JP2010537437A - Ledケーシング - Google Patents
Ledケーシング Download PDFInfo
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- JP2010537437A JP2010537437A JP2010522178A JP2010522178A JP2010537437A JP 2010537437 A JP2010537437 A JP 2010537437A JP 2010522178 A JP2010522178 A JP 2010522178A JP 2010522178 A JP2010522178 A JP 2010522178A JP 2010537437 A JP2010537437 A JP 2010537437A
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- 230000017525 heat dissipation Effects 0.000 claims description 9
- 230000008878 coupling Effects 0.000 claims description 4
- 238000010168 coupling process Methods 0.000 claims description 4
- 238000005859 coupling reaction Methods 0.000 claims description 4
- 238000011161 development Methods 0.000 description 18
- 230000018109 developmental process Effects 0.000 description 18
- 239000000758 substrate Substances 0.000 description 11
- 238000010586 diagram Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- 230000003287 optical effect Effects 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 238000005286 illumination Methods 0.000 description 4
- 239000003086 colorant Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000012778 molding material Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000004020 luminiscence type Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 238000013021 overheating Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000012966 insertion method Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 239000002470 thermal conductor Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
- F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/10—Sockets for co-operation with pins or blades
- H01R13/11—Resilient sockets
- H01R13/113—Resilient sockets co-operating with pins or blades having a rectangular transverse section
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
Description
Claims (12)
- ケーシング中空部(2)と、支持エレメント(3)と、少なくとも1つのLEDチップ(4)と、少なくとも1つの保持エレメント(5)と、少なくとも1つのケーシング接続エレメント(6)とを有するLEDケーシング(1)において;
・前記支持エレメント(3)および前記少なくとも1つのLEDチップ(4)は、前記LEDケーシング(1)のケーシング中空部(2)の内部に配置されており、
・前記LEDチップ(4)は、前記支持エレメント(3)の第1表面に配置されており、前記LEDケーシング(1)は以下のように構成されている、すなわち:
・前記少なくとも1つのケーシング接続エレメント(6)が、前記LEDケーシング(1)の外側面に配置されており、前記少なくとも1つのLEDチップ(4)を動作するために該LEDチップ(4)との電気接続(8)を有しており、かつ
・前記LEDケーシング(1)が機械的に制限されて解除可能に、同一構造の第2のLEDケーシング(1)と接続可能である、
ように構成されている、
ことを特徴とするLEDケーシング(1)。 - 前記LEDケーシング(1)は、前記少なくとも1つの保持エレメント(5)によって、機械的に制限されて解除可能に、支持体と接続可能である、
ことを特徴とする請求項1記載のLEDケーシング(1)。 - 前記LEDケーシング(1)は、前記少なくとも1つの保持エレメント(5)によって、機械的に制限されて解除可能に、同一構造の第2のLEDケーシング(1)と電気的および/または機械的に接続可能である、
ことを特徴とする請求項1または2記載のLEDケーシング(1)。 - 前記LEDケーシング(1)は、前記支持エレメント(3)の前記第1表面とは反対の少なくとも1つの第2の側の上に熱放散エレメント(7)を有する、
ことを特徴とする請求項1〜3のいずれか一項記載のLEDケーシング(1)。 - 前記少なくとも1つの保持エレメント(5)は、複数の部分から形成されており、
該保持エレメント(5)の少なくとも1つの部分は、前記ケーシング接続エレメント(6)を含む、
ことを特徴とする請求項1〜4のいずれか一項記載のLEDケーシング(1)。 - 前記ケーシング接続エレメント(6)は、少なくとも1つのアノード接続エレメント(6a)およびカソード接続エレメント(6b)を有し、
前記アノード接続エレメント(6a)と前記カソード接続エレメント(6b)は、機械的および/または電気的な差込システムを形成している、
ことを特徴とする請求項1〜5のいずれか一項記載のLEDケーシング(1)。 - 前記LEDケーシング(1)は、SMTによって取り付け可能であり、
