CN102016723A - 光刻设备、器件制造方法、清洁系统以及图案形成装置的清洁方法 - Google Patents

光刻设备、器件制造方法、清洁系统以及图案形成装置的清洁方法 Download PDF

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Publication number
CN102016723A
CN102016723A CN2009801144055A CN200980114405A CN102016723A CN 102016723 A CN102016723 A CN 102016723A CN 2009801144055 A CN2009801144055 A CN 2009801144055A CN 200980114405 A CN200980114405 A CN 200980114405A CN 102016723 A CN102016723 A CN 102016723A
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CN
China
Prior art keywords
pattern
lithographic equipment
radiation beam
cleaning
cleaning electrode
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Pending
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CN2009801144055A
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English (en)
Chinese (zh)
Inventor
L·斯卡克卡巴拉兹
V·V·伊万诺夫
K·N·克什烈夫
J·H·J·莫尔斯
L·H·J·斯蒂文斯
P·S·安提斯弗诺夫
V·M·克里夫特逊
L·A·多若克林
M·范卡朋
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ASML Netherlands BV
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ASML Netherlands BV
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Publication of CN102016723A publication Critical patent/CN102016723A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H01L21/0275—Photolithographic processes using lasers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Epidemiology (AREA)
  • Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • General Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CN2009801144055A 2008-04-23 2009-04-16 光刻设备、器件制造方法、清洁系统以及图案形成装置的清洁方法 Pending CN102016723A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US7134508P 2008-04-23 2008-04-23
US61/071,345 2008-04-23
PCT/EP2009/002782 WO2009129960A1 (en) 2008-04-23 2009-04-16 Lithographic apparatus, device manufacturing method, cleaning system and method for cleaning a patterning device

Publications (1)

Publication Number Publication Date
CN102016723A true CN102016723A (zh) 2011-04-13

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CN2009801144055A Pending CN102016723A (zh) 2008-04-23 2009-04-16 光刻设备、器件制造方法、清洁系统以及图案形成装置的清洁方法

Country Status (7)

Country Link
US (1) US20110037960A1 (enExample)
JP (1) JP5535194B2 (enExample)
KR (1) KR20110005288A (enExample)
CN (1) CN102016723A (enExample)
NL (1) NL1036769A1 (enExample)
TW (1) TWI453545B (enExample)
WO (1) WO2009129960A1 (enExample)

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CN105518530A (zh) * 2013-09-04 2016-04-20 Asml荷兰有限公司 用于保护euv光学元件的设备
CN106502047A (zh) * 2015-09-03 2017-03-15 佳能株式会社 压印装置、物品的制造方法及供给装置
CN110899246A (zh) * 2018-09-14 2020-03-24 长鑫存储技术有限公司 光罩缺陷的清洁装置及清洁方法
CN111051986A (zh) * 2017-08-28 2020-04-21 Asml控股股份有限公司 清洁在光刻装置内的支撑件的装置和方法
CN111061129A (zh) * 2018-10-17 2020-04-24 台湾积体电路制造股份有限公司 光刻系统及清洁光刻系统的方法
CN111880375A (zh) * 2019-05-02 2020-11-03 三星电子株式会社 半导体器件的制造系统和使用其制造半导体器件的方法
CN112969970A (zh) * 2018-11-09 2021-06-15 Asml控股股份有限公司 用于清洁光刻设备内的支撑件的设备和方法
CN114556222A (zh) * 2019-10-18 2022-05-27 Asml荷兰有限公司 图案形成装置调节系统以及方法
CN114690536A (zh) * 2021-03-05 2022-07-01 台湾积体电路制造股份有限公司 清洁极紫外线遮罩的系统和方法

