CN101582395A - 布线基板 - Google Patents

布线基板 Download PDF

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Publication number
CN101582395A
CN101582395A CNA2009101371949A CN200910137194A CN101582395A CN 101582395 A CN101582395 A CN 101582395A CN A2009101371949 A CNA2009101371949 A CN A2009101371949A CN 200910137194 A CN200910137194 A CN 200910137194A CN 101582395 A CN101582395 A CN 101582395A
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China
Prior art keywords
circuit board
peristome
chip
bight
resin
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Granted
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CNA2009101371949A
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CN101582395B (zh
Inventor
小泽隆史
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Shinko Electric Industries Co Ltd
Shinko Electric Co Ltd
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Shinko Electric Co Ltd
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Publication of CN101582395A publication Critical patent/CN101582395A/zh
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    • H—ELECTRICITY
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    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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Abstract

本发明涉及一种布线基板。当在安装有半导体芯片等被安装体的状态下向其间隙中填充树脂时，不会在该树脂内产生空洞，且提高树脂在被安装体角部的蔓延性，从而有助于可靠地形成树脂圆角。向与所安装的芯片(20)之间填充树脂(30)的布线基板10具有：基板主体，在该基板主体上形成有用于与芯片(20)的电极端子连接的导体部；以及绝缘性保护膜(14)，其形成在该基板主体上，并形成有使所述导体部露出的开口部(18)。开口部(18)形成为：除了特定的角部(P4)以外，其边缘部(EP)沿着芯片(20)的外形位于其外侧，并且在特定的角部(P4)中，边缘部(EP)位于芯片(20)外形的边上或其内侧。

Description

布线基板
技术领域
本发明涉及安装半导体芯片和半导体装置等被安装体所使用的布线基板，尤其涉及在通过倒装芯片接合来安装半导体芯片等时在与该芯片等之间填充树脂的结构的布线基板。
