JP2010524830A5 - - Google Patents
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- Publication number
- JP2010524830A5 JP2010524830A5 JP2010504631A JP2010504631A JP2010524830A5 JP 2010524830 A5 JP2010524830 A5 JP 2010524830A5 JP 2010504631 A JP2010504631 A JP 2010504631A JP 2010504631 A JP2010504631 A JP 2010504631A JP 2010524830 A5 JP2010524830 A5 JP 2010524830A5
- Authority
- JP
- Japan
- Prior art keywords
- component
- mass
- ceramic body
- metallization
- components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 claims description 15
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 2
- 238000001465 metallisation Methods 0.000 claims 12
- 229910052751 metal Inorganic materials 0.000 claims 6
- 239000002184 metal Substances 0.000 claims 6
- 238000000034 method Methods 0.000 claims 5
- 229910052802 copper Inorganic materials 0.000 claims 3
- 239000010949 copper Substances 0.000 claims 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 2
- 239000000654 additive Substances 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- 239000000203 mixture Substances 0.000 claims 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 229910000831 Steel Inorganic materials 0.000 claims 1
- 230000000996 additive effect Effects 0.000 claims 1
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 238000005452 bending Methods 0.000 claims 1
- 238000005219 brazing Methods 0.000 claims 1
- 229910010293 ceramic material Inorganic materials 0.000 claims 1
- 238000005234 chemical deposition Methods 0.000 claims 1
- 238000006243 chemical reaction Methods 0.000 claims 1
- 238000005229 chemical vapour deposition Methods 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- 238000004070 electrodeposition Methods 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 239000012535 impurity Substances 0.000 claims 1
- 229910052745 lead Inorganic materials 0.000 claims 1
- 150000002739 metals Chemical class 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 230000003647 oxidation Effects 0.000 claims 1
- 238000007254 oxidation reaction Methods 0.000 claims 1
- 229910052763 palladium Inorganic materials 0.000 claims 1
- 229910052697 platinum Inorganic materials 0.000 claims 1
- 238000007650 screen-printing Methods 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 239000010959 steel Substances 0.000 claims 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 1
- 229910052721 tungsten Inorganic materials 0.000 claims 1
- 239000010937 tungsten Substances 0.000 claims 1
- 229910052727 yttrium Inorganic materials 0.000 claims 1
- 229910052725 zinc Inorganic materials 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102007019633.6 | 2007-04-24 | ||
| DE102007019633 | 2007-04-24 | ||
| PCT/EP2008/054626 WO2008128945A1 (de) | 2007-04-24 | 2008-04-17 | Bauteil mit einem keramischen körper mit metallisierter oberfläche |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010524830A JP2010524830A (ja) | 2010-07-22 |
| JP2010524830A5 true JP2010524830A5 (https=) | 2013-01-31 |
| JP5649958B2 JP5649958B2 (ja) | 2015-01-07 |
Family
ID=39590169
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010504631A Expired - Fee Related JP5649958B2 (ja) | 2007-04-24 | 2008-04-17 | メタライズされた表面を備えるセラミックボディを有するコンポーネント |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8980398B2 (https=) |
| EP (1) | EP2142489A1 (https=) |
| JP (1) | JP5649958B2 (https=) |
| KR (1) | KR101519925B1 (https=) |
| CN (1) | CN101687718A (https=) |
| DE (1) | DE102008001221A1 (https=) |
| WO (1) | WO2008128945A1 (https=) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6833413B2 (en) | 2000-05-09 | 2004-12-21 | Asahi Kasei Kabushiki Kaisha | Block copolymer and composition containing the copolymer |
