CN101687718A - 具有金属化表面的陶瓷体的结构部件 - Google Patents

具有金属化表面的陶瓷体的结构部件 Download PDF

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Publication number
CN101687718A
CN101687718A CN200880021678A CN200880021678A CN101687718A CN 101687718 A CN101687718 A CN 101687718A CN 200880021678 A CN200880021678 A CN 200880021678A CN 200880021678 A CN200880021678 A CN 200880021678A CN 101687718 A CN101687718 A CN 101687718A
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perhaps
metallization
weight
ceramic body
structure unit
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CN200880021678A
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Chinese (zh)
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C·P·克卢格
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Ceramtec GmbH
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Ceramtec GmbH
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    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
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    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
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    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/021—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles in a direct manner, e.g. direct copper bonding [DCB]
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    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
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    • H05K1/00—Printed circuits
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
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    • H10W40/00—Arrangements for thermal protection or thermal control
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    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
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    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
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    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
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    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
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    • C04B2237/32—Ceramic
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    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Ceramic Products (AREA)
CN200880021678A 2007-04-24 2008-04-17 具有金属化表面的陶瓷体的结构部件 Pending CN101687718A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102007019633.6 2007-04-24
DE102007019633 2007-04-24
PCT/EP2008/054626 WO2008128945A1 (de) 2007-04-24 2008-04-17 Bauteil mit einem keramischen körper mit metallisierter oberfläche

Publications (1)

Publication Number Publication Date
CN101687718A true CN101687718A (zh) 2010-03-31

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Application Number Title Priority Date Filing Date
CN200880021678A Pending CN101687718A (zh) 2007-04-24 2008-04-17 具有金属化表面的陶瓷体的结构部件

Country Status (7)

Country Link
US (1) US8980398B2 (https=)
EP (1) EP2142489A1 (https=)
JP (1) JP5649958B2 (https=)
KR (1) KR101519925B1 (https=)
CN (1) CN101687718A (https=)
DE (1) DE102008001221A1 (https=)
WO (1) WO2008128945A1 (https=)

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CN110563484A (zh) * 2019-08-26 2019-12-13 泰州市光明电子材料有限公司 一种陶瓷表面金属化工艺

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TWI525287B (zh) * 2009-10-27 2016-03-11 製陶技術股份有限公司 由具有ｌｅｄ的可變規模的陶瓷二極體載體構成的陣列
CN103547850A (zh) * 2011-03-29 2014-01-29 陶瓷技术有限责任公司 具有陶瓷冷却器和led的浇注灯体
DE102018221160A1 (de) * 2018-12-06 2020-06-10 Siemens Aktiengesellschaft Isolierkeramik für elektrische Schaltungen und zugehörige Anwendungen
SE543338C2 (en) * 2019-04-04 2020-12-08 Swep Int Ab Stencil device and method for stencil printing of brazing material onto a heat exchanger plate and use thereof
DE102019124593A1 (de) * 2019-09-12 2021-03-18 Tdk Electronics Ag Kühlsystem
TWI760242B (zh) * 2021-05-31 2022-04-01 微智冷科技股份有限公司 複合結構與封裝架構

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TWI449137B (zh) * 2006-03-23 2014-08-11 製陶技術創新製陶工程股份公司 構件或電路用的攜帶體
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CN110563484A (zh) * 2019-08-26 2019-12-13 泰州市光明电子材料有限公司 一种陶瓷表面金属化工艺

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EP2142489A1 (de) 2010-01-13
US8980398B2 (en) 2015-03-17
US20100089625A1 (en) 2010-04-15
KR101519925B1 (ko) 2015-05-14
KR20100017331A (ko) 2010-02-16

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