另外，在以下描述中，“布线基板”实现安装半导体芯片的作用，因此为了便于说明，还将“布线基板”称作“半导体封装”或简单称作“封装”。
背景技术
近年来，半导体装置已经被组装到各种电子设备中，随着电子设备的小型化及高性能化，组装到电子设备中的半导体装置已经开始向小型化、高密度化以及多管脚化(多端子化)发展，存在要求该半导体装置达到的可靠性越来越高的趋势。半导体装置通常具有将半导体芯片安装在布线基板(封装)上的结构，因此随着所安装的半导体芯片的小型化和高密度化，作为安装方法大多采用倒装芯片安装。
倒装芯片安装是这样的方法：在半导体芯片上形成突起状的电极端子(Bump：凸点)，使用焊锡等导电材料将芯片的电极端子与形成在封装的芯片安装面侧的导体部(从保护膜露出的布线层的一部分、即焊盘部)接合。进而，为了使该接合部位与外部绝缘并提高接合强度，在封装与芯片之间的间隙中填充被称为底部填充料(underfill)的树脂(环氧系的热硬化树脂等)，然后使其硬化凝固。
这样，在倒装芯片安装中需要将芯片的电极端子与布线基板的布线层(焊盘部)电连接，因此在覆盖布线基板表面而形成的保护膜(典型的是阻焊剂)上，形成用于使焊盘部露出的开口部。形成在布线基板上的焊盘部的配置根据所要安装的芯片的电极端子的排列来决定，因此还决定了与该焊盘部对应而需要的开口部的形状。例如，在所要安装的芯片的电极端子被配置为环绕状(沿着芯片外周的环状的方式)的情况下，与其对应着形成在布线基板上的各焊盘部也排列成环状，因此为了露出这些焊盘部，至少需要开口部形成为环状。
这样，需要在阻焊剂层上预先形成所需要的开口部，不过当该开口部的边缘部位于布线基板上的芯片安装区域的内侧时，存在以下的问题。即，在这种形式中，阻焊剂层与开口部相比离芯片的距离更近，因此在向芯片与布线基板之间填充底部填充树脂时，由于毛细管现象，使阻焊剂层与开口部相比，其底部填充树脂的浸润更快，结果存在这样的问题：底部填充树脂首先从开口部的外周开始填充，之后在填充到开口部内侧的树脂内形成有空洞(气泡)。当形成空洞时，无法得到充分的接合强度，因此芯片与封装之间的连接可靠性下降。此外，空洞内的空气由于树脂填充后的加热处理而发生膨胀，从而有可能在底部填充树脂中产生裂缝，或者根据情况在芯片的电极端子与布线层之间发生断线。
因此，作为用于防止产生这种空洞的方法，考虑以开口部的边缘部位于芯片安装区域的外侧的方式在阻焊剂层上形成开口部(即，形成比芯片尺寸更大的开口部)。图6示出了其一例。
在图6中，(a)是表示在将半导体芯片安装到以往的倒装芯片安装用布线基板上的状态下向其间隙中填充树脂时的状态的俯视图，(b)表示沿该俯视图中的C-C’线观察时的剖面结构。在图中，40表示布线基板，在该布线基板40中，41表示构成布线基板主体的树脂基板，42表示形成在树脂基板41最表层上的布线层，44表示露出布线层42的一部分上限定的焊盘部42P而形成在树脂基板41上的作为保护膜的阻焊剂层，46表示覆盖在焊盘部42P上的芯片安装用的焊锡。此外，50表示安装在布线基板40上的半导体芯片，在该芯片50中，51表示覆盖在芯片50的电路形成面侧上的保护膜，52表示以从保护膜51露出的方式形成的电极焊盘，53表示与电极焊盘52接合的突起状的电极端子(凸点)。
芯片50的电极端子(凸点)53经由覆盖在布线基板40上的焊盘部42P上的焊锡46与布线基板40接合，由此来将芯片50倒装安装在布线基板40上。而且，在该倒装安装后的芯片50与布线基板40之间填充有底部填充树脂60。
在保护布线基板40的表面的阻焊剂层44上，形成有为了露出设置在芯片安装面侧的布线层42的焊盘部42P而需要的开口部48。该开口部48形成为：该开口部48的边缘部沿着芯片50的外形(矩形)而位于其外侧(即，形成比芯片尺寸更大的开口)，而且在该开口部48的四个角(角部R1、R2、R3、R4)处开口成局部较宽。拓宽各角部R1～R4的开口部分的原因是为了提高底部填充树脂60的注入性。
