CN101816125B - 水晶装置及水晶装置的制造方法 - Google Patents

水晶装置及水晶装置的制造方法 Download PDF

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Publication number
CN101816125B
CN101816125B CN200880105296.6A CN200880105296A CN101816125B CN 101816125 B CN101816125 B CN 101816125B CN 200880105296 A CN200880105296 A CN 200880105296A CN 101816125 B CN101816125 B CN 101816125B
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CN
China
Prior art keywords
crystal
electrode
frame
connection electrode
outer frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CN200880105296.6A
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English (en)
Chinese (zh)
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CN101816125A (zh
Inventor
猪濑直人
竹内敏晃
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Dempa Kogyo Co Ltd
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Nihon Dempa Kogyo Co Ltd
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Publication of CN101816125A publication Critical patent/CN101816125A/zh
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Publication of CN101816125B publication Critical patent/CN101816125B/zh
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/21—Crystal tuning forks
    • H03H9/215—Crystal tuning forks consisting of quartz
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0595—Holders or supports the holder support and resonator being formed in one body
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1035—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by two sealing substrates sandwiching the piezoelectric layer of the BAW device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49005—Acoustic transducer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y10T29/4908—Acoustic transducer

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
CN200880105296.6A 2007-09-03 2008-07-03 水晶装置及水晶装置的制造方法 Expired - Fee Related CN101816125B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007227344A JP5085240B2 (ja) 2007-09-03 2007-09-03 水晶デバイス及び水晶デバイスの製造方法
JP2007-227344 2007-09-03
PCT/JP2008/001751 WO2009031258A1 (ja) 2007-09-03 2008-07-03 水晶デバイス及び水晶デバイスの製造方法

Publications (2)

Publication Number Publication Date
CN101816125A CN101816125A (zh) 2010-08-25
CN101816125B true CN101816125B (zh) 2013-05-22

Family

ID=40428583

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200880105296.6A Expired - Fee Related CN101816125B (zh) 2007-09-03 2008-07-03 水晶装置及水晶装置的制造方法

Country Status (5)

Country Link
US (1) US8261427B2 (enExample)
EP (1) EP2187519A4 (enExample)
JP (1) JP5085240B2 (enExample)
CN (1) CN101816125B (enExample)
WO (1) WO2009031258A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5085240B2 (ja) 2007-09-03 2012-11-28 日本電波工業株式会社 水晶デバイス及び水晶デバイスの製造方法
JP5113870B2 (ja) 2009-08-27 2013-01-09 日本電波工業株式会社 表面実装用水晶振動子の製造方法
US9511151B2 (en) 2010-11-12 2016-12-06 Uti Limited Partnership Compositions and methods for the prevention and treatment of cancer
EP2624450B1 (en) * 2011-02-25 2015-02-11 Daishinku Corporation Piezoelectric vibrating reed, piezoelectric vibrator, method for manufacturing piezoelectric vibrating reed, and method for manufacturing piezoelectric vibrator
JP2012195918A (ja) * 2011-03-18 2012-10-11 Nippon Dempa Kogyo Co Ltd 圧電デバイス
US10988516B2 (en) 2012-03-26 2021-04-27 Uti Limited Partnership Methods and compositions for treating inflammation
US9603948B2 (en) 2012-10-11 2017-03-28 Uti Limited Partnership Methods and compositions for treating multiple sclerosis and related disorders
SG10201912301XA (en) 2013-11-04 2020-02-27 Uti Lp Methods and compositions for sustained immunotherapy
US12011480B2 (en) 2015-05-06 2024-06-18 Uti Limited Partnership Nanoparticle compositions for sustained therapy
WO2017126185A1 (ja) * 2016-01-21 2017-07-27 株式会社村田製作所 水晶振動子及びその製造方法
KR101872599B1 (ko) * 2016-08-26 2018-06-28 삼성전기주식회사 탄성파 필터 장치
CN111741746A (zh) 2017-11-29 2020-10-02 乌第有限合伙公司 治疗自身免疫性疾病的方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2464595A1 (fr) * 1979-08-31 1981-03-06 Ebauches Sa Procede de detection d'asymetrie de resonateurs a cristal piezoelectrique en forme de diapason et resonateurs pour sa mise en oeuvre
JPH06350376A (ja) * 1993-01-25 1994-12-22 Matsushita Electric Ind Co Ltd 気密封止された圧電デバイスおよび気密封止パッケージ
JPH06343017A (ja) 1993-04-09 1994-12-13 Citizen Watch Co Ltd 圧電振動子およびその製造方法
JPH09326663A (ja) * 1996-06-07 1997-12-16 Matsushita Electric Ind Co Ltd 振動子とその製造方法
JPH1022773A (ja) * 1996-07-03 1998-01-23 Matsushita Electric Ind Co Ltd 振動子とその製造方法
JPH1032293A (ja) * 1996-07-17 1998-02-03 Matsushita Electric Ind Co Ltd 電子部品の製造方法
JPH1041771A (ja) * 1996-07-24 1998-02-13 Matsushita Electric Ind Co Ltd 振動子の製造方法とその製造装置
JP3702656B2 (ja) * 1998-07-01 2005-10-05 セイコーエプソン株式会社 圧電素子およびその製造方法
JP2001119264A (ja) 1999-10-15 2001-04-27 Nippon Dempa Kogyo Co Ltd 水晶振動子
JP2003017965A (ja) * 2001-07-04 2003-01-17 Nippon Dempa Kogyo Co Ltd 水晶振動子の製造方法
JP3646258B2 (ja) * 2001-10-31 2005-05-11 有限会社ピエデック技術研究所 水晶ユニットとその製造方法
US6915548B2 (en) * 2002-03-06 2005-07-12 Piedek Technical Laboratory Method for manufacturing quartz crystal tuning fork resonator, quartz crystal unit having quartz crystal tuning fork resonator, and quartz crystal oscillator having quartz crystal unit
JP2003318699A (ja) * 2002-04-23 2003-11-07 Piedekku Gijutsu Kenkyusho:Kk 水晶ユニットとその製造方法
JP3980943B2 (ja) * 2002-06-06 2007-09-26 日本電波工業株式会社 Ｐｌｌ制御発振器
JP2006311393A (ja) * 2005-04-28 2006-11-09 Seiko Epson Corp 水晶振動子の製造方法
JP4690146B2 (ja) * 2005-08-26 2011-06-01 セイコーインスツル株式会社 水晶振動子、発振器及び電子機器
JP5085240B2 (ja) 2007-09-03 2012-11-28 日本電波工業株式会社 水晶デバイス及び水晶デバイスの製造方法
JP4647671B2 (ja) * 2008-01-15 2011-03-09 日本電波工業株式会社 水晶デバイス及び水晶デバイスの製造方法

Also Published As

Publication number Publication date
US8261427B2 (en) 2012-09-11
US20100162545A1 (en) 2010-07-01
JP2009060479A (ja) 2009-03-19
EP2187519A1 (en) 2010-05-19
WO2009031258A1 (ja) 2009-03-12
JP5085240B2 (ja) 2012-11-28
EP2187519A4 (en) 2012-11-14
CN101816125A (zh) 2010-08-25

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