JP2010528450A - 多機能ダイ接着フィルム及びこれを用いた半導体素子パッケージング方法 - Google Patents

多機能ダイ接着フィルム及びこれを用いた半導体素子パッケージング方法 Download PDF

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JP2010528450A
JP2010528450A JP2009548981A JP2009548981A JP2010528450A JP 2010528450 A JP2010528450 A JP 2010528450A JP 2009548981 A JP2009548981 A JP 2009548981A JP 2009548981 A JP2009548981 A JP 2009548981A JP 2010528450 A JP2010528450 A JP 2010528450A
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Prior art keywords
die
adhesive film
film
chip
wafer
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JP2009548981A
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Japanese (ja)
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JP2010528450A5 (enExample
Inventor
カン ビョン−ウン
ソ ジュン−モ
スン チュン−ヒョン
キム ジェ−フーン
ヒョン スーン−ヤン
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LG Innotek Co Ltd
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LG Innotek Co Ltd
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Priority claimed from KR1020070013935A external-priority patent/KR20080074602A/ko
Priority claimed from KR1020070013933A external-priority patent/KR20080074601A/ko
Application filed by LG Innotek Co Ltd filed Critical LG Innotek Co Ltd
Publication of JP2010528450A publication Critical patent/JP2010528450A/ja
Publication of JP2010528450A5 publication Critical patent/JP2010528450A5/ja
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Adhesive Tapes (AREA)
  • Wire Bonding (AREA)
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TW201341199A (zh) * 2011-12-12 2013-10-16 日東電工股份有限公司 積層片材以及使用積層片材之半導體裝置之製造方法
US9741682B2 (en) * 2015-12-18 2017-08-22 International Business Machines Corporation Structures to enable a full intermetallic interconnect
US10629539B2 (en) * 2017-11-07 2020-04-21 Taiwan Semiconductor Manufacturing Co., Ltd. Package structure and method of fabricating the same
CN109037036A (zh) * 2018-08-02 2018-12-18 德淮半导体有限公司 晶圆边缘修剪方法
CN110223942A (zh) * 2019-06-06 2019-09-10 长江存储科技有限责任公司 晶圆贴膜方法及晶圆贴膜装置
CN110957269A (zh) * 2019-11-08 2020-04-03 广东佛智芯微电子技术研究有限公司 一种改善埋入式扇出型封装结构电镀性能的制作方法
CN113161242B (zh) * 2021-02-23 2022-03-25 青岛歌尔微电子研究院有限公司 芯片封装工艺
KR102729808B1 (ko) * 2021-05-28 2024-11-14 (주)이녹스첨단소재 웨이퍼 가공용 점착 필름

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