底层树脂60的填充(注入)例如通过以下方式进行，即：使装有液态环氧系树脂的分注机(dispenser)的喷嘴沿着芯片50与布线基板40间隙处的开口部48的边进行移动。例如，在从开口部48的某个角部开始填充(注入)树脂，如图中箭头所示，使喷嘴沿着开口部48的边一直移动到相邻的角部，由此来向开口部48填充树脂。图示的例子表示如下情况：从开口部48的两个边(与角部R1与R2之间对应的部分的边、和与角部R2与R3之间对应的部分的边)开始注入底部填充树脂60。或者，也可以从开口部48的某个边的中间部分开始填充(注入)树脂，并使喷嘴与上述同样地沿着该边进行移动，由此来填充(注入)树脂。这样，为了便于在以下叙述中进行说明，还将开口部48的用于注入底部填充树脂60的边称为“树脂注入边”。
如图6所例示，开口部48形成得比芯片尺寸大，因此能够使底部填充树脂60快速浸透至芯片50与布线基板40之间的间隙中。即，在从开口部48的某个树脂注入边开始填充底部填充树脂60时，能够利用毛细管现象将该底部填充树脂60填充到开口部48的内部侧，并且能够从树脂注入边相反侧(树脂60流动的下游侧)的开口部分和角部抽出空气，因此能够使底部填充树脂60快速浸透至芯片50与布线基板40之间的间隙中。通过该作用，能够防止在填充到开口部48中的树脂60内产生空洞。
作为与该现有技术相关联的技术，例如具有如专利文献1所记载的用于安装IC芯片的倒装芯片安装用印刷布线基板，该布线基板具有基板主体和形成在该基板主体上的绝缘保护膜，在基板主体上形成有与IC芯片的电极连接的基板导体，绝缘保护膜在IC芯片的安装位置具有开口部，该布线基板在安装有IC芯片的状态下，在与基板主体之间填充有树脂，其中，将IC芯片的外形各边与绝缘保护膜的开口缘部之间的距离设定为预定的间隔，并且将该开口部的角部(所有四个角)开口成局部较宽。
【专利文献1】特开2005-175113号公报
如上所述，在以往的半导体封装(图6(a))中，在保护封装的阻焊剂层上形成有比芯片尺寸更大的开口部，因此在芯片安装后向与该芯片之间填充底部填充树脂时，不会在该填充的树脂内产生空洞。虽然这种开口部的形状有利于防止空洞，但另一方面，如图6(b)的剖面图(开口部48的角部R4的附近部分的剖视图)示意性所示，存在没有充分形成底部填充树脂60的圆角(fillet)(用虚线DF围起的部分)的问题。
即，如图6(a)所示，在底部填充树脂60的注入边(开口部48的与带箭头的部分对应的边)相反侧(树脂60流动的下游侧)，也以相同的形状进行开口，因此如图所示，在该相反侧的边、尤其角部R4处，发生底部填充树脂60蔓延不充分的概率较高。当底部填充树脂60蔓延不充分时，树脂60无法充分填充至该角部R4的开口部分，从而如图6(b)所示，形成了未被树脂60覆盖的部分(树脂基板41露出的部分)。在图示的例子中，该露出的部分是相当于树脂基板41的绝缘层的区域，因此虽然作为封装在工作上没有特别的问题，但从外观上看不美观。即，由于缺欠底部填充树脂60的圆角而产生不精美的外观。
此外，虽未特别图示，但由于封装种类不同，还有在已开口成局部较宽的角部铺设配线等类型的封装。在这种封装中，当如图6所例示在该角部发生了树脂的填充不足时，该配线等露出，因此在绝缘性方面存在问题。
这样的问题不限于BGA(球栅阵列)、LGA(平面栅格阵列)和PGA(引脚格栅阵列)等代表性的半导体封装，在其他形式的封装中，例如构成为在封装上层叠有其他封装的倒装芯片安装型的封装(还称为“层叠封装”)，也同样会发生这样的问题。即，在该结构中，在下侧封装(布线基板)上倒装安装半导体芯片，在该下侧封装上形成至芯片周边区域的导体部(焊盘部)经由焊锡等与形成在上侧封装的安装面侧的凸点接合后，向两个封装之间填充底部填充树脂，这种情况下也会发生上述问题。
