KR101519925B1 - 금속화된 표면을 갖는 세라믹 베이스를 구비한 컴포넌트 - Google Patents

금속화된 표면을 갖는 세라믹 베이스를 구비한 컴포넌트 Download PDF

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KR101519925B1
KR101519925B1 KR1020097024487A KR20097024487A KR101519925B1 KR 101519925 B1 KR101519925 B1 KR 101519925B1 KR 1020097024487 A KR1020097024487 A KR 1020097024487A KR 20097024487 A KR20097024487 A KR 20097024487A KR 101519925 B1 KR101519925 B1 KR 101519925B1
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ceramic body
component
metallized
metallized coating
ceramic
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Korean (ko)
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KR20100017331A (ko
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클라우스 페터 클루게
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세람테크 게엠베하
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    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
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    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C—CHEMISTRY; METALLURGY
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    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/021—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles in a direct manner, e.g. direct copper bonding [DCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
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    • H05K1/00—Printed circuits
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    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
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    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
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    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
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    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
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    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
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    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
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    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
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    • H05K1/18—Printed circuits structurally associated with non-printed electric components
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    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
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    • Y10T428/31504—Composite [nonstructural laminate]
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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Ceramic Products (AREA)
KR1020097024487A 2007-04-24 2008-04-17 금속화된 표면을 갖는 세라믹 베이스를 구비한 컴포넌트 Expired - Fee Related KR101519925B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102007019633.6 2007-04-24
DE102007019633 2007-04-24
PCT/EP2008/054626 WO2008128945A1 (de) 2007-04-24 2008-04-17 Bauteil mit einem keramischen körper mit metallisierter oberfläche

Publications (2)

Publication Number Publication Date
KR20100017331A KR20100017331A (ko) 2010-02-16
KR101519925B1 true KR101519925B1 (ko) 2015-05-14

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KR1020097024487A Expired - Fee Related KR101519925B1 (ko) 2007-04-24 2008-04-17 금속화된 표면을 갖는 세라믹 베이스를 구비한 컴포넌트

Country Status (7)

Country Link
US (1) US8980398B2 (https=)
EP (1) EP2142489A1 (https=)
JP (1) JP5649958B2 (https=)
KR (1) KR101519925B1 (https=)
CN (1) CN101687718A (https=)
DE (1) DE102008001221A1 (https=)
WO (1) WO2008128945A1 (https=)

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US6833413B2 (en) 2000-05-09 2004-12-21 Asahi Kasei Kabushiki Kaisha Block copolymer and composition containing the copolymer
DE102008063325A1 (de) * 2008-12-30 2010-07-01 Osram Opto Semiconductors Gmbh Verfahren zur Fertigung von Leuchtmitteln
DE102009025033A1 (de) 2009-06-10 2010-12-16 Behr Gmbh & Co. Kg Thermoelektrische Vorrichtung und Verfahren zum Herstellen einer thermoelektrischen Vorrichtung
TWI525287B (zh) * 2009-10-27 2016-03-11 製陶技術股份有限公司 由具有ｌｅｄ的可變規模的陶瓷二極體載體構成的陣列
CN103547850A (zh) * 2011-03-29 2014-01-29 陶瓷技术有限责任公司 具有陶瓷冷却器和led的浇注灯体
DE102018221160A1 (de) * 2018-12-06 2020-06-10 Siemens Aktiengesellschaft Isolierkeramik für elektrische Schaltungen und zugehörige Anwendungen
SE543338C2 (en) * 2019-04-04 2020-12-08 Swep Int Ab Stencil device and method for stencil printing of brazing material onto a heat exchanger plate and use thereof
CN110563484A (zh) * 2019-08-26 2019-12-13 泰州市光明电子材料有限公司 一种陶瓷表面金属化工艺
DE102019124593A1 (de) * 2019-09-12 2021-03-18 Tdk Electronics Ag Kühlsystem
TWI760242B (zh) * 2021-05-31 2022-04-01 微智冷科技股份有限公司 複合結構與封裝架構

Citations (1)

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Publication number Priority date Publication date Assignee Title
WO2006005280A1 (de) 2004-07-08 2006-01-19 Curamik Electronics Gmbh Metall-keramic-substrat

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JPS62113783A (ja) * 1985-11-13 1987-05-25 日本セメント株式会社 窒化けい素焼結体のメタライズ方法
JPS6370545A (ja) * 1986-09-12 1988-03-30 Hitachi Ltd 半導体パツケ−ジ
DE3777522D1 (de) * 1986-10-17 1992-04-23 Hitachi Ltd Verfahren zum herstellen einer gemischten struktur fuer halbleiteranordnung.
JPS63131194U (https=) * 1987-02-19 1988-08-26
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EP2142489A1 (de) 2010-01-13
US8980398B2 (en) 2015-03-17
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