CN101540342B - 薄膜晶体管及显示装置 - Google Patents

薄膜晶体管及显示装置 Download PDF

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Publication number
CN101540342B
CN101540342B CN200910128138.9A CN200910128138A CN101540342B CN 101540342 B CN101540342 B CN 101540342B CN 200910128138 A CN200910128138 A CN 200910128138A CN 101540342 B CN101540342 B CN 101540342B
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China
Prior art keywords
semiconductor layer
microcrystalline semiconductor
layer
film transistor
thin film
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Expired - Fee Related
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CN200910128138.9A
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English (en)
Chinese (zh)
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CN101540342A (zh
Inventor
山崎舜平
黑川义元
乡户宏充
宫入秀和
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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Publication of CN101540342A publication Critical patent/CN101540342A/zh
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/021Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/031Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
    • H10D30/0321Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] comprising silicon, e.g. amorphous silicon or polysilicon
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/021Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/031Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
    • H10D30/0312Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes
    • H10D30/0316Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes of lateral bottom-gate TFTs comprising only a single gate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/674Thin-film transistors [TFT] characterised by the active materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6757Thin-film transistors [TFT] characterised by the structure of the channel, e.g. transverse or longitudinal shape or doping profile
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/40Crystalline structures

Landscapes

  • Thin Film Transistor (AREA)
CN200910128138.9A 2008-03-18 2009-03-04 薄膜晶体管及显示装置 Expired - Fee Related CN101540342B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008070465 2008-03-18
JP2008070465 2008-03-18
JP2008-070465 2008-03-18

Publications (2)

Publication Number Publication Date
CN101540342A CN101540342A (zh) 2009-09-23
CN101540342B true CN101540342B (zh) 2015-05-20

Family

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CN200910128138.9A Expired - Fee Related CN101540342B (zh) 2008-03-18 2009-03-04 薄膜晶体管及显示装置

Country Status (4)

Country Link
US (1) US8624321B2 (enExample)
JP (1) JP5411528B2 (enExample)
CN (1) CN101540342B (enExample)
TW (1) TWI492386B (enExample)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006203120A (ja) * 2005-01-24 2006-08-03 Toshiba Corp 半導体装置の製造方法
JP5436017B2 (ja) * 2008-04-25 2014-03-05 株式会社半導体エネルギー研究所 半導体装置
US8049215B2 (en) * 2008-04-25 2011-11-01 Semiconductor Energy Laboratory Co., Ltd. Thin film transistor
KR101602252B1 (ko) * 2008-06-27 2016-03-10 가부시키가이샤 한도오따이 에네루기 켄큐쇼 박막 트랜지스터, 반도체장치 및 전자기기
JP2010211086A (ja) * 2009-03-12 2010-09-24 Hitachi Displays Ltd 液晶表示装置
KR101582946B1 (ko) * 2009-12-04 2016-01-08 삼성디스플레이 주식회사 박막 트랜지스터 표시판 및 그 제조 방법
KR101840622B1 (ko) 2009-12-21 2018-05-04 가부시키가이샤 한도오따이 에네루기 켄큐쇼 박막 트랜지스터와 그 제작 방법
CN102405527A (zh) * 2010-05-11 2012-04-04 松下电器产业株式会社 显示装置用薄膜半导体器件及其制造方法
US8440548B2 (en) * 2010-08-06 2013-05-14 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of microcrystalline silicon film and manufacturing method of thin film transistor
US8405085B2 (en) * 2010-12-01 2013-03-26 Au Optronics Corporation Thin film transistor capable of reducing photo current leakage
US9401396B2 (en) * 2011-04-19 2016-07-26 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device and plasma oxidation treatment method
KR101849268B1 (ko) 2011-05-13 2018-04-18 한국전자통신연구원 빛과 전압 스트레스에 강한 산화물 박막 트랜지스터 및 그의 제조 방법
JP2013016611A (ja) * 2011-07-04 2013-01-24 Sony Corp 半導体装置及びその製造方法、並びに、画像表示装置の製造方法
CN103081078A (zh) 2011-07-05 2013-05-01 松下电器产业株式会社 薄膜晶体管及其制造方法以及显示装置
US8912542B2 (en) * 2013-01-23 2014-12-16 Shenzhen China Star Optoelectronics Technology Co., Ltd. TFT structure and LCD device
CN103107202B (zh) * 2013-01-23 2016-04-27 深圳市华星光电技术有限公司 一种薄膜晶体管结构、液晶显示装置和一种制造方法
KR102130139B1 (ko) * 2013-07-30 2020-07-03 엘지디스플레이 주식회사 산화물 반도체를 이용한 박막 트랜지스터 기판을 포함하는 유기발광 다이오드 표시장치 및 그 제조 방법
JP6345023B2 (ja) * 2013-08-07 2018-06-20 株式会社半導体エネルギー研究所 半導体装置およびその作製方法
CN104752514B (zh) * 2013-12-26 2018-05-25 昆山工研院新型平板显示技术中心有限公司 一种薄膜晶体管及其制备方法和应用
WO2017042941A1 (ja) 2015-09-10 2017-03-16 堺ディスプレイプロダクト株式会社 表示装置及び表示装置の製造方法
US11081507B2 (en) * 2017-07-12 2021-08-03 Sakai Display Products Corporation Semiconductor device and method for manufacturing same
DE112017007966T5 (de) * 2017-09-01 2020-06-04 Mitsubishi Electric Corporation Feldeffekttransistor
TWI648844B (zh) * 2017-11-06 2019-01-21 Industrial Technology Research Institute 薄膜電晶體及其製造方法
US11764308B2 (en) * 2020-02-18 2023-09-19 Sakai Display Products Corporation Thin-film transistor and manufacturing method thereof
CN112331722B (zh) * 2020-11-05 2024-05-28 北海惠科光电技术有限公司 薄膜晶体管及其阈值电压的调整方法、显示装置及介质
CN114864735B (zh) * 2022-05-11 2024-03-15 中南大学 基于飞秒激光的光电晶体管制备方法及晶体管阵列

