JP4992940B2 - 圧延銅箔 - Google Patents

圧延銅箔 Download PDF

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Publication number
JP4992940B2
JP4992940B2 JP2009147250A JP2009147250A JP4992940B2 JP 4992940 B2 JP4992940 B2 JP 4992940B2 JP 2009147250 A JP2009147250 A JP 2009147250A JP 2009147250 A JP2009147250 A JP 2009147250A JP 4992940 B2 JP4992940 B2 JP 4992940B2
Authority
JP
Japan
Prior art keywords
copper foil
rolled copper
rolled
additive element
ppm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2009147250A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011001622A5 (enExample
JP2011001622A (ja
Inventor
岳海 室賀
聡至 関
登 萩原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP2009147250A priority Critical patent/JP4992940B2/ja
Priority to US12/588,361 priority patent/US20100323214A1/en
Priority to CN200910205402.4A priority patent/CN101932194B/zh
Publication of JP2011001622A publication Critical patent/JP2011001622A/ja
Publication of JP2011001622A5 publication Critical patent/JP2011001622A5/ja
Application granted granted Critical
Publication of JP4992940B2 publication Critical patent/JP4992940B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12431—Foil or filament smaller than 6 mils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Metal Rolling (AREA)
JP2009147250A 2009-06-22 2009-06-22 圧延銅箔 Expired - Fee Related JP4992940B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009147250A JP4992940B2 (ja) 2009-06-22 2009-06-22 圧延銅箔
US12/588,361 US20100323214A1 (en) 2009-06-22 2009-10-13 Rolled copper foil
CN200910205402.4A CN101932194B (zh) 2009-06-22 2009-10-23 轧制铜箔

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009147250A JP4992940B2 (ja) 2009-06-22 2009-06-22 圧延銅箔

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011226604A Division JP2012052238A (ja) 2011-10-14 2011-10-14 圧延銅箔

Publications (3)

Publication Number Publication Date
JP2011001622A JP2011001622A (ja) 2011-01-06
JP2011001622A5 JP2011001622A5 (enExample) 2011-05-12
JP4992940B2 true JP4992940B2 (ja) 2012-08-08

Family

ID=43354638

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009147250A Expired - Fee Related JP4992940B2 (ja) 2009-06-22 2009-06-22 圧延銅箔

Country Status (3)

Country Link
US (1) US20100323214A1 (enExample)
JP (1) JP4992940B2 (enExample)
CN (1) CN101932194B (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5411192B2 (ja) * 2011-03-25 2014-02-12 Ｊｘ日鉱日石金属株式会社 圧延銅箔及びその製造方法
JP5865759B2 (ja) * 2011-03-31 2016-02-17 新日鉄住金化学株式会社 銅箔、銅張積層板、可撓性回路基板、及び銅張積層板の製造方法
WO2013069800A1 (ja) * 2011-11-11 2013-05-16 古河電気工業株式会社 圧延銅箔
JP5650098B2 (ja) * 2011-11-22 2015-01-07 Jx日鉱日石金属株式会社 超電導膜形成用圧延銅箔
JP5650099B2 (ja) * 2011-11-22 2015-01-07 Jx日鉱日石金属株式会社 超電導膜形成用圧延銅箔
CN103290345B (zh) * 2012-02-28 2015-07-01 Jx日矿日石金属株式会社 轧制铜箔
JP5826160B2 (ja) * 2012-04-10 2015-12-02 Jx日鉱日石金属株式会社 圧延銅箔、銅張積層板、フレキシブルプリント配線板及びその製造方法
JP5718426B2 (ja) * 2012-10-31 2015-05-13 古河電気工業株式会社 銅箔、非水電解質二次電池用負極および非水電解質二次電池
CN104801542A (zh) * 2015-05-06 2015-07-29 无锡丰元新材料科技有限公司 用于高能绿色电池的高精压延铜箔
JP7033905B2 (ja) * 2017-02-07 2022-03-11 Ｊｘ金属株式会社 表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
CN110392485B (zh) * 2019-06-18 2022-04-12 淮安维嘉益集成科技有限公司 一种lp316l sta高阶摄像头模组fpc基板加工方法
JP7186141B2 (ja) * 2019-07-10 2022-12-08 Ｊｘ金属株式会社 フレキシブルプリント基板用銅箔
CN112064071B (zh) * 2020-09-09 2021-08-03 松山湖材料实验室 耐弯折铜箔及其制备方法和fpc挠性电路板
US20250300189A1 (en) * 2024-03-19 2025-09-25 Chang Chun Petrochemical Co., Ltd. Copper foil, current collector and lithium ion secondary battery
EP4621086A1 (en) * 2024-03-19 2025-09-24 Chang Chun Petrochemical Co., Ltd. Copper foil, current collector and lithium ion secondary battery

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4908275A (en) * 1987-03-04 1990-03-13 Nippon Mining Co., Ltd. Film carrier and method of manufacturing same
JP2001011550A (ja) * 1999-06-30 2001-01-16 Kobe Steel Ltd 銅合金圧延箔
JP2001152267A (ja) * 1999-11-18 2001-06-05 Kobe Steel Ltd 銅合金圧延箔
JP2001279351A (ja) * 2000-03-28 2001-10-10 Kobe Steel Ltd 圧延銅合金箔及びその製造方法
JP4743977B2 (ja) * 2001-03-07 2011-08-10 株式会社神戸製鋼所 圧延銅合金箔及びその製造方法
JP4655834B2 (ja) * 2005-09-02 2011-03-23 日立電線株式会社 電気部品用銅合金材とその製造方法
US7789977B2 (en) * 2006-10-26 2010-09-07 Hitachi Cable, Ltd. Rolled copper foil and manufacturing method thereof

Also Published As

Publication number Publication date
US20100323214A1 (en) 2010-12-23
CN101932194B (zh) 2012-07-25
CN101932194A (zh) 2010-12-29
JP2011001622A (ja) 2011-01-06

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