前記ケーシング接続エレメント(6)は、差込接続および/または係止接続によって駆動制御可能である、
ことを特徴とする請求項1〜6のいずれか一項記載のLEDケーシング(1)。 - 前記LEDケーシング(1)は、制御接続エレメント(10)を有し、
該制御接続エレメント(10)は、前記ケーシング中空部(2)内の少なくとも1つの制御エレメントとの電気接続(11)を有し、
各制御エレメントは、LEDチップ(4)から放出される電磁ビームの強度を制御する、
ことを特徴とする請求項1〜7のいずれか一項記載のLEDケーシング(1)。 - 前記LEDケーシング(1)は、差込接続、圧接接続、および/またはケージクランプによる前記ケーシング接続エレメントによって電気的にコンタクト可能である、
ことを特徴とする請求項1〜8のいずれか一項記載のLEDケーシング(1)。 - 前記LEDケーシング(1)の保持エレメントの複数の部分は、ねじ接続、差込接続、および係止接続によって、同一構造のLEDケーシング(2)と機械的に接続可能にする、
ことを特徴とする請求項1〜9のいずれか一項記載のLEDケーシング(1)。 - ・前記保持エレメント(5)は、ねじ式保持体として構成されており、かつ、前記保持エレメント(5)に係合するねじとして構成された少なくとも1つの結合エレメント(14)によって支持体と機械的に接続可能であり、
・前記LEDチップ(4)は、前記ケーシング接続エレメント(6)によって電気的にコンタクト可能となり、
前記ケーシング接続エレメントは、前記LEDケーシング(1)の側面に配置されている、
ことを特徴とする請求項2記載のLEDケーシング(1)。 - 請求項1〜11のいずれか一項記載のLEDケーシング(1)を複数有するLEDチェーンにおいて、
・前記LEDケーシング(1)の、LEDチップ(4)とは反対の裏側面が支持体の上に固定されており、
・少なくとも2つのLEDケーシングは、それぞれ1つのケーシング接続エレメント(6)によって互いに導電接続されており、
少なくとも1つのケーシング接続エレメント(6)は、それぞれのLEDケーシング(1)の側面に配置されている、
ことを特徴とするLEDチェーン。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102007041136A DE102007041136A1 (de) | 2007-08-30 | 2007-08-30 | LED-Gehäuse |
PCT/DE2008/001293 WO2009026876A1 (de) | 2007-08-30 | 2008-08-06 | Led-gehäuse |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010537437A true JP2010537437A (ja) | 2010-12-02 |
JP2010537437A5 JP2010537437A5 (ja) | 2011-06-30 |
Family
ID=40085583
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010522178A Pending JP2010537437A (ja) | 2007-08-30 | 2008-08-06 | Ledケーシング |
Country Status (8)
Country | Link |
---|---|
US (1) | US8487323B2 (ja) |
EP (1) | EP2183794B1 (ja) |
JP (1) | JP2010537437A (ja) |
KR (1) | KR20100047339A (ja) |
CN (2) | CN101790802B (ja) |
DE (1) | DE102007041136A1 (ja) |
TW (1) | TW200917533A (ja) |
WO (1) | WO2009026876A1 (ja) |
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JP2015185763A (ja) * | 2014-03-25 | 2015-10-22 | エムテックスマツムラ株式会社 | 半導体素子実装用中空パッケージ |
JP2017208484A (ja) * | 2016-05-19 | 2017-11-24 | 日亜化学工業株式会社 | 発光装置及び発光装置用パッケージ |
JP2021536663A (ja) * | 2018-08-21 | 2021-12-27 | ロベルト・ボッシュ・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツングRobert Bosch Gmbh | 制御装置の回路基板の外部との電気的な接触接続に適した制御装置用ハウジングフレーム |
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JP2013093104A (ja) * | 2011-10-24 | 2013-05-16 | Panasonic Corp | 照明装置および照明器具 |
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JP2021536663A (ja) * | 2018-08-21 | 2021-12-27 | ロベルト・ボッシュ・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツングRobert Bosch Gmbh | 制御装置の回路基板の外部との電気的な接触接続に適した制御装置用ハウジングフレーム |
Also Published As
Publication number | Publication date |
---|---|
CN101790802A (zh) | 2010-07-28 |
CN101790802B (zh) | 2012-06-20 |
EP2183794A1 (de) | 2010-05-12 |
EP2183794B1 (de) | 2017-04-05 |
CN102664219A (zh) | 2012-09-12 |
KR20100047339A (ko) | 2010-05-07 |
TW200917533A (en) | 2009-04-16 |
DE102007041136A1 (de) | 2009-03-05 |
US20110186880A1 (en) | 2011-08-04 |
US8487323B2 (en) | 2013-07-16 |
WO2009026876A1 (de) | 2009-03-05 |
CN102664219B (zh) | 2016-07-06 |
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