发明内容
本发明正是鉴于该现有技术的课题而作出的，其目的在于提供一种布线基板，该布线基板在安装有半导体芯片等被安装体的状态下向其间隙中填充树脂时，不会在该树脂内产生空洞，且提高树脂在被安装体角部的蔓延性，从而有助于可靠地形成树脂的圆角。
为了解决上述现有技术的课题，根据本发明，提供一种布线基板，其在安装了俯视观察为多边形状、且在安装面侧具有凸点状电极端子的被安装体时，在与该被安装体之间填充树脂，其特征在于，该布线基板具有：布线基板主体，其形成有与所述被安装体的电极端子连接的导体部；以及绝缘性的保护膜，其形成在所述布线基板主体上，在与所述被安装体的外形对应的安装区域中具有形成为至少使所述导体部露出的开口部，所述开口部形成为：除了至少一处角部以外，所述开口部的边缘部沿着所述被安装体的安装区域位于该安装区域的外侧，并且，在所述至少一处角部中，所述开口部的边缘部位于该被安装体的安装区域的边上或其内侧。
根据本发明的布线基板的结构，在从开口部的、位于上述至少一处角部(特定的角部)相反侧的边(树脂注入边)开始填充(注入)树脂时，能够利用毛细管现象将该注入的树脂填充到开口部的内部侧，并且能够从与树脂注入边相反侧(树脂流动的下游侧)的开口部分抽出空气，因此，即使树脂首先从保护膜(例如阻焊剂层)浸入，也不会在填充的树脂内形成空洞(气泡)，从而能够将树脂填充到被安装体(例如芯片)与布线基板的间隙中。
此外，在上述特定的角部处形成了其开口部分，使开口部的边缘部位于该被安装体的安装区域的边上或其内侧，因此，该特定的角部不存在如其他角部那样的相对较大的开口部分。此外，该特定的角部位于上述树脂注入边相反侧(树脂流动的下游侧)。即，位于树脂注入边相反侧的特定角部的开口部分形成得相对较小，因此在该特定角部的开口部分也能够充分填充树脂。由此，能够提高被安装体的角部(与开口部的特定角部对应的部位)中的树脂的蔓延性，从而有助于在该部分可靠地形成树脂圆角。
参照以下叙述的发明的实施方式，来说明本发明的布线基板的其他结构上的特征以及基于这些特征的有利的优点等。
附图说明
图1是表示本发明一实施方式的倒装芯片安装用的布线基板(封装)的结构的俯视图。
图2是表示在将半导体芯片安装到图1的布线基板上的状态下、向其间隙中填充树脂时的状态的俯视图。
图3表示图2结构中的阻焊剂层的开口部附近的纵剖面结构，(a)表示沿A-A’线观察时的剖面结构(开口部的沿芯片边的部分的附近部分)，(b)表示沿B-B’线观察时的剖面结构(开口部的角部的附近部分)。
图4是表示本发明另一实施方式的倒装芯片安装用布线基板的结构的俯视图。
图5表示本发明又一实施方式的倒装芯片安装用布线基板的结构，(a)表示按照与图1的布线基板对应的布局形成开口部的情况，(b)表示按照与图4的布线基板对应的布局形成开口部的情况。
图6表示以往的倒装芯片安装用布线基板(封装)的结构，(a)是表示在将半导体芯片安装到该布线基板上的状态下向其间隙中填充树脂时的状态的俯视图，(b)是表示沿C-C’线观察时的剖面结构(开口部的角部的附近部分)的图。
标号说明
10、10a、10b、10c...布线基板(封装)
11...树脂基板(布线基板主体)
12、13...布线层
12P、13P...焊盘部(导体部)
14、15、...阻焊剂层(保护层/绝缘层)
18、18a、18b、18c...开口部
20...半导体芯片(被安装体)
23...凸点(电极端子)
30...底部填充树脂
MA...芯片的安装区域
EP、EP1、EP2、EP3...(开口部的)边缘部
P1～P8、Q1～Q8...(开口部的)角部
具体实施方式
下面参照附图对本发明的优选实施方式进行说明。
