CN101790802B - Led壳体 - Google Patents

Led壳体 Download PDF

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Publication number
CN101790802B
CN101790802B CN2008801045110A CN200880104511A CN101790802B CN 101790802 B CN101790802 B CN 101790802B CN 2008801045110 A CN2008801045110 A CN 2008801045110A CN 200880104511 A CN200880104511 A CN 200880104511A CN 101790802 B CN101790802 B CN 101790802B
Authority
CN
China
Prior art keywords
housing
led
connection element
led housing
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2008801045110A
Other languages
English (en)
Chinese (zh)
Other versions
CN101790802A (zh
Inventor
S·科勒
S·格罗特希
H·布伦纳
R·休伯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of CN101790802A publication Critical patent/CN101790802A/zh
Application granted granted Critical
Publication of CN101790802B publication Critical patent/CN101790802B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/10—Sockets for co-operation with pins or blades
    • H01R13/11—Resilient sockets
    • H01R13/113—Resilient sockets co-operating with pins or blades having a rectangular transverse section
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
CN2008801045110A 2007-08-30 2008-08-06 Led壳体 Expired - Fee Related CN101790802B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102007041136.9 2007-08-30
DE102007041136A DE102007041136A1 (de) 2007-08-30 2007-08-30 LED-Gehäuse
PCT/DE2008/001293 WO2009026876A1 (de) 2007-08-30 2008-08-06 Led-gehäuse

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201210124304.XA Division CN102664219B (zh) 2007-08-30 2008-08-06 Led壳体

Publications (2)

Publication Number Publication Date
CN101790802A CN101790802A (zh) 2010-07-28
CN101790802B true CN101790802B (zh) 2012-06-20

Family

ID=40085583

Family Applications (2)

Application Number Title Priority Date Filing Date
CN2008801045110A Expired - Fee Related CN101790802B (zh) 2007-08-30 2008-08-06 Led壳体
CN201210124304.XA Expired - Fee Related CN102664219B (zh) 2007-08-30 2008-08-06 Led壳体

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201210124304.XA Expired - Fee Related CN102664219B (zh) 2007-08-30 2008-08-06 Led壳体

Country Status (8)

Country Link
US (1) US8487323B2 (enExample)
EP (1) EP2183794B1 (enExample)
JP (1) JP2010537437A (enExample)
KR (1) KR20100047339A (enExample)
CN (2) CN101790802B (enExample)
DE (1) DE102007041136A1 (enExample)
TW (1) TW200917533A (enExample)
WO (1) WO2009026876A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102937270A (zh) * 2012-11-23 2013-02-20 昆山博爱模具开发有限公司 一种led壳体

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US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
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US8748915B2 (en) * 2006-04-24 2014-06-10 Cree Hong Kong Limited Emitter package with angled or vertical LED
US8735920B2 (en) 2006-07-31 2014-05-27 Cree, Inc. Light emitting diode package with optical element
US9711703B2 (en) 2007-02-12 2017-07-18 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
CN101388161A (zh) * 2007-09-14 2009-03-18 科锐香港有限公司 Led表面安装装置和并入有此装置的led显示器
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
US8866169B2 (en) 2007-10-31 2014-10-21 Cree, Inc. LED package with increased feature sizes
US8791471B2 (en) * 2008-11-07 2014-07-29 Cree Hong Kong Limited Multi-chip light emitting diode modules
US20110037083A1 (en) * 2009-01-14 2011-02-17 Alex Chi Keung Chan Led package with contrasting face
US8368112B2 (en) 2009-01-14 2013-02-05 Cree Huizhou Opto Limited Aligned multiple emitter package
US7956546B2 (en) * 2009-05-15 2011-06-07 Bridgelux, Inc. Modular LED light bulb
WO2011124689A1 (de) * 2010-04-09 2011-10-13 Ledon Oled Lighting Gmbh & Co. Kg Leuchtmodul und leuchte
KR101543333B1 (ko) * 2010-04-23 2015-08-11 삼성전자주식회사 발광소자 패키지용 리드 프레임, 발광소자 패키지, 및 발광소자 패키지를 채용한 조명장치
DE102010038251A1 (de) 2010-10-18 2012-04-19 Koninklijke Philips Electronics N.V. OLED-Leuchtmittel für eine Leuchte
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JP5841802B2 (ja) * 2011-10-24 2016-01-13 パナソニックＩｐマネジメント株式会社 照明器具
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KR101933189B1 (ko) 2012-01-31 2019-04-05 서울반도체 주식회사 발광다이오드 패키지
CN103236483A (zh) * 2013-03-15 2013-08-07 达亮电子（苏州）有限公司 发光二极管封装结构及封装方法
TWI598665B (zh) * 2013-03-15 2017-09-11 隆達電子股份有限公司 發光元件、長條狀發光元件及其應用
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CH709337B1 (fr) * 2014-03-04 2016-12-30 Robert Alderton Unité d'éclairage LED et procédé de fabrication d'une telle unité.
JP6190746B2 (ja) * 2014-03-25 2017-08-30 エムテックスマツムラ株式会社 半導体素子実装用中空パッケージ
US9601670B2 (en) 2014-07-11 2017-03-21 Cree, Inc. Method to form primary optic with variable shapes and/or geometries without a substrate
KR102233038B1 (ko) * 2014-07-30 2021-03-30 엘지이노텍 주식회사 광원 모듈
US10622522B2 (en) 2014-09-05 2020-04-14 Theodore Lowes LED packages with chips having insulated surfaces
JP6484588B2 (ja) 2016-05-19 2019-03-13 日亜化学工業株式会社 発光装置及び発光装置用パッケージ
JP6880725B2 (ja) * 2016-12-27 2021-06-02 日亜化学工業株式会社 発光装置
RU172080U1 (ru) * 2017-01-09 2017-06-28 федеральное государственное бюджетное образовательное учреждение высшего образования "Новгородский государственный университет имени Ярослава Мудрого" Корпус светодиода для поверхностного монтажа
CN108879242B (zh) * 2017-05-12 2022-03-29 中兴通讯股份有限公司 传输线及其发光线缆
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102937270A (zh) * 2012-11-23 2013-02-20 昆山博爱模具开发有限公司 一种led壳体
CN102937270B (zh) * 2012-11-23 2015-01-21 昆山博爱模具开发有限公司 一种led壳体

Also Published As

Publication number Publication date
US8487323B2 (en) 2013-07-16
EP2183794A1 (de) 2010-05-12
US20110186880A1 (en) 2011-08-04
CN102664219B (zh) 2016-07-06
DE102007041136A1 (de) 2009-03-05
JP2010537437A (ja) 2010-12-02
CN102664219A (zh) 2012-09-12
KR20100047339A (ko) 2010-05-07
TW200917533A (en) 2009-04-16
CN101790802A (zh) 2010-07-28
WO2009026876A1 (de) 2009-03-05
EP2183794B1 (de) 2017-04-05

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Granted publication date: 20120620

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