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JP5758153B2 (ja) 2010-03-12 2015-08-05 エーエスエムエル ネザーランズ ビー．ブイ． 放射源装置、リソグラフィ装置、放射発生および送出方法、およびデバイス製造方法
US8891080B2 (en) * 2010-07-08 2014-11-18 Canon Nanotechnologies, Inc. Contaminate detection and substrate cleaning
JP5557674B2 (ja) * 2010-09-29 2014-07-23 三菱スペース・ソフトウエア株式会社 スペースデブリ焼滅装置、スペースデブリ焼滅システムおよびスペースデブリ焼滅方法
JP5821397B2 (ja) * 2011-08-16 2015-11-24 富士通セミコンダクター株式会社 極紫外露光マスク用防塵装置及び露光方法
CN103782365B (zh) * 2011-09-05 2016-10-05 株式会社东芝 掩模版吸盘洁净器及掩模版吸盘清洁方法
US20140253887A1 (en) * 2013-03-07 2014-09-11 Applied Materials, Inc. Contamination prevention for photomask in extreme ultraviolet lithography application
US9378941B2 (en) 2013-10-02 2016-06-28 Applied Materials, Inc. Interface treatment of semiconductor surfaces with high density low energy plasma
JP2015176934A (ja) * 2014-03-13 2015-10-05 株式会社東芝 静電チャッククリーナ、クリーニング方法、および露光装置
US9539622B2 (en) * 2014-03-18 2017-01-10 Asml Netherlands B.V. Apparatus for and method of active cleaning of EUV optic with RF plasma field
CN106164776B (zh) * 2014-04-09 2019-04-23 Asml荷兰有限公司 用于清洁对象的装置
JP2018500596A (ja) * 2014-12-31 2018-01-11 エーエスエムエル ホールディング エヌ．ブイ． パターニングデバイス環境を有するリソグラフィ装置
KR20180098784A (ko) 2017-02-27 2018-09-05 김창연 기도용 텐트
WO2019001931A1 (en) * 2017-06-29 2019-01-03 Asml Netherlands B.V. SYSTEM, LITHOGRAPHIC APPARATUS, AND METHOD FOR REDUCING OXIDATION OR OXIDE REMOVAL ON SUBSTRATE CARRIER
IL273836B2 (en) 2017-10-31 2023-09-01 Asml Netherlands Bv A measuring device, a method for measuring a structure, a method for making a device
WO2019129456A1 (en) * 2017-12-28 2019-07-04 Asml Netherlands B.V. Apparatus for and a method of removing contaminant particles from a component of an apparatus
EP3506011A1 (en) * 2017-12-28 2019-07-03 ASML Netherlands B.V. Apparatus for and a method of removing contaminant particles from a component of a metrology apparatus
JP7262939B2 (ja) * 2018-07-20 2023-04-24 キヤノン株式会社 クリーニング装置、インプリント装置、リソグラフィ装置、および、クリーニング方法
NL2024289B1 (en) * 2018-11-27 2020-09-25 Asml Netherlands Bv Membrane cleaning apparatus
CN113169047B (zh) 2018-12-10 2024-09-10 应用材料公司 在极紫外线光刻应用中从光掩模去除附接特征
EP4045974A1 (en) * 2019-10-18 2022-08-24 ASML Netherlands B.V. Membrane cleaning apparatus
KR102788879B1 (ko) 2019-10-30 2025-04-01 삼성전자주식회사 극자외선 노광 시스템
US11294292B2 (en) 2019-12-30 2022-04-05 Taiwan Semiconductor Manufacturing Co., Ltd. Particle removing assembly and method of cleaning mask for lithography
IL294398A (en) 2020-01-23 2022-08-01 Asml Holding Nv A lithographic system provided with a deflection mechanism to change the trajectory of particulate debris
US12287589B2 (en) 2021-03-26 2025-04-29 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus for removing contamination
CN118265951A (zh) * 2021-11-25 2024-06-28 Asml荷兰有限公司 一种光学装置、照射系统、投影系统、euv辐射源、光刻设备、污染沉积防止方法以及光学部件翻新方法
WO2024132381A1 (en) * 2022-12-22 2024-06-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
CN120958388A (zh) * 2023-04-14 2025-11-14 Asml荷兰有限公司 用于在光刻中使用的静电夹具