图1以俯视图的方式来表示本发明一实施方式的倒装芯片安装用布线基板(封装)的结构。另外，图2以俯视图的方式来表示在将半导体芯片安装到该布线基板上的状态下向其间隙中填充树脂时的状态，图3表示该结构中的阻焊剂层的开口部附近的纵剖面结构。在图3中，(a)表示沿图2的A-A’线观察时的剖面结构(开口部的沿芯片边的部分的附近部分)，(b)表示沿图2的B-B’线观察时的剖面结构(开口部的角部的附近部分)。
首先参照图3，本实施方式的布线基板(封装)10基本上具有：构成布线基板主体的树脂基板11；在该树脂基板11的两面上分别构图形成了预定形状的布线层12和13；以及绝缘性的保护膜(阻焊剂层)14和15，其以覆盖两面且露出焊盘部12P、13P的方式形成，所述焊盘部12P、13P限定在各布线层12、13各自的预定位置上。布线层12、13的材料典型地是采用铜(Cu)，阻焊剂层14、15的材料采用环氧系绝缘树脂。
在安装IC或LSI等半导体芯片20的一侧(芯片安装面侧)的阻焊剂层14上，形成有为了露出设置在芯片安装面侧的布线层12的焊盘部12P所需的开口部18。后面对该开口部18进行详细说明。
构成封装10的布线基板主体的树脂基板11只要采用以下形态即可：在至少于最表层形成有布线层12、13的基板上，各布线层12、13通过基板内部进行电连接。在树脂基板11的内部可以形成布线层，也可以不形成布线层。由于这不是本发明的特征部分，因此省略了详细的图示。在树脂基板11的内部形成有布线层的形态下，最表层的布线层12、13经由在基板内部隔着绝缘层而形成的各布线层以及将各布线层之间相互连接的通孔(中填充的导体)而彼此电连接。作为这种形式的基板，例如包括可通过积层(build-up)法形成的多层布线基板。该多层布线基板为，以玻璃环氧树脂基板等核心基板为中心，在其两面上依次反复地形成导体图案(布线层)、绝缘层以及绝缘层中的通孔，由此来形成多层布线结构，最后用保护膜(阻焊剂层)来覆盖最表层的布线层，并对其预定位置进行开口，使导体图案的一部分(焊盘部)露出。另一方面，在树脂基板11的内部未形成布线层的形态下，最表层的布线层12、13经由适当形成在该树脂基板11的预定位置处的通孔(中填充的导体)而彼此电连接。
此外，在从芯片安装面侧的阻焊剂层14露出的焊盘部(Cu)12P上，通过预焊接(pre-solder)来预先覆盖焊锡16，以使在安装芯片20时便于与芯片20的电极端子23连接。关于该焊锡16例如可以使用共晶焊锡或者无铅焊锡(Sn(锡)-Ag(银)系、Sn-Cu(铜)系、Sn-Ag-Cu系等)。不过，不一定要设置这种芯片安装用的焊锡16，也可以使该焊盘部12P直接处于露出的状态，以便在以后需要的时候(例如在发货目的地)能够连接芯片的电极端子。在该情况下，优选在该焊盘部的表面上依次实施镀镍(Ni)、镀金(Au)。这是为了提高接合电极端子时的接触性(Au层)；以及提高该Au层与焊盘部(Cu)12P的密合性并防止Cu向Au层中扩散(Ni层)。
同样，如图中虚线所示，在从芯片安装面侧相反侧的阻焊剂层15露出的焊盘部13P上也接合有焊球等外部连接端子17，该外部连接端子17在将该布线基板10安装到印刷布线板等母板上时使用，从而根据与上面相同的理由，优选在焊盘部13P上实施镀Ni/Au。可以在出厂时预先设置这种外部连接端子，也可以使该焊盘部13P直接处于露出的状态，以便在以后需要的时候能够接合外部连接端子。
另一方面，安装在布线基板(封装)10上的芯片20在其电路形成面(在图示的例子中为下侧的面)上具有多个突起状的电极端子(凸点)23。在本实施方式中，芯片20的电极端子23配置成环绕状(沿芯片外周的环状的形式)，作为其形式，例如是可利用引线键合技术来形成的金(Au)钉头凸点。此外，21表示覆盖在电路形成面侧的保护膜，22表示以从保护膜21露出的方式形成的电极焊盘，该电极焊盘22与电极端子(Au钉头凸点)23接合。
该芯片20相对于布线基板10进行倒装芯片接合。该倒装芯片接合通过如下方式实现：经由覆盖在布线基板10的芯片安装面侧的焊盘部(Cu)12P上的焊锡来连接芯片20的电极端子(Au钉头凸点)。
