CN101996977A - 集成电路接触式测试装置及其制造方法 - Google Patents

集成电路接触式测试装置及其制造方法 Download PDF

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Publication number
CN101996977A
CN101996977A CN2009102235551A CN200910223555A CN101996977A CN 101996977 A CN101996977 A CN 101996977A CN 2009102235551 A CN2009102235551 A CN 2009102235551A CN 200910223555 A CN200910223555 A CN 200910223555A CN 101996977 A CN101996977 A CN 101996977A
Authority
CN
China
Prior art keywords
electrode
integrated circuit
electrode part
testing apparatus
spacing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2009102235551A
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English (en)
Chinese (zh)
Inventor
金宪敏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kodi S Co Ltd
Original Assignee
Kodi S Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kodi S Co Ltd filed Critical Kodi S Co Ltd
Publication of CN101996977A publication Critical patent/CN101996977A/zh
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2879—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to electrical aspects, e.g. to voltage or current supply or stimuli or to electrical loads
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)
  • Liquid Crystal (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Tests Of Electronic Circuits (AREA)
CN2009102235551A 2009-08-26 2009-11-24 集成电路接触式测试装置及其制造方法 Pending CN101996977A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20090079351 2009-08-26
KR10-2009-0079351 2009-08-26
KR10-2009-0089077 2009-09-21
KR20090089077 2009-09-21

Publications (1)

Publication Number Publication Date
CN101996977A true CN101996977A (zh) 2011-03-30

Family

ID=43786887

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009102235551A Pending CN101996977A (zh) 2009-08-26 2009-11-24 集成电路接触式测试装置及其制造方法

Country Status (4)

Country Link
JP (1) JP5119282B2 (ja)
KR (1) KR101265722B1 (ja)
CN (1) CN101996977A (ja)
TW (1) TW201107757A (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5597564B2 (ja) * 2011-02-04 2014-10-01 株式会社日本マイクロニクス プローブ装置及びその製造方法
CN102879618A (zh) * 2012-09-29 2013-01-16 郑礼朋 测试机构及其制作方法
KR101272493B1 (ko) 2012-11-08 2013-06-10 주식회사 프로이천 필름타입 프로브카드

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000332077A (ja) * 1999-05-17 2000-11-30 Sony Corp 半導体集積回路の配線欠陥検査方法および構造

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02264868A (ja) * 1989-04-04 1990-10-29 Tokyo Electron Ltd プローブ装置
JPH09281140A (ja) * 1996-04-15 1997-10-31 Casio Comput Co Ltd プローブ装置
ES2242451T3 (es) * 1998-10-10 2005-11-01 Un-Young Chung Conector de prueba.
JP2002350461A (ja) * 2001-05-29 2002-12-04 Hioki Ee Corp プローブ装置および回路基板検査装置
JP2003098189A (ja) * 2001-09-26 2003-04-03 Micronics Japan Co Ltd プローブシート及びプローブ装置
JP2003109705A (ja) * 2001-09-28 2003-04-11 Canon Inc 接触子の位置決め機構及び位置決め方法
JP2006284221A (ja) * 2005-03-31 2006-10-19 Yamaha Corp プローブユニット、その製造方法及び電子デバイスの検査方法
JP2009079911A (ja) * 2007-09-25 2009-04-16 Seiko Epson Corp 検査用治具とその製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000332077A (ja) * 1999-05-17 2000-11-30 Sony Corp 半導体集積回路の配線欠陥検査方法および構造

Also Published As

Publication number Publication date
JP5119282B2 (ja) 2013-01-16
JP2011047919A (ja) 2011-03-10
TW201107757A (en) 2011-03-01
KR101265722B1 (ko) 2013-05-21
KR20110021614A (ko) 2011-03-04

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PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20110330