CN101689513B - 多功能芯片贴膜以及使用此贴膜的半导体封装方法 - Google Patents

多功能芯片贴膜以及使用此贴膜的半导体封装方法 Download PDF

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Publication number
CN101689513B
CN101689513B CN200780052483.8A CN200780052483A CN101689513B CN 101689513 B CN101689513 B CN 101689513B CN 200780052483 A CN200780052483 A CN 200780052483A CN 101689513 B CN101689513 B CN 101689513B
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China
Prior art keywords
die attach
attach film
chip
film
wafer
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Expired - Fee Related
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CN200780052483.8A
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English (en)
Chinese (zh)
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CN101689513A (zh
Inventor
姜炳彦
徐凖模
成忠铉
金载勋
玄淳莹
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Hi Tech Corp
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LG Innotek Co Ltd
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Priority claimed from KR1020070013935A external-priority patent/KR20080074602A/ko
Priority claimed from KR1020070013933A external-priority patent/KR20080074601A/ko
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Publication of CN101689513A publication Critical patent/CN101689513A/zh
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  • Engineering & Computer Science (AREA)
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  • Microelectronics & Electronic Packaging (AREA)
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  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Adhesive Tapes (AREA)
  • Wire Bonding (AREA)
CN200780052483.8A 2007-02-09 2007-08-03 多功能芯片贴膜以及使用此贴膜的半导体封装方法 Expired - Fee Related CN101689513B (zh)

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CN102122624B (zh) * 2011-02-01 2013-02-13 南通富士通微电子股份有限公司 晶圆封装方法
TW201341199A (zh) * 2011-12-12 2013-10-16 日東電工股份有限公司 積層片材以及使用積層片材之半導體裝置之製造方法
CN103998238B (zh) * 2012-01-06 2016-08-24 Lg化学株式会社 封装薄膜
US9741682B2 (en) * 2015-12-18 2017-08-22 International Business Machines Corporation Structures to enable a full intermetallic interconnect
US10629539B2 (en) * 2017-11-07 2020-04-21 Taiwan Semiconductor Manufacturing Co., Ltd. Package structure and method of fabricating the same
CN109037036A (zh) * 2018-08-02 2018-12-18 德淮半导体有限公司 晶圆边缘修剪方法
CN110223942A (zh) * 2019-06-06 2019-09-10 长江存储科技有限责任公司 晶圆贴膜方法及晶圆贴膜装置
CN110957269A (zh) * 2019-11-08 2020-04-03 广东佛智芯微电子技术研究有限公司 一种改善埋入式扇出型封装结构电镀性能的制作方法
CN113161242B (zh) * 2021-02-23 2022-03-25 青岛歌尔微电子研究院有限公司 芯片封装工艺
KR102729808B1 (ko) * 2021-05-28 2024-11-14 (주)이녹스첨단소재 웨이퍼 가공용 점착 필름

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