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5071779A (en) * 1988-07-13 1991-12-10 Seikosha Co., Ltd. Method for producing a silicon thin film transistor
US5109260A (en) * 1989-07-10 1992-04-28 Seikosha Co., Ltd. Silicon thin film transistor and method for producing the same
US5825050A (en) * 1995-05-25 1998-10-20 Nec Corporation Thin film transistor having tapered active layer formed by controlling defect density and process of fabrication thereof
JP2005322845A (ja) * 2004-05-11 2005-11-17 Sekisui Chem Co Ltd 半導体デバイスと、その製造装置、および製造方法

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56122123A (en) 1980-03-03 1981-09-25 Shunpei Yamazaki Semiamorphous semiconductor
US5122849A (en) * 1988-07-13 1992-06-16 Seikosha Co., Ltd. Silicon thin film transistor
US5221631A (en) 1989-02-17 1993-06-22 International Business Machines Corporation Method of fabricating a thin film transistor having a silicon carbide buffer layer
JP2839529B2 (ja) 1989-02-17 1998-12-16 株式会社東芝 薄膜トランジスタ
US5849601A (en) 1990-12-25 1998-12-15 Semiconductor Energy Laboratory Co., Ltd. Electro-optical device and method for manufacturing the same
KR950013784B1 (ko) 1990-11-20 1995-11-16 가부시키가이샤 한도오따이 에네루기 겐큐쇼 반도체 전계효과 트랜지스터 및 그 제조방법과 박막트랜지스터
JP2791422B2 (ja) 1990-12-25 1998-08-27 株式会社 半導体エネルギー研究所 電気光学装置およびその作製方法
US7115902B1 (en) 1990-11-20 2006-10-03 Semiconductor Energy Laboratory Co., Ltd. Electro-optical device and method for manufacturing the same
US5514879A (en) 1990-11-20 1996-05-07 Semiconductor Energy Laboratory Co., Ltd. Gate insulated field effect transistors and method of manufacturing the same
US7576360B2 (en) 1990-12-25 2009-08-18 Semiconductor Energy Laboratory Co., Ltd. Electro-optical device which comprises thin film transistors and method for manufacturing the same
US7098479B1 (en) 1990-12-25 2006-08-29 Semiconductor Energy Laboratory Co., Ltd. Electro-optical device and method for manufacturing the same
JPH05129608A (ja) 1991-10-31 1993-05-25 Sharp Corp 半導体装置
EP0535979A3 (en) 1991-10-02 1993-07-21 Sharp Kabushiki Kaisha A thin film transistor and a method for producing the same
JPH05190857A (ja) * 1992-01-10 1993