在这样倒装芯片接合后的芯片20与布线基板10之间填充底部填充树脂30。作为该底部填充树脂30的材料，代表性地使用环氧系热硬化树脂，该环氧系热硬化树脂在硬化前的状态下具有流动性和低粘性。将这种底部填充树脂30流入芯片20与布线基板10之间的间隙中，并在之后利用加热处理使其硬化凝固，由此能够缓解由于芯片20与布线基板10之间的热膨胀系数差而产生的应力，还能够从外部保护电极端子23与布线层12(焊盘部12P)的接合部位，以提高安装的可靠性。
接着，参照图1对阻焊剂层14上形成的开口部18进行说明。图中用虚线围起的四方形部分MA表示用于安装半导体芯片20的区域(安装区域)，其形状与该芯片20的外形对应。
在本实施方式中，如上所述，假设芯片20的电极端子(凸点)23被配置成环绕状，因此与该配置方式相对应，形成在布线基板10上的芯片连接用的焊盘部12P也排列成环状。因此，如图所示，为了露出这些焊盘部12P而应该形成在阻焊剂层14上的开口部18沿着所要安装的芯片20的外形(安装区域MA)形成为四方形的环状。
该开口部18形成为：除了其四个角(角部P1、P2、P3、P4)中的特定角部(在图示的例子中为角部P4这一个角)之外，开口部18的边缘部EP都沿着安装区域MA(芯片20的外形)位于安装区域MA的外侧，而且在其他角部P1～P3处开口成局部较宽。此外开口部18还形成为：在其特定角部P4处，如图所示开口部18的边缘部EP位于安装区域MA(芯片20的外形)的边上或其内侧。在图示的例子中，该特定角部P4位于开口部18的左上侧，不过显然不限于该位置。
在将芯片20倒装安装到布线基板10上后向其间隙(包含开口部18)填充底部填充树脂30时，只要将开口部18中与用于注入底部填充树脂30的注入边相反侧的边相连的角部选定为“特定的角部”即可。在本实施方式中，如图2所示，从开口部18的两个边(与角部P1与P2之间对应的部分的边、和与角部P2与P3之间对应的部分的边)来注入底部填充树脂30，因此如图所示，将位于开口部18左上侧的角部P4选定为“特定的角部”。
另外，由于在本实施方式中开口部18形成为环状，因此阻焊剂层14成为这样的形态，即：被分割成该开口部18外侧的区域(形成在安装区域MA的外侧的区域)和在该开口部18内侧以岛状残留的区域(形成在安装区域MA内侧的区域)。
如上所述，根据本实施方式的倒装芯片安装用布线基板10的结构，将为了露出芯片安装面侧的焊盘部12P而应该形成在阻焊剂层14上的开口部18的形状形成为特定的形状(参照图1)，因此在安装到该布线基板10上的半导体芯片20与布线基板10之间填充底部填充树脂30时(参照图2)，不会在该填充的树脂30内产生空洞(气泡)，且在树脂30的注入边相反侧(树脂30流动的下游侧)的边以及与该边连接的特定角部P4的开口部分也能够充分填充树脂30。
即，在从开口部18中被开口成局部较宽的3处角部P1、P2和P3中的例如角部P1开始填充底部填充(注入)树脂30时，能够利用毛细管现象从该角部P1向开口部18的内部侧填充底部填充树脂30，并且从其他角部P2、P3抽出空气，因此，即使底部填充树脂30首先从阻焊剂层14(呈岛状而残留下的内侧区域)浸润，也不会在填充的树脂30内形成空洞，从而能够将树脂30填充到芯片20与布线基板10的间隙中。
此外，在特定角部P4处形成了其开口部分，使开口部18的边缘部EP位于芯片20的外形的边上或其内侧，因此，该特定角部P4不存在现有技术(图6)中的角部R4那样的“局部较宽的开口部分”。即，位于树脂30的注入边相反侧(树脂30流动的下游侧)的角部P4的开口部分形成得相对较小，因此也能够将树脂30充分填充到该角部P4的开口部分，这样能够克服现有技术中的“底部填充树脂的蔓延不良”等问题。由此，能够提高芯片20的角部(与开口部18的角部P4对应的部位)中的底部填充树脂的蔓延性，能够有助于在该部分可靠地形成树脂圆角(改善了因缺欠圆角而引起的外观不精美)。
