JP5535194B2 - リソグラフィ装置、デバイス製造方法、クリーニングシステム、およびパターニングデバイスをクリーニングする方法 - Google Patents

リソグラフィ装置、デバイス製造方法、クリーニングシステム、およびパターニングデバイスをクリーニングする方法 Download PDF

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JP5535194B2
JP5535194B2 JP2011505407A JP2011505407A JP5535194B2 JP 5535194 B2 JP5535194 B2 JP 5535194B2 JP 2011505407 A JP2011505407 A JP 2011505407A JP 2011505407 A JP2011505407 A JP 2011505407A JP 5535194 B2 JP5535194 B2 JP 5535194B2
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Japan
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patterning device
radiation beam
lithographic apparatus
cleaning
cleaning electrode
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Expired - Fee Related
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JP2011505407A
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Japanese (ja)
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JP2011519156A (ja
JP2011519156A5 (enExample
Inventor
スキャカバロッツィ，ルイージ
イワノフ，ウラジミール，ビターレビッチ
コシェレブ，コンスタンチン，ニコラエビッチ
モールス，ヨハネス，フベルトゥス，ヨセフィナ
スティーブンズ，ルーカス，ヘンリカス，ヨハネス
アンツィフェロブ，パベル，スタニスラボビッチ
クリブツン，ブラディミア，ミハイロビッチ
ドロヒン，レオニード，アレキサンドロビッチ
カンペン，マールテン ヴァン
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エーエスエムエル ネザーランズ ビー．ブイ．
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Publication of JP2011519156A5 publication Critical patent/JP2011519156A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H01L21/0275—Photolithographic processes using lasers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Epidemiology (AREA)
  • Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • General Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2011505407A 2008-04-23 2009-04-16 リソグラフィ装置、デバイス製造方法、クリーニングシステム、およびパターニングデバイスをクリーニングする方法 Expired - Fee Related JP5535194B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US7134508P 2008-04-23 2008-04-23
US61/071,345 2008-04-23
PCT/EP2009/002782 WO2009129960A1 (en) 2008-04-23 2009-04-16 Lithographic apparatus, device manufacturing method, cleaning system and method for cleaning a patterning device

Publications (3)

Publication Number Publication Date
JP2011519156A JP2011519156A (ja) 2011-06-30
JP2011519156A5 JP2011519156A5 (enExample) 2012-06-07
JP5535194B2 true JP5535194B2 (ja) 2014-07-02

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Country Status (7)

Country Link
US (1) US20110037960A1 (enExample)
JP (1) JP5535194B2 (enExample)
KR (1) KR20110005288A (enExample)
CN (1) CN102016723A (enExample)
NL (1) NL1036769A1 (enExample)
TW (1) TWI453545B (enExample)
WO (1) WO2009129960A1 (enExample)

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CN103782365B (zh) * 2011-09-05 2016-10-05 株式会社东芝 掩模版吸盘洁净器及掩模版吸盘清洁方法
US20140253887A1 (en) * 2013-03-07 2014-09-11 Applied Materials, Inc. Contamination prevention for photomask in extreme ultraviolet lithography application
US8901523B1 (en) * 2013-09-04 2014-12-02 Asml Netherlands B.V. Apparatus for protecting EUV optical elements
US9378941B2 (en) 2013-10-02 2016-06-28 Applied Materials, Inc. Interface treatment of semiconductor surfaces with high density low energy plasma
JP2015176934A (ja) * 2014-03-13 2015-10-05 株式会社東芝 静電チャッククリーナ、クリーニング方法、および露光装置
US9539622B2 (en) * 2014-03-18 2017-01-10 Asml Netherlands B.V. Apparatus for and method of active cleaning of EUV optic with RF plasma field
CN106164776B (zh) * 2014-04-09 2019-04-23 Asml荷兰有限公司 用于清洁对象的装置
JP2018500596A (ja) * 2014-12-31 2018-01-11 エーエスエムエル ホールディング エヌ．ブイ． パターニングデバイス環境を有するリソグラフィ装置
JP6702672B2 (ja) * 2015-09-03 2020-06-03 キヤノン株式会社 インプリント装置、物品の製造方法及び供給装置
KR20180098784A (ko) 2017-02-27 2018-09-05 김창연 기도용 텐트
WO2019001931A1 (en) * 2017-06-29 2019-01-03 Asml Netherlands B.V. SYSTEM, LITHOGRAPHIC APPARATUS, AND METHOD FOR REDUCING OXIDATION OR OXIDE REMOVAL ON SUBSTRATE CARRIER
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WO2019129456A1 (en) * 2017-12-28 2019-07-04 Asml Netherlands B.V. Apparatus for and a method of removing contaminant particles from a component of an apparatus
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JP7262939B2 (ja) * 2018-07-20 2023-04-24 キヤノン株式会社 クリーニング装置、インプリント装置、リソグラフィ装置、および、クリーニング方法
CN110899246A (zh) * 2018-09-14 2020-03-24 长鑫存储技术有限公司 光罩缺陷的清洁装置及清洁方法
CN111061129B (zh) * 2018-10-17 2022-11-01 台湾积体电路制造股份有限公司 光刻系统及清洁光刻系统的方法
CN112969970B (zh) * 2018-11-09 2024-10-11 Asml控股股份有限公司 用于清洁光刻设备内的支撑件的设备和方法
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CN113169047B (zh) 2018-12-10 2024-09-10 应用材料公司 在极紫外线光刻应用中从光掩模去除附接特征
KR102813711B1 (ko) * 2019-05-02 2025-05-29 삼성전자주식회사 반도체 소자의 제조 장치 및 그를 이용한 반도체 소자의 제조 방법
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KR102788879B1 (ko) 2019-10-30 2025-04-01 삼성전자주식회사 극자외선 노광 시스템
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CN120958388A (zh) * 2023-04-14 2025-11-14 Asml荷兰有限公司 用于在光刻中使用的静电夹具

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Publication number Publication date
WO2009129960A1 (en) 2009-10-29
JP2011519156A (ja) 2011-06-30
CN102016723A (zh) 2011-04-13
US20110037960A1 (en) 2011-02-17
NL1036769A1 (nl) 2009-10-26
TWI453545B (zh) 2014-09-21
KR20110005288A (ko) 2011-01-17
TW200949458A (en) 2009-12-01

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