CN102006024A - 振动片的制造方法和振子的制造方法 - Google Patents
振动片的制造方法和振子的制造方法 Download PDFInfo
- Publication number
- CN102006024A CN102006024A CN2010105972942A CN201010597294A CN102006024A CN 102006024 A CN102006024 A CN 102006024A CN 2010105972942 A CN2010105972942 A CN 2010105972942A CN 201010597294 A CN201010597294 A CN 201010597294A CN 102006024 A CN102006024 A CN 102006024A
- Authority
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- manufacture method
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- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 41
- 238000005530 etching Methods 0.000 claims abstract description 24
- 239000002184 metal Substances 0.000 claims description 43
- 229910052751 metal Inorganic materials 0.000 claims description 43
- 238000000034 method Methods 0.000 claims description 41
- 235000014676 Phragmites communis Nutrition 0.000 claims description 36
- 238000004806 packaging method and process Methods 0.000 claims description 24
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 239000000463 material Substances 0.000 description 10
- 238000005452 bending Methods 0.000 description 8
- 230000001965 increasing effect Effects 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 230000007935 neutral effect Effects 0.000 description 4
- 230000002708 enhancing effect Effects 0.000 description 3
- 238000001312 dry etching Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 244000089486 Phragmites australis subsp australis Species 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
- H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H3/04—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/21—Crystal tuning forks
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49005—Acoustic transducer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4957—Sound device making
- Y10T29/49574—Musical instrument or tuning fork making
Abstract
Description
Claims (6)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008005768A JP4533934B2 (ja) | 2008-01-15 | 2008-01-15 | 振動片及び振動子の製造方法 |
JP2008-005768 | 2008-01-15 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2009100013072A Division CN101488731B (zh) | 2008-01-15 | 2009-01-04 | 振动片的制造方法和振子的制造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102006024A true CN102006024A (zh) | 2011-04-06 |
CN102006024B CN102006024B (zh) | 2014-08-06 |
Family
ID=40849401
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201010597294.2A Expired - Fee Related CN102006024B (zh) | 2008-01-15 | 2009-01-04 | 振动片的制造方法和振子的制造方法 |
CN2010105972923A Pending CN102064790A (zh) | 2008-01-15 | 2009-01-04 | 振动片的制造方法和振子的制造方法 |
CN2009100013072A Expired - Fee Related CN101488731B (zh) | 2008-01-15 | 2009-01-04 | 振动片的制造方法和振子的制造方法 |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010105972923A Pending CN102064790A (zh) | 2008-01-15 | 2009-01-04 | 振动片的制造方法和振子的制造方法 |
CN2009100013072A Expired - Fee Related CN101488731B (zh) | 2008-01-15 | 2009-01-04 | 振动片的制造方法和振子的制造方法 |
Country Status (3)
Country | Link |
---|---|
US (2) | US8191216B2 (zh) |
