CN101604671B - 半导体装置及其制造方法 - Google Patents

半导体装置及其制造方法 Download PDF

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Publication number
CN101604671B
CN101604671B CN200910146496.2A CN200910146496A CN101604671B CN 101604671 B CN101604671 B CN 101604671B CN 200910146496 A CN200910146496 A CN 200910146496A CN 101604671 B CN101604671 B CN 101604671B
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wiring board
pad
pads
lnd3
land
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CN101604671A (zh
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团野忠敏
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NEC Electronics Corp
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Renesas Electronics Corp
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Address after: Tokyo, Japan

Patentee after: Renesas Electronics Corporation

Address before: Kanagawa

Patentee before: Renesas Electronics Corporation