CN101932194B - 轧制铜箔 - Google Patents
轧制铜箔 Download PDFInfo
- Publication number
- CN101932194B CN101932194B CN200910205402.4A CN200910205402A CN101932194B CN 101932194 B CN101932194 B CN 101932194B CN 200910205402 A CN200910205402 A CN 200910205402A CN 101932194 B CN101932194 B CN 101932194B
- Authority
- CN
- China
- Prior art keywords
- copper foil
- rolled copper
- rolled
- additive element
- fatigue life
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 262
- 239000011889 copper foil Substances 0.000 title claims abstract description 188
- 239000010949 copper Substances 0.000 claims abstract description 114
- 229910052802 copper Inorganic materials 0.000 claims abstract description 75
- 239000000654 additive Substances 0.000 claims abstract description 54
- 230000000996 additive effect Effects 0.000 claims abstract description 54
- 239000012535 impurity Substances 0.000 claims abstract description 19
- 150000001875 compounds Chemical class 0.000 claims abstract description 11
- 238000002441 X-ray diffraction Methods 0.000 claims description 34
- 238000000984 pole figure measurement Methods 0.000 claims description 23
- 229910052796 boron Inorganic materials 0.000 claims description 20
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical group [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 19
- 229910052709 silver Inorganic materials 0.000 claims description 17
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 15
- 239000004332 silver Substances 0.000 claims description 15
- 229910052760 oxygen Inorganic materials 0.000 claims description 13
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 12
- 238000005259 measurement Methods 0.000 claims description 12
- 239000001301 oxygen Substances 0.000 claims description 12
- 239000013078 crystal Substances 0.000 claims description 11
- 238000005452 bending Methods 0.000 abstract description 67
- 239000006104 solid solution Substances 0.000 abstract description 5
- 238000007669 thermal treatment Methods 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 62
- 238000000034 method Methods 0.000 description 48
- 230000008569 process Effects 0.000 description 31
- 239000000463 material Substances 0.000 description 29
- 238000000137 annealing Methods 0.000 description 26
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 23
- 238000010438 heat treatment Methods 0.000 description 22
- 238000005097 cold rolling Methods 0.000 description 20
- 238000010586 diagram Methods 0.000 description 19
- 238000004519 manufacturing process Methods 0.000 description 19
- 238000005096 rolling process Methods 0.000 description 18
- 238000001953 recrystallisation Methods 0.000 description 17
- 238000012360 testing method Methods 0.000 description 17
- 239000010936 titanium Substances 0.000 description 17
- 239000011572 manganese Substances 0.000 description 16
- 239000010955 niobium Substances 0.000 description 15
- 239000011575 calcium Substances 0.000 description 14
- 229910052748 manganese Inorganic materials 0.000 description 8
- 229910052759 nickel Inorganic materials 0.000 description 8
- 229910052758 niobium Inorganic materials 0.000 description 8
- 229910052717 sulfur Inorganic materials 0.000 description 8
- 229910052715 tantalum Inorganic materials 0.000 description 8
- 229910052719 titanium Inorganic materials 0.000 description 8
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 7
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 7
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 7
- 229910052791 calcium Inorganic materials 0.000 description 7
- 229910052735 hafnium Inorganic materials 0.000 description 7
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 7
