CN101821819B - 透明导电膜及其制造方法 - Google Patents

透明导电膜及其制造方法 Download PDF

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Publication number
CN101821819B
CN101821819B CN2008801121097A CN200880112109A CN101821819B CN 101821819 B CN101821819 B CN 101821819B CN 2008801121097 A CN2008801121097 A CN 2008801121097A CN 200880112109 A CN200880112109 A CN 200880112109A CN 101821819 B CN101821819 B CN 101821819B
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CN
China
Prior art keywords
transparent conductive
conductive film
film
magnesium
carbon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2008801121097A
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English (en)
Chinese (zh)
Other versions
CN101821819A (zh
Inventor
久慈俊郎
千叶雅史
本城贵充
小户田小一郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kuji Toshiro
Original Assignee
AISEKKU NANO TYUBU CO Ltd
Tokai University Educational System
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AISEKKU NANO TYUBU CO Ltd, Tokai University Educational System filed Critical AISEKKU NANO TYUBU CO Ltd
Publication of CN101821819A publication Critical patent/CN101821819A/zh
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Publication of CN101821819B publication Critical patent/CN101821819B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0635—Carbides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/58—After-treatment
    • C23C14/5846—Reactive treatment

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Non-Insulated Conductors (AREA)
  • Laminated Bodies (AREA)
CN2008801121097A 2007-10-15 2008-10-10 透明导电膜及其制造方法 Expired - Fee Related CN101821819B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007-268343 2007-10-15
JP2007268343A JP5224438B2 (ja) 2007-10-15 2007-10-15 透明導電膜およびその製造方法
PCT/JP2008/068460 WO2009051075A1 (ja) 2007-10-15 2008-10-10 透明導電膜およびその製造方法

Publications (2)

Publication Number Publication Date
CN101821819A CN101821819A (zh) 2010-09-01
CN101821819B true CN101821819B (zh) 2012-07-25

Family

ID=40567342

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008801121097A Expired - Fee Related CN101821819B (zh) 2007-10-15 2008-10-10 透明导电膜及其制造方法

Country Status (8)

Country Link
US (1) US20100227176A1 (enExample)
EP (1) EP2228805A4 (enExample)
JP (1) JP5224438B2 (enExample)
KR (1) KR20100075622A (enExample)
CN (1) CN101821819B (enExample)
SG (1) SG185923A1 (enExample)
TW (1) TWI466136B (enExample)
WO (1) WO2009051075A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5881995B2 (ja) * 2011-08-26 2016-03-09 久慈　俊郎 透明導電膜及びその製造方法
CN108321239A (zh) * 2017-12-21 2018-07-24 君泰创新（北京）科技有限公司 一种太阳能异质结电池及其制备方法
JP2019173048A (ja) * 2018-03-26 2019-10-10 Ｊｘ金属株式会社 スパッタリングターゲット部材及びその製造方法
US11520451B2 (en) * 2018-07-30 2022-12-06 Asahi Kasei Kabushiki Kaisha Conductive film and conductive film roll, electronic paper, touch panel and flat-panel display comprising the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1957425A (zh) * 2004-05-21 2007-05-02 Tdk株式会社 透明导电材料、透明导电膏、透明导电膜和透明电极

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03183759A (ja) * 1989-12-12 1991-08-09 Toyobo Co Ltd 積層プラスチックフイルムおよびその製造方法
EP0924777A3 (en) * 1997-10-15 1999-07-07 Canon Kabushiki Kaisha A method for the formation of an indium oxide film by electro deposition process or electroless deposition process, a substrate provided with said indium oxide film for a semiconductor element, and a semiconductor element provided with said substrate
JP4429467B2 (ja) * 1999-04-08 2010-03-10 帝人株式会社 透明導電性フィルム
JP4092958B2 (ja) * 2002-06-11 2008-05-28 コニカミノルタホールディングス株式会社 Ｉｔｏ膜、ｉｔｏ膜材料及びｉｔｏ膜の形成方法
JP2004179139A (ja) * 2002-09-30 2004-06-24 Sumitomo Osaka Cement Co Ltd 導電性粒子とそれを含有する導電性接着材料及び透明導電膜形成用塗料及びそれを用いた透明導電膜並びに表示装置
DE602004010409T2 (de) * 2003-09-26 2008-10-16 Matsushita Electric Industrial Co., Ltd., Kadoma Plasmaanzeigetafel
JP4752507B2 (ja) 2003-12-24 2011-08-17 コニカミノルタホールディングス株式会社 透明プラスチックフィルム、および有機ｅｌ素子
US8728615B2 (en) * 2004-09-13 2014-05-20 Sumitomo Metal Mining Co., Ltd. Transparent conductive film and method of fabricating the same, transparent conductive base material, and light-emitting device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1957425A (zh) * 2004-05-21 2007-05-02 Tdk株式会社 透明导电材料、透明导电膏、透明导电膜和透明电极

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
JP平3-183759A 1991.08.09
JP特开2000-353426A 2000.12.19
JP特开2004-11014A 2004.01.15
JP特开2004-179139A 2004.06.24

Also Published As

Publication number Publication date
EP2228805A1 (en) 2010-09-15
TW200923974A (en) 2009-06-01
US20100227176A1 (en) 2010-09-09
KR20100075622A (ko) 2010-07-02
JP2009099327A (ja) 2009-05-07
EP2228805A4 (en) 2012-08-22
JP5224438B2 (ja) 2013-07-03
CN101821819A (zh) 2010-09-01
SG185923A1 (en) 2012-12-28
WO2009051075A1 (ja) 2009-04-23
TWI466136B (zh) 2014-12-21

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
ASS Succession or assignment of patent right

Free format text: FORMER OWNER: AISEKKU NANO TYUBU CO., LTD.

Effective date: 20120302

Owner name: KUJI TOSHIRO

Free format text: FORMER OWNER: THE TOKAI UNIV. JURIDICAL FOUNDATION

Effective date: 20120302

C41 Transfer of patent application or patent right or utility model
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Effective date of registration: 20120302

Address after: The tama area in Kanagawa County, Japan Kawasaki 5-11-9

Applicant after: Kuji Toshiro

Address before: Tokyo, Japan

Applicant before: Tokai University Educational System

Co-applicant before: Aisekku Nano Tyubu Co., Ltd.

C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20120725

Termination date: 20161010

CF01 Termination of patent right due to non-payment of annual fee