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JP3644246B2 (ja) * 1998-04-10 2005-04-27 三菱電機株式会社 Ｘ線露光方法
US6369874B1 (en) * 2000-04-18 2002-04-09 Silicon Valley Group, Inc. Photoresist outgassing mitigation system method and apparatus for in-vacuum lithography
US6781673B2 (en) * 2000-08-25 2004-08-24 Asml Netherlands B.V. Mask handling apparatus, lithographic projection apparatus, device manufacturing method and device manufactured thereby
US6828569B2 (en) * 2001-11-19 2004-12-07 Asml Netherlands B.V. Lithographic projection apparatus, device manufacturing method and device manufactured thereby
EP1329770A1 (en) * 2002-01-18 2003-07-23 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1329773A3 (en) * 2002-01-18 2006-08-30 ASML Netherlands B.V. Lithographic apparatus, apparatus cleaning method, and device manufacturing method
KR100563102B1 (ko) * 2002-09-12 2006-03-27 에이에스엠엘 네델란즈 비.브이. 표면들로부터 입자들을 제거함으로써 세정하는 방법,세정장치 및 리소그래피투영장치
EP1411392B1 (en) * 2002-10-18 2008-09-17 ASML Netherlands B.V. Lithographic projection apparatus
SG115575A1 (en) * 2002-10-18 2005-10-28 Asml Netherlands Bv Lithographic projection apparatus comprising a secondary electron removal unit
SG121847A1 (en) * 2002-12-20 2006-05-26 Asml Netherlands Bv Method for cleaning a surface of a component of a lithographic projection apparatus, lithographic projection apparatus, device manufacturing method and cleaning system
US7248332B2 (en) * 2004-07-13 2007-07-24 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2006120776A (ja) * 2004-10-20 2006-05-11 Canon Inc 露光装置
JP2006287003A (ja) * 2005-04-01 2006-10-19 Tohoku Univ 露光装置
JP2007329288A (ja) * 2006-06-07 2007-12-20 Canon Inc 露光装置及びデバイス製造方法
US7671347B2 (en) * 2006-10-10 2010-03-02 Asml Netherlands B.V. Cleaning method, apparatus and cleaning system

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105518530B (zh) * 2013-09-04 2019-09-24 Asml荷兰有限公司 用于保护euv光学元件的设备
CN105518530A (zh) * 2013-09-04 2016-04-20 Asml荷兰有限公司 用于保护euv光学元件的设备
CN106502047A (zh) * 2015-09-03 2017-03-15 佳能株式会社 压印装置、物品的制造方法及供给装置
CN111051986B (zh) * 2017-08-28 2024-04-16 Asml控股股份有限公司 清洁在光刻装置内的支撑件的装置和方法
CN111051986A (zh) * 2017-08-28 2020-04-21 Asml控股股份有限公司 清洁在光刻装置内的支撑件的装置和方法
CN110899246A (zh) * 2018-09-14 2020-03-24 长鑫存储技术有限公司 光罩缺陷的清洁装置及清洁方法
CN111061129A (zh) * 2018-10-17 2020-04-24 台湾积体电路制造股份有限公司 光刻系统及清洁光刻系统的方法
CN112969970A (zh) * 2018-11-09 2021-06-15 Asml控股股份有限公司 用于清洁光刻设备内的支撑件的设备和方法
CN111880375A (zh) * 2019-05-02 2020-11-03 三星电子株式会社 半导体器件的制造系统和使用其制造半导体器件的方法
CN111880375B (zh) * 2019-05-02 2024-09-06 三星电子株式会社 半导体器件的制造系统和使用其制造半导体器件的方法
CN114556222A (zh) * 2019-10-18 2022-05-27 Asml荷兰有限公司 图案形成装置调节系统以及方法
US12372888B2 (en) 2019-10-18 2025-07-29 Asml Netherlands B.V. Patterning device conditioning system and method
CN114690536A (zh) * 2021-03-05 2022-07-01 台湾积体电路制造股份有限公司 清洁极紫外线遮罩的系统和方法

Also Published As

Publication number Publication date
WO2009129960A1 (en) 2009-10-29
JP2011519156A (ja) 2011-06-30
US20110037960A1 (en) 2011-02-17
NL1036769A1 (nl) 2009-10-26
TWI453545B (zh) 2014-09-21
KR20110005288A (ko) 2011-01-17
JP5535194B2 (ja) 2014-07-02
TW200949458A (en) 2009-12-01

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Effective date of abandoning: 20170412