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical group [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 7
- 229910052698 phosphorus Inorganic materials 0.000 description 7
- VSZWPYCFIRKVQL-UHFFFAOYSA-N selanylidenegallium;selenium Chemical compound [Se].[Se]=[Ga].[Se]=[Ga] VSZWPYCFIRKVQL-UHFFFAOYSA-N 0.000 description 7
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 7
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 238000000691 measurement method Methods 0.000 description 6
- 238000004381 surface treatment Methods 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 239000004033 plastic Substances 0.000 description 5
- 239000000956 alloy Substances 0.000 description 4
- 238000005098 hot rolling Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 238000001028 reflection method Methods 0.000 description 3
- JQMFQLVAJGZSQS-UHFFFAOYSA-N 2-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]-N-(2-oxo-3H-1,3-benzoxazol-6-yl)acetamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)CC(=O)NC1=CC2=C(NC(O2)=O)C=C1 JQMFQLVAJGZSQS-UHFFFAOYSA-N 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000005482 strain hardening Methods 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- 230000002195 synergetic effect Effects 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- DEXFNLNNUZKHNO-UHFFFAOYSA-N 6-[3-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperidin-1-yl]-3-oxopropyl]-3H-1,3-benzoxazol-2-one Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C1CCN(CC1)C(CCC1=CC2=C(NC(O2)=O)C=C1)=O DEXFNLNNUZKHNO-UHFFFAOYSA-N 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- JAWMENYCRQKKJY-UHFFFAOYSA-N [3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-ylmethyl)-1-oxa-2,8-diazaspiro[4.5]dec-2-en-8-yl]-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]methanone Chemical compound N1N=NC=2CN(CCC=21)CC1=NOC2(C1)CCN(CC2)C(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F JAWMENYCRQKKJY-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 description 1
- QUQFTIVBFKLPCL-UHFFFAOYSA-L copper;2-amino-3-[(2-amino-2-carboxylatoethyl)disulfanyl]propanoate Chemical compound [Cu+2].[O-]C(=O)C(N)CSSCC(N)C([O-])=O QUQFTIVBFKLPCL-UHFFFAOYSA-L 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910052762 osmium Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12431—Foil or filament smaller than 6 mils
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Metal Rolling (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009-147250 | 2009-06-22 | ||
| JP2009147250A JP4992940B2 (ja) | 2009-06-22 | 2009-06-22 | 圧延銅箔 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101932194A CN101932194A (zh) | 2010-12-29 |
| CN101932194B true CN101932194B (zh) | 2012-07-25 |
Family
ID=43354638
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910205402.4A Expired - Fee Related CN101932194B (zh) | 2009-06-22 | 2009-10-23 | 轧制铜箔 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20100323214A1 (enExample) |
| JP (1) | JP4992940B2 (enExample) |
| CN (1) | CN101932194B (enExample) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5411192B2 (ja) * | 2011-03-25 | 2014-02-12 | Ｊｘ日鉱日石金属株式会社 | 圧延銅箔及びその製造方法 |
| JP5865759B2 (ja) * | 2011-03-31 | 2016-02-17 | 新日鉄住金化学株式会社 | 銅箔、銅張積層板、可撓性回路基板、及び銅張積層板の製造方法 |
| WO2013069800A1 (ja) * | 2011-11-11 | 2013-05-16 | 古河電気工業株式会社 | 圧延銅箔 |
| JP5650098B2 (ja) * | 2011-11-22 | 2015-01-07 | Jx日鉱日石金属株式会社 | 超電導膜形成用圧延銅箔 |
| JP5650099B2 (ja) * | 2011-11-22 | 2015-01-07 | Jx日鉱日石金属株式会社 | 超電導膜形成用圧延銅箔 |
| CN103290345B (zh) * | 2012-02-28 | 2015-07-01 | Jx日矿日石金属株式会社 | 轧制铜箔 |
| JP5826160B2 (ja) * | 2012-04-10 | 2015-12-02 | Jx日鉱日石金属株式会社 | 圧延銅箔、銅張積層板、フレキシブルプリント配線板及びその製造方法 |
| JP5718426B2 (ja) * | 2012-10-31 | 2015-05-13 | 古河電気工業株式会社 | 銅箔、非水電解質二次電池用負極および非水電解質二次電池 |
| CN104801542A (zh) * | 2015-05-06 | 2015-07-29 | 无锡丰元新材料科技有限公司 | 用于高能绿色电池的高精压延铜箔 |