JP (1) | JP4533934B2 (zh) |
CN (3) | CN102006024B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105811915A (zh) * | 2015-01-19 | 2016-07-27 | 精工爱普生株式会社 | 振动元件、振子、振荡器、电子设备及移动体 |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7994877B1 (en) | 2008-11-10 | 2011-08-09 | Hrl Laboratories, Llc | MEMS-based quartz hybrid filters and a method of making the same |
US8766745B1 (en) | 2007-07-25 | 2014-07-01 | Hrl Laboratories, Llc | Quartz-based disk resonator gyro with ultra-thin conductive outer electrodes and method of making same |
US10266398B1 (en) | 2007-07-25 | 2019-04-23 | Hrl Laboratories, Llc | ALD metal coatings for high Q MEMS structures |
US7802356B1 (en) | 2008-02-21 | 2010-09-28 | Hrl Laboratories, Llc | Method of fabricating an ultra thin quartz resonator component |
JP5375503B2 (ja) * | 2009-10-07 | 2013-12-25 | セイコーエプソン株式会社 | 屈曲振動片 |
JP5786303B2 (ja) * | 2009-12-10 | 2015-09-30 | セイコーエプソン株式会社 | 振動片、振動子、物理量センサー、及び電子機器 |
JP5549340B2 (ja) * | 2010-04-13 | 2014-07-16 | セイコーエプソン株式会社 | 振動片、振動片の製造方法、振動デバイスおよび電子機器 |
JP5552878B2 (ja) * | 2010-04-14 | 2014-07-16 | セイコーエプソン株式会社 | 振動片、振動デバイスおよび電子機器 |
US8912711B1 (en) * | 2010-06-22 | 2014-12-16 | Hrl Laboratories, Llc | Thermal stress resistant resonator, and a method for fabricating same |
JP5533349B2 (ja) * | 2010-06-30 | 2014-06-25 | セイコーエプソン株式会社 | 屈曲振動片、屈曲振動子、発振器、および電子機器 |
JP5622173B2 (ja) * | 2010-07-29 | 2014-11-12 | セイコーエプソン株式会社 | 振動片、振動子、発振器、および電子機器 |
JP2012060355A (ja) * | 2010-09-08 | 2012-03-22 | Seiko Epson Corp | 振動片、振動子、振動デバイスおよび電子機器 |
JP5581931B2 (ja) * | 2010-09-17 | 2014-09-03 | セイコーエプソン株式会社 | 振動片、振動片の製造方法、振動子、振動デバイスおよび電子機器 |
JP5561377B2 (ja) * | 2010-12-16 | 2014-07-30 | 株式会社村田製作所 | 音片型圧電振動子及び音叉型圧電振動子 |
JP5685962B2 (ja) * | 2011-02-02 | 2015-03-18 | セイコーエプソン株式会社 | 振動片、振動子、発振器及び電子機器 |
US8581669B2 (en) | 2011-02-02 | 2013-11-12 | Seiko Epson Corporation | Vibrator element, vibrator, oscillator, and electronic apparatus |
SG11201508860QA (en) * | 2013-05-13 | 2015-11-27 | Murata Manufacturing Co | Vibrating device |
WO2014185281A1 (ja) | 2013-05-13 | 2014-11-20 | 株式会社村田製作所 | 振動装置 |
JP6482169B2 (ja) | 2013-07-19 | 2019-03-13 | セイコーエプソン株式会社 | 振動片、振動子、発振器、電子機器及び移動体 |
US9599470B1 (en) | 2013-09-11 | 2017-03-21 | Hrl Laboratories, Llc | Dielectric high Q MEMS shell gyroscope structure |
JP6442821B2 (ja) * | 2013-09-30 | 2018-12-26 | セイコーエプソン株式会社 | 超音波デバイス及び電子機器 |
JP6337443B2 (ja) * | 2013-10-30 | 2018-06-06 | セイコーエプソン株式会社 | 振動片、角速度センサー、電子機器及び移動体 |
US9977097B1 (en) | 2014-02-21 | 2018-05-22 | Hrl Laboratories, Llc | Micro-scale piezoelectric resonating magnetometer |
US9991863B1 (en) | 2014-04-08 | 2018-06-05 | Hrl Laboratories, Llc | Rounded and curved integrated tethers for quartz resonators |
US10308505B1 (en) | 2014-08-11 | 2019-06-04 | Hrl Laboratories, Llc | Method and apparatus for the monolithic encapsulation of a micro-scale inertial navigation sensor suite |
US10031191B1 (en) | 2015-01-16 | 2018-07-24 | Hrl Laboratories, Llc | Piezoelectric magnetometer capable of sensing a magnetic field in multiple vectors |
