TWI466136B - 透明導電膜及其製造方法 - Google Patents

透明導電膜及其製造方法 Download PDF

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Publication number
TWI466136B
TWI466136B TW097139319A TW97139319A TWI466136B TW I466136 B TWI466136 B TW I466136B TW 097139319 A TW097139319 A TW 097139319A TW 97139319 A TW97139319 A TW 97139319A TW I466136 B TWI466136 B TW I466136B
Authority
TW
Taiwan
Prior art keywords
film
transparent conductive
conductive film
magnesium
carbon
Prior art date
Application number
TW097139319A
Other languages
English (en)
Chinese (zh)
Other versions
TW200923974A (en
Inventor
Toshiro Kuji
Masafumi Chiba
Takamitsu Honjo
Koichiro Kotoda
Original Assignee
Toshiro Kuji
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiro Kuji filed Critical Toshiro Kuji
Publication of TW200923974A publication Critical patent/TW200923974A/zh
Application granted granted Critical
Publication of TWI466136B publication Critical patent/TWI466136B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0635—Carbides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/58—After-treatment
    • C23C14/5846—Reactive treatment

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Non-Insulated Conductors (AREA)
  • Laminated Bodies (AREA)
TW097139319A 2007-10-15 2008-10-14 透明導電膜及其製造方法 TWI466136B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007268343A JP5224438B2 (ja) 2007-10-15 2007-10-15 透明導電膜およびその製造方法

Publications (2)

Publication Number Publication Date
TW200923974A TW200923974A (en) 2009-06-01
TWI466136B true TWI466136B (zh) 2014-12-21

Family

ID=40567342

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097139319A TWI466136B (zh) 2007-10-15 2008-10-14 透明導電膜及其製造方法

Country Status (8)

Country Link
US (1) US20100227176A1 (enExample)
EP (1) EP2228805A4 (enExample)
JP (1) JP5224438B2 (enExample)
KR (1) KR20100075622A (enExample)
CN (1) CN101821819B (enExample)
SG (1) SG185923A1 (enExample)
TW (1) TWI466136B (enExample)
WO (1) WO2009051075A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5881995B2 (ja) * 2011-08-26 2016-03-09 久慈　俊郎 透明導電膜及びその製造方法
CN108321239A (zh) * 2017-12-21 2018-07-24 君泰创新（北京）科技有限公司 一种太阳能异质结电池及其制备方法
JP2019173048A (ja) * 2018-03-26 2019-10-10 Ｊｘ金属株式会社 スパッタリングターゲット部材及びその製造方法
US11520451B2 (en) * 2018-07-30 2022-12-06 Asahi Kasei Kabushiki Kaisha Conductive film and conductive film roll, electronic paper, touch panel and flat-panel display comprising the same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1218844A (zh) * 1997-10-15 1999-06-09 佳能株式会社 氧化铟膜的形成方法,具有氧化铟膜的衬底及半导体元件
JP2000353426A (ja) * 1999-04-08 2000-12-19 Teijin Ltd 透明導電性フィルム
JP2004011014A (ja) * 2002-06-11 2004-01-15 Konica Minolta Holdings Inc 金属原子含有膜、金属原子含有膜材料及び金属原子含有膜の形成方法
TW200617998A (en) * 2004-09-13 2006-06-01 Sumitomo Metal Mining Co Transparentconductive film, process for producing the same, transparent conductive substrate and light-emitting device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03183759A (ja) * 1989-12-12 1991-08-09 Toyobo Co Ltd 積層プラスチックフイルムおよびその製造方法
JP2004179139A (ja) * 2002-09-30 2004-06-24 Sumitomo Osaka Cement Co Ltd 導電性粒子とそれを含有する導電性接着材料及び透明導電膜形成用塗料及びそれを用いた透明導電膜並びに表示装置
DE602004010409T2 (de) * 2003-09-26 2008-10-16 Matsushita Electric Industrial Co., Ltd., Kadoma Plasmaanzeigetafel
JP4752507B2 (ja) 2003-12-24 2011-08-17 コニカミノルタホールディングス株式会社 透明プラスチックフィルム、および有機ｅｌ素子
CN1957425A (zh) * 2004-05-21 2007-05-02 Tdk株式会社 透明导电材料、透明导电膏、透明导电膜和透明电极

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1218844A (zh) * 1997-10-15 1999-06-09 佳能株式会社 氧化铟膜的形成方法,具有氧化铟膜的衬底及半导体元件
JP2000353426A (ja) * 1999-04-08 2000-12-19 Teijin Ltd 透明導電性フィルム
JP2004011014A (ja) * 2002-06-11 2004-01-15 Konica Minolta Holdings Inc 金属原子含有膜、金属原子含有膜材料及び金属原子含有膜の形成方法
TW200617998A (en) * 2004-09-13 2006-06-01 Sumitomo Metal Mining Co Transparentconductive film, process for producing the same, transparent conductive substrate and light-emitting device

Also Published As

Publication number Publication date
EP2228805A1 (en) 2010-09-15
TW200923974A (en) 2009-06-01
CN101821819B (zh) 2012-07-25
US20100227176A1 (en) 2010-09-09
KR20100075622A (ko) 2010-07-02
JP2009099327A (ja) 2009-05-07
EP2228805A4 (en) 2012-08-22
JP5224438B2 (ja) 2013-07-03
CN101821819A (zh) 2010-09-01
SG185923A1 (en) 2012-12-28
WO2009051075A1 (ja) 2009-04-23

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