| DE102008063325A1 (de) * | 2008-12-30 | 2010-07-01 | Osram Opto Semiconductors Gmbh | Verfahren zur Fertigung von Leuchtmitteln |
| DE102009025033A1 (de) | 2009-06-10 | 2010-12-16 | Behr Gmbh & Co. Kg | Thermoelektrische Vorrichtung und Verfahren zum Herstellen einer thermoelektrischen Vorrichtung |
| TWI525287B (zh) * | 2009-10-27 | 2016-03-11 | 製陶技術股份有限公司 | 由具有ｌｅｄ的可變規模的陶瓷二極體載體構成的陣列 |
| CN103547850A (zh) * | 2011-03-29 | 2014-01-29 | 陶瓷技术有限责任公司 | 具有陶瓷冷却器和led的浇注灯体 |
| DE102018221160A1 (de) * | 2018-12-06 | 2020-06-10 | Siemens Aktiengesellschaft | Isolierkeramik für elektrische Schaltungen und zugehörige Anwendungen |
| SE543338C2 (en) * | 2019-04-04 | 2020-12-08 | Swep Int Ab | Stencil device and method for stencil printing of brazing material onto a heat exchanger plate and use thereof |
| CN110563484A (zh) * | 2019-08-26 | 2019-12-13 | 泰州市光明电子材料有限公司 | 一种陶瓷表面金属化工艺 |
| DE102019124593A1 (de) * | 2019-09-12 | 2021-03-18 | Tdk Electronics Ag | Kühlsystem |
| TWI760242B (zh) * | 2021-05-31 | 2022-04-01 | 微智冷科技股份有限公司 | 複合結構與封裝架構 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2326534A (en) * | 1940-12-28 | 1943-08-10 | Murray Corp | Bath tub |
| JPS61248302A (ja) * | 1985-04-25 | 1986-11-05 | 株式会社日立製作所 | 炭化ケイ素焼結体用メタライズペ−スト |
| JPS62113783A (ja) * | 1985-11-13 | 1987-05-25 | 日本セメント株式会社 | 窒化けい素焼結体のメタライズ方法 |
| JPS6370545A (ja) * | 1986-09-12 | 1988-03-30 | Hitachi Ltd | 半導体パツケ−ジ |
| DE3777522D1 (de) * | 1986-10-17 | 1992-04-23 | Hitachi Ltd | Verfahren zum herstellen einer gemischten struktur fuer halbleiteranordnung. |
| JPS63131194U (https=) * | 1987-02-19 | 1988-08-26 | ||
| DE3709200A1 (de) * | 1987-03-20 | 1988-09-29 | Heraeus Gmbh W C | Elektronisches bauteil |
| JPH01111360A (ja) * | 1987-10-26 | 1989-04-28 | Fujitsu Ltd | 半導体装置 |
| JP2662738B2 (ja) * | 1988-11-11 | 1997-10-15 | 株式会社トーキン | セラミックス放熱フィン付半導体装置 |
| JPH0336754A (ja) * | 1989-07-03 | 1991-02-18 | Mitsubishi Electric Corp | Ｉｃパツケージ及びその製造方法 |
| JPH0382060A (ja) * | 1989-08-24 | 1991-04-08 | Nec Corp | 半導体装置 |
| JPH0437662A (ja) * | 1990-06-01 | 1992-02-07 | Murata Mfg Co Ltd | セラミック基板と金属板の接合構造 |
| EP0544329A3 (en) * | 1991-11-28 | 1993-09-01 | Kabushiki Kaisha Toshiba | Semiconductor package |
| JP3208438B2 (ja) * | 1992-01-16 | 2001-09-10 | イビデン株式会社 | 金属層を備えたセラミックス基板とその製造方法 |
| JPH10284808A (ja) * | 1997-04-08 | 1998-10-23 | Denki Kagaku Kogyo Kk | 回路基板 |
| JP3339572B2 (ja) * | 1999-10-04 | 2002-10-28 | 日本電気株式会社 | 半導体装置及びその製造方法 |
| DE102004012231B4 (de) | 2004-03-09 | 2006-03-23 | Curamik Electronics Gmbh | Metall-Keramik-Substrat |
| CN1707886A (zh) * | 2004-06-11 | 2005-12-14 | 中国科学院半导体研究所 | 一种氮化铝交叠式单片集成微通道热沉 |
| DE102004033227A1 (de) * | 2004-07-08 | 2006-01-26 | Curamik Electronics Gmbh | Metall-Keramik-Substrat |
| TWI449137B (zh) * | 2006-03-23 | 2014-08-11 | 製陶技術創新製陶工程股份公司 | 構件或電路用的攜帶體 |
| US20070236883A1 (en) * | 2006-04-05 | 2007-10-11 | Javier Ruiz | Electronics assembly having heat sink substrate disposed in cooling vessel |
-
2008
- 2008-04-17 WO PCT/EP2008/054626 patent/WO2008128945A1/de not_active Ceased
- 2008-04-17 EP EP08736299A patent/EP2142489A1/de not_active Ceased
- 2008-04-17 US US12/596,864 patent/US8980398B2/en not_active Expired - Fee Related
- 2008-04-17 KR KR1020097024487A patent/KR101519925B1/ko not_active Expired - Fee Related
- 2008-04-17 CN CN200880021678A patent/CN101687718A/zh active Pending
- 2008-04-17 DE DE102008001221A patent/DE102008001221A1/de not_active Withdrawn
- 2008-04-17 JP JP2010504631A patent/JP5649958B2/ja not_active Expired - Fee Related
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