CN101681964B - 用于制造光电子器件的方法以及光电子器件 - Google Patents

用于制造光电子器件的方法以及光电子器件 Download PDF

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CN101681964B
CN101681964B CN2008800180191A CN200880018019A CN101681964B CN 101681964 B CN101681964 B CN 101681964B CN 2008800180191 A CN2008800180191 A CN 2008800180191A CN 200880018019 A CN200880018019 A CN 200880018019A CN 101681964 B CN101681964 B CN 101681964B
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semiconductor body
semiconductor
component carrier
component
device supporting
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CN101681964A (zh
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赫尔穆特·菲舍尔
迪特尔·艾斯勒
亚历山大·海因德尔
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Ams Osram International GmbH
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Osram Opto Semiconductors GmbH
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  • Engineering & Computer Science (AREA)
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CN2008800180191A 2007-06-29 2008-05-07 用于制造光电子器件的方法以及光电子器件 Expired - Fee Related CN101681964B (zh)

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GB2464102A (en) * 2008-10-01 2010-04-07 Optovate Ltd Illumination apparatus comprising multiple monolithic subarrays
JP5590837B2 (ja) * 2009-09-15 2014-09-17 キヤノン株式会社 機能性領域の移設方法
JP5534763B2 (ja) * 2009-09-25 2014-07-02 株式会社東芝 半導体発光装置の製造方法及び半導体発光装置
DE102009048401A1 (de) 2009-10-06 2011-04-07 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen eines optoelektronischen Halbleiterbauteils und optoelektronisches Halbleiterbauteil
KR101601622B1 (ko) 2009-10-13 2016-03-09 삼성전자주식회사 발광다이오드 소자, 발광 장치 및 발광다이오드 소자의 제조방법
DE102010009015A1 (de) 2010-02-24 2011-08-25 OSRAM Opto Semiconductors GmbH, 93055 Verfahren zum Herstellen einer Mehrzahl von optoelektronischen Halbleiterchips
GB2484713A (en) 2010-10-21 2012-04-25 Optovate Ltd Illumination apparatus
US8227271B1 (en) * 2011-01-27 2012-07-24 Himax Technologies Limited Packaging method of wafer level chips
US8241932B1 (en) * 2011-03-17 2012-08-14 Tsmc Solid State Lighting Ltd. Methods of fabricating light emitting diode packages
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