| JP7033905B2 (ja) * | 2017-02-07 | 2022-03-11 | Ｊｘ金属株式会社 | 表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
| CN110392485B (zh) * | 2019-06-18 | 2022-04-12 | 淮安维嘉益集成科技有限公司 | 一种lp316l sta高阶摄像头模组fpc基板加工方法 |
| JP7186141B2 (ja) * | 2019-07-10 | 2022-12-08 | Ｊｘ金属株式会社 | フレキシブルプリント基板用銅箔 |
| CN112064071B (zh) * | 2020-09-09 | 2021-08-03 | 松山湖材料实验室 | 耐弯折铜箔及其制备方法和fpc挠性电路板 |
| US20250300189A1 (en) * | 2024-03-19 | 2025-09-25 | Chang Chun Petrochemical Co., Ltd. | Copper foil, current collector and lithium ion secondary battery |
| EP4621086A1 (en) * | 2024-03-19 | 2025-09-24 | Chang Chun Petrochemical Co., Ltd. | Copper foil, current collector and lithium ion secondary battery |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1925065A (zh) * | 2005-09-02 | 2007-03-07 | 日立电线株式会社 | 电气元件用铜合金材料及其制造方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4908275A (en) * | 1987-03-04 | 1990-03-13 | Nippon Mining Co., Ltd. | Film carrier and method of manufacturing same |
| JP2001011550A (ja) * | 1999-06-30 | 2001-01-16 | Kobe Steel Ltd | 銅合金圧延箔 |
| JP2001152267A (ja) * | 1999-11-18 | 2001-06-05 | Kobe Steel Ltd | 銅合金圧延箔 |
| JP2001279351A (ja) * | 2000-03-28 | 2001-10-10 | Kobe Steel Ltd | 圧延銅合金箔及びその製造方法 |
| JP4743977B2 (ja) * | 2001-03-07 | 2011-08-10 | 株式会社神戸製鋼所 | 圧延銅合金箔及びその製造方法 |
| US7789977B2 (en) * | 2006-10-26 | 2010-09-07 | Hitachi Cable, Ltd. | Rolled copper foil and manufacturing method thereof |
-
2009
- 2009-06-22 JP JP2009147250A patent/JP4992940B2/ja not_active Expired - Fee Related
- 2009-10-13 US US12/588,361 patent/US20100323214A1/en not_active Abandoned
- 2009-10-23 CN CN200910205402.4A patent/CN101932194B/zh not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1925065A (zh) * | 2005-09-02 | 2007-03-07 | 日立电线株式会社 | 电气元件用铜合金材料及其制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20100323214A1 (en) | 2010-12-23 |
| JP4992940B2 (ja) | 2012-08-08 |
| CN101932194A (zh) | 2010-12-29 |
| JP2011001622A (ja) | 2011-01-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101932194B (zh) | 轧制铜箔 | |
| JP4466688B2 (ja) | 圧延銅箔 | |
| JP4285526B2 (ja) | 圧延銅箔およびその製造方法 | |
| TWI221161B (en) | Rolled copper foil for flexible printed circuit and method of manufacturing the same | |
| TWI491325B (zh) | A rolled copper foil, a copper clad laminate, a flexible printed wiring board, and a method of manufacturing the same | |
| JP5320638B2 (ja) | 圧延銅箔およびその製造方法 | |
| JP5752536B2 (ja) | 圧延銅箔 | |
| JP4215093B2 (ja) | 圧延銅箔およびその製造方法 | |
| JP5245813B2 (ja) | 圧延銅箔 | |
| JP4524471B2 (ja) | 銅合金箔およびその製造法 | |
| JP2000212660A (ja) | フレキシブルプリント回路基板用圧延銅箔およびその製造方法 | |
| JP2010150597A (ja) | 圧延銅箔 | |
| CN106011525A (zh) | 柔性印刷基板用铜合金箔、使用其而成的覆铜层叠体、柔性印刷基板和电子仪器 | |
| JP5390852B2 (ja) | 圧延銅箔 | |
| US20090173414A1 (en) | Rolled Copper Foil and Manufacturing Method of Rolled Copper Foil | |
| JP3709109B2 (ja) | 張出し加工性に優れたプリント回路基板用圧延銅箔およびその製造方法 | |
| US8293033B2 (en) | Rolled copper foil | |
| JP3986707B2 (ja) | フレキシブルプリント回路基板用圧延銅箔およびその製造方法 | |
| JP5562218B2 (ja) | 圧延銅箔 | |
| JP3830680B2 (ja) | フレキシブルプリント回路基板用圧延銅箔およびその製造方法 | |
| JP2008038170A (ja) | 圧延銅箔 | |
| JP5562217B2 (ja) | 圧延銅箔 | |
| JP2012001783A (ja) | 圧延銅箔 | |
| JP2012052238A (ja) | 圧延銅箔 | |
| JP2010121154A (ja) | 圧延銅箔の製造方法および圧延銅箔 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SH COPPER INDUSTRY CO., LTD. Free format text: FORMER OWNER: HITACHI CABLE CO., LTD. Effective date: 20130809 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20130809 Address after: Ibaraki Patentee after: Sh Copper Products Co Ltd Address before: Tokyo, Japan, Japan Patentee before: Hitachi Cable Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120725 Termination date: 20151023 |
|
| EXPY | Termination of patent right or utility model |