-09 | 京东方科技集团股份有限公司 | 一种薄膜晶体管及其制作方法、阵列基板和显示装置 |
JP5909198B2 (ja) | 2013-01-21 | 2016-04-26 | 株式会社ジャパンディスプレイ | 液晶表示パネル及び電子機器 |
KR102162888B1 (ko) * | 2013-06-27 | 2020-10-08 | 엘지디스플레이 주식회사 | 액정표시장치 어레이 기판 및 그 제조방법 |
TWI502263B (zh) * | 2013-07-25 | 2015-10-01 | Au Optronics Corp | 畫素結構、顯示面板及其製作方法 |
KR102169013B1 (ko) * | 2013-12-17 | 2020-10-23 | 삼성디스플레이 주식회사 | 박막트랜지스터 어레이 기판, 유기 발광 표시 장치 및 박막트랜지스터 어레이 기판의 제조 방법 |
CN104681626A (zh) * | 2015-03-03 | 2015-06-03 | 京东方科技集团股份有限公司 | 氧化物薄膜晶体管及其制作方法、阵列基板 |
CN104795402B (zh) | 2015-04-09 | 2016-09-07 | 京东方科技集团股份有限公司 | 阵列基板及其制作方法和显示装置 |
CN105789218A (zh) * | 2016-03-10 | 2016-07-20 | 京东方科技集团股份有限公司 | 一种基板、其制作方法及显示装置 |
US10192909B2 (en) | 2017-04-17 | 2019-01-29 | Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Array substrate structure and manufacturing method of array substrate |
CN106932986B (zh) * | 2017-04-17 | 2019-04-02 | 深圳市华星光电半导体显示技术有限公司 | 阵列基板结构及阵列基板的制备方法 |
CN110854069A (zh) * | 2019-10-31 | 2020-02-28 | 深圳市华星光电半导体显示技术有限公司 | 阵列基板的制备方法及阵列基板 |
US11411026B2 (en) * | 2019-10-31 | 2022-08-09 | Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Method for manufacturing array substrate and array substrate |
CN113589605B (zh) * | 2021-07-29 | 2024-01-16 | 武汉京东方光电科技有限公司 | 一种阵列基板及其制备方法、显示面板 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1790750A (zh) * | 2004-12-08 | 2006-06-21 | 三星电子株式会社 | 薄膜晶体管、其制造方法、显示设备及其制造方法 |
CN101140398A (zh) * | 2006-09-07 | 2008-03-12 | 株式会社未来视野 | 液晶显示板的制造方法及液晶显示板 |
CN101349847A (zh) * | 2007-07-18 | 2009-01-21 | 三星电子株式会社 | 显示基板和所述显示基板的制造方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20000002805A (ko) | 1998-06-23 | 2000-01-15 | 김영환 | 박막 트랜지스터의 제조방법 |
JP4382181B2 (ja) * | 1998-11-25 | 2009-12-09 | エルジー ディスプレイ カンパニー リミテッド | 薄膜トランジスタアレイ基板の製造方法 |
US6159779A (en) * | 1999-02-03 | 2000-12-12 | Industrial Technology Research Institute | Multi-layer gate for TFT and method of fabrication |
JP2001194676A (ja) * | 2000-01-07 | 2001-07-19 | Hitachi Ltd | 液晶表示装置 |
JP4238956B2 (ja) * | 2000-01-12 | 2009-03-18 | エルジー ディスプレイ カンパニー リミテッド | 銅配線基板及びその製造方法並びに液晶表示装置 |
KR100672623B1 (ko) | 2000-08-30 | 2007-01-23 | 엘지.필립스 엘시디 주식회사 | 액정표시장치 제조방법 |
KR100795344B1 (ko) * | 2001-05-29 | 2008-01-17 | 엘지.필립스 엘시디 주식회사 | 액정표시장치용 어레이 기판 및 그의 제조방법 |
JP2006189484A (ja) * | 2004-12-28 | 2006-07-20 | Toshiba Matsushita Display Technology Co Ltd | 配線構造及び部品実装構造 |
KR101137861B1 (ko) * | 2005-06-20 | 2012-04-20 | 엘지디스플레이 주식회사 | 프린지 필드 스위칭 타입의 박막 트랜지스터 기판 및 그제조방법 |
KR101274684B1 (ko) | 2006-08-03 | 2013-06-12 | 엘지디스플레이 주식회사 | 액정표시장치 및 그의 제조방법 |
TWI312578B (en) * | 2006-09-29 | 2009-07-21 | Innolux Display Corp | Thin film transistor substrate |
-
2009