此外，由于在本实施方式中开口部18形成为环状，所以在该开口部18的内侧形成有阻焊剂层14的一部分残留成岛状的区域。因此，在该岛状的阻焊剂层14的下部也能够形成布线层12。当假设不在该区域设置阻焊剂层而形成布线层12时，在安装时芯片20的电路形成面直接与布线层12相对，从芯片20的保护性和绝缘性方面看是不理想的。与此相对，在像本发明这样形成岛状的阻焊剂层14时，即使在该阻焊剂层14的下部形成布线层12，也能够维持芯片20的保护性和绝缘性。此外，能够拓宽布线层12的配置区域，从而有利于提高布线图案的设计自由度。
在上述实施方式的布线基板10(图1)的结构中，是以从开口部18的两个边(图2中与带箭头的部分对应的边)注入底部填充树脂30为前提，因此以只将开口部18的一处角部P4选定为“特定的角部”的情况为例进行了说明，不过，显然该特定的角部不限于一处。例如，在从开口部18的一边注入底部填充树脂30的情况下，可以选定两处该特定的角部。图4示出了其一例。
图4所示的实施方式的倒装芯片安装用布线基板10a与上述实施方式的布线基板10(图1)相比，不同之处在于：将开口部18a的四个角(角部P5、P6、P7、P8)中的两处角部P7、P8选定为“特定的角部”，该P7、P8与底部填充树脂的注入边(图中带箭头的部分，与角部P5和P6之间对应的部分的边)相反侧的边相连，将各个开口部分形成为，开口部18a的边缘部EP1位于安装区域MA的边上或其内侧。其他结构与上述实施方式的布线基板10的情况基本相同，因此省略对其的说明。
在该实施方式的布线基板10a的结构(图4)中，也与上述实施方式的布线基板10(图1)的情况相同，将为了露出芯片安装面侧的焊盘部12P而应该形成在阻焊剂层14上的开口部18的形状形成为特定的形状，因此基于与上述实施方式的布线基板10的情况相同的作用，可实现同样的效果。
在上述各实施方式(图1、图4)中，以将特定的角部P4、P7、P8的开口部分形成为该开口部的边缘部位于安装区域MA的边上或其内侧的情况为例进行了说明，不过根据本发明的主旨可知，该开口部分的形状不限于此，也可以采用其他形状。图5示出了该情况的实施方式。
在图5中，(a)以俯视图的方式来表示按照与图1的布线基板10对应的布局来形成开口部18b时的布线基板10b的结构，(b)以俯视图的方式来表示按照与图4的布线基板10a对应的布局来形成开口部18c时的布线基板10c的结构。
图5(a)所示的实施方式的倒装芯片安装用布线基板10b与图1的布线基板10相比，不同之处在于：将开口部18b的各个角部Q1、Q2、Q3、Q4中被选定为特定角部的一处角部Q4的开口部分形成为曲线状，使开口部18b的边缘部EP2通过安装区域MA的角的位置。其他结构与图1的布线基板10的情况基本相同，因此省略对其的说明。
另一方面，图5(b)所示的实施方式的倒装芯片安装用布线基板10c与图4的布线基板10a相比，不同之处在于：将开口部18c的各个角部Q5、Q6、Q7、Q8中被选定为特定角部的两处角部Q7、Q8的开口部分形成为曲线状，使开口部18c的边缘部EP3分别通过安装区域MA的角的位置。其他结构与图4的布线基板10a的情况基本相同，因此省略对其的说明。
在图5所示的各实施方式的布线基板10b、10c的结构中，也分别与上述实施方式的布线基板10(图1)、10a(图4)的情况相同，将应该形成在阻焊剂层14上的开口部18b、18c的形状形成为特定的形状，因此基于与上述实施方式的布线基板10、10a的情况相同的作用，可实现同样的效果。