JP6468350B2 (ja) | 2015-04-27 | 2019-02-13 | 株式会社村田製作所 | 共振子及び共振装置 |
WO2016175161A1 (ja) | 2015-04-27 | 2016-11-03 | 株式会社村田製作所 | 共振子及び共振装置 |
CN107534432B (zh) * | 2015-04-28 | 2020-06-05 | 株式会社村田制作所 | 谐振子以及谐振装置 |
JP5996078B1 (ja) | 2015-10-19 | 2016-09-21 | 株式会社トライフォース・マネジメント | 発電素子 |
US10175307B1 (en) | 2016-01-15 | 2019-01-08 | Hrl Laboratories, Llc | FM demodulation system for quartz MEMS magnetometer |
KR20180037841A (ko) * | 2016-10-05 | 2018-04-13 | 삼성전자주식회사 | 공진기를 포함하는 필터 시스템 |
JP7139610B2 (ja) * | 2018-01-23 | 2022-09-21 | セイコーエプソン株式会社 | 振動素子、振動素子の製造方法、物理量センサー、慣性計測装置、電子機器および移動体 |
US10812046B2 (en) | 2018-02-07 | 2020-10-20 | Murata Manufacturing Co., Ltd. | Micromechanical resonator having reduced size |
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JP2003227719A (ja) * | 2001-11-27 | 2003-08-15 | Matsushita Electric Ind Co Ltd | 薄膜微小機械式共振子、薄膜微小機械式共振子ジャイロ、この薄膜微小機械式共振子ジャイロを用いたナビゲーションシステム及び自動車 |
CN1447454A (zh) * | 2002-03-25 | 2003-10-08 | 精工爱普生株式会社 | 音叉型压电振荡片及其制造方法,压电器件 |
JP2004079869A (ja) * | 2002-08-21 | 2004-03-11 | Matsushita Electric Ind Co Ltd | 共振デバイスの製造方法 |
JP2005233706A (ja) * | 2004-02-18 | 2005-09-02 | Matsushita Electric Ind Co Ltd | 角速度センサ |
CN1706098A (zh) * | 2003-03-28 | 2005-12-07 | 株式会社大真空 | 音叉型振子的频率调整方法和通过该方法调整频率的音叉型振子 |
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-
2008
- 2008-01-15 JP JP2008005768A patent/JP4533934B2/ja not_active Expired - Fee Related
-
2009
- 2009-01-04 CN CN201010597294.2A patent/CN102006024B/zh not_active Expired - Fee Related
- 2009-01-04 CN CN2010105972923A patent/CN102064790A/zh active Pending
- 2009-01-04 CN CN2009100013072A patent/CN101488731B/zh not_active Expired - Fee Related
- 2009-01-06 US US12/349,201 patent/US8191216B2/en not_active Expired - Fee Related
-
2012
- 2012-04-30 US US13/460,277 patent/US8415863B2/en active Active
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JP2003227719A (ja) * | 2001-11-27 | 2003-08-15 | Matsushita Electric Ind Co Ltd | 薄膜微小機械式共振子、薄膜微小機械式共振子ジャイロ、この薄膜微小機械式共振子ジャイロを用いたナビゲーションシステム及び自動車 |
CN1447454A (zh) * | 2002-03-25 | 2003-10-08 | 精工爱普生株式会社 | 音叉型压电振荡片及其制造方法,压电器件 |
JP2004079869A (ja) * | 2002-08-21 | 2004-03-11 | Matsushita Electric Ind Co Ltd | 共振デバイスの製造方法 |
CN1706098A (zh) * | 2003-03-28 | 2005-12-07 | 株式会社大真空 | 音叉型振子的频率调整方法和通过该方法调整频率的音叉型振子 |
JP2005233706A (ja) * | 2004-02-18 | 2005-09-02 | Matsushita Electric Ind Co Ltd | 角速度センサ |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105811915A (zh) * | 2015-01-19 | 2016-07-27 | 精工爱普生株式会社 | 振动元件、振子、振荡器、电子设备及移动体 |
CN105811915B (zh) * | 2015-01-19 | 2020-12-01 | 精工爱普生株式会社 | 振动元件、振子、振荡器、电子设备及移动体 |
Also Published As
Publication number | Publication date |
---|---|
CN102064790A (zh) | 2011-05-18 |
JP2009171118A (ja) | 2009-07-30 |
CN102006024B (zh) | 2014-08-06 |
US8415863B2 (en) | 2013-04-09 |
JP4533934B2 (ja) | 2010-09-01 |
CN101488731A (zh) | 2009-07-22 |
US20090178260A1 (en) | 2009-07-16 |
US20120212109A1 (en) | 2012-08-23 |
CN101488731B (zh) | 2011-10-05 |
US8191216B2 (en) | 2012-06-05 |
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