- 2009-09-25 CN CN200910093194A patent/CN102033343B/zh active Active
-
2010
- 2010-09-22 US US12/887,698 patent/US8487347B2/en active Active
- 2010-09-24 KR KR1020100092933A patent/KR101270484B1/ko active IP Right Grant
- 2010-09-24 JP JP2010213510A patent/JP5827795B2/ja active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1790750A (zh) * | 2004-12-08 | 2006-06-21 | 三星电子株式会社 | 薄膜晶体管、其制造方法、显示设备及其制造方法 |
CN101140398A (zh) * | 2006-09-07 | 2008-03-12 | 株式会社未来视野 | 液晶显示板的制造方法及液晶显示板 |
CN101349847A (zh) * | 2007-07-18 | 2009-01-21 | 三星电子株式会社 | 显示基板和所述显示基板的制造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP5827795B2 (ja) | 2015-12-02 |
US20110073867A1 (en) | 2011-03-31 |
KR101270484B1 (ko) | 2013-06-03 |
CN102033343A (zh) | 2011-04-27 |
JP2011070200A (ja) | 2011-04-07 |
US8487347B2 (en) | 2013-07-16 |
KR20110033808A (ko) | 2011-03-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102033343B (zh) | 阵列基板及其制造方法 | |
CN100576550C (zh) | 薄膜晶体管阵列基板及其制造方法 | |
CN101097928B (zh) | 薄膜晶体管阵列基板及其制造方法 | |
CN103730475B (zh) | 一种阵列基板及其制造方法、显示装置 | |
CN104637925A (zh) | 用于显示面板的阵列基板及其制造方法 | |
CN103178021B (zh) | 一种氧化物薄膜晶体管阵列基板及制作方法、显示面板 | |
CN102315165B (zh) | 边缘电场型液晶显示器阵列基板及其制造方法 | |
CN103018990B (zh) | 一种阵列基板和其制备方法、及液晶显示装置 | |
CN102750024A (zh) | 用于嵌入式触摸传感器液晶显示装置的基板及其制造方法 | |
CN104914640A (zh) | 一种阵列基板及其制作方法、显示面板、显示装置 | |
KR102305495B1 (ko) | 박막 트랜지스터 기판 및 이의 제조방법 | |
CN105264669A (zh) | 用于在电子装置中金属化的铜合金阻挡层和覆盖层 | |
CN103872060A (zh) | 阵列基板及其制造方法 | |
CN104851789A (zh) | 薄膜晶体管及制作方法、阵列基板及制作方法和显示装置 | |
CN104766803A (zh) | Tft的制作方法及tft、阵列基板、显示装置 | |
CN106356376A (zh) | 具有低线电阻结构的超高密度薄膜晶体管基板及制造方法 | |
CN106019751A (zh) | 阵列基板及其制造方法、显示装置 | |
CN103413834B (zh) | 一种薄膜晶体管及其制作方法、阵列基板及显示装置 | |
CN108493216A (zh) | 一种tft阵列基板、显示装置及tft阵列基板的制备方法 | |
CN104241296A (zh) | 一种阵列基板及其制作方法和显示装置 | |
CN100590854C (zh) | 像素结构及其制造方法 | |
CN105575977B (zh) | 显示基板、制备方法及显示装置 | |
CN104752437A (zh) | 制造薄膜晶体管阵列基板的方法 | |
CN203179887U (zh) | 一种阵列基板及显示装置 | |
CN107978608A (zh) | Ips型薄膜晶体管阵列基板及其制作方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: BEIJING BOE PHOTOELECTRICITY SCIENCE + TECHNOLOGY Effective date: 20150623 Owner name: JINGDONGFANG SCIENCE AND TECHNOLOGY GROUP CO., LTD Free format text: FORMER OWNER: BEIJING BOE PHOTOELECTRICITY SCIENCE + TECHNOLOGY CO., LTD. Effective date: 20150623 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20150623 Address after: 100015 Jiuxianqiao Road, Beijing, No. 10, No. Patentee after: BOE Technology Group Co., Ltd. Patentee after: Beijing BOE Photoelectricity Science & Technology Co., Ltd. Address before: 100176 Beijing economic and Technological Development Zone, West Central Road, No. 8 Patentee before: Beijing BOE Photoelectricity Science & Technology Co., Ltd. |