另外，在上述各实施方式中，以如下情况为例进行了说明，即：从开口部(例如，图2的开口部18)中的某个角部(图2的P1、P2)开始注入树脂，使喷嘴沿着该开口部的边一直移动到相邻的角部(图2的P2、P3)，由此来向该开口部填充树脂。不过，显然树脂的注入不一定从角部开始。例如，也可以从开口部的某边(树脂注入边)的中间部分开始注入树脂，与上述同样使喷嘴沿该边进行移动来填充树脂。在该情况下，可以将上述特定的角部(P4、P7、P8、Q4、Q7、Q8)都选定在该开口部的全部四个角的部位。或者，可以仅将该开口部的四个角中在对角线方向上隔开的两处角部选定为“特定的角部”。
此外，在上述各实施方式中，关于为了露出封装的芯片安装面侧的焊盘部12P而应该形成在阻焊剂层14上的开口部18(18a、18b、18c)的形状，以沿着所要安装的芯片20的外形(安装区域MA)形成为四方形的环状为例进行了说明，不过根据本发明的主旨可知，显然开口部整体的形状不限于此。例如，可以按照在芯片20的整个安装区域MA内都进行开口的方式来形成该开口部。在该情况下，不形成上述阻焊剂层14的岛状部分(形成在安装区域MA内侧的区域)。
此外，在上述各实施方式中，以在作为封装的布线基板10(10a、10b、10c)上搭载作为被安装体的半导体芯片20的情况为例进行了说明，不过，显然安装在封装(布线基板)上的被安装体的形式不限于芯片。例如，具有在封装(布线基板)上层叠了其他封装(布线基板)或半导体装置的结构的倒装芯片安装型的封装(层叠封装，package on package)，也同样可应用本发明。
此外，在上述各实施方式中，以使用树脂基板11(其最表层上形成有布线层12、13，用阻焊剂层14、15来覆盖该布线层，并露出在各布线层上限定的焊盘部12P、13P)作为封装的布线基板主体为例进行了说明，不过，显然所使用的布线基板主体不限于此。只要是具有倒装芯片安装型结构的封装基板即可。例如，也可以是在CSP(芯片尺寸封装，chip sizepackage)中采用的硅基板的形式。在该形式下，在硅(Si)基板上设置铝(Al)电极焊盘，来取代上述布线层12、13(焊盘部12P、13P)，设置由SiO2、SiN、聚酰亚胺树脂等构成的钝化膜，来取代上述阻焊剂层14、15。此外作为其他方式，还可以使用陶瓷基板等。

Claims (7)

1.一种布线基板，其在安装了俯视观察为多边形状、且在安装面侧具有凸点状的电极端子的被安装体时，在与该被安装体之间填充树脂，其特征在于，该布线基板具有：
布线基板主体，其形成有与所述被安装体的电极端子连接的导体部；以及
绝缘性的保护膜，其形成在所述布线基板主体上，并在与所述被安装体的外形对应的安装区域中具有形成为至少露出所述导体部的开口部，
所述开口部形成为：所述开口部的边缘部除了至少一处角部以外，沿着所述被安装体的安装区域位于该安装区域的外侧，并且，在所述至少一处角部中，所述开口部的边缘部位于该被安装体的安装区域的边上或其内侧。
2.根据权利要求1所述的布线基板，其特征在于，
所述开口部不是形成为在所述至少一处角部中、所述开口部的边缘部位于该被安装体的安装区域的边上或其内侧，而是形成为曲线状，使所述开口部的边缘部通过该被安装体的安装区域的角的位置。
3.根据权利要求1或2所述的布线基板，其特征在于，
在安装俯视观察为方形的所述被安装体时，所述开口部形成为最多在两处角部中、所述开口部的边缘部位于该被安装体的安装区域的边上或其内侧，或者形成为曲线状，使得最多在两处角部中、所述开口部的边缘部通过该被安装体的安装区域的角的位置。
4.根据权利要求1所述的布线基板，其特征在于，
所述开口部在除了所述至少一处角部以外的其他角部中，被开口成局部较宽。
5.根据权利要求1所述的布线基板，其特征在于，
所述开口部沿着所述被安装体的安装区域而形成为环状。
6.根据权利要求1所述的布线基板，其特征在于，
所述开口部形成为：在所述被安装体的整个安装区域内进行开口。
7.根据权利要求1所述的布线基板，其特征在于，
该布线基板适合于安装半导体芯片、其他布线基板或半导体装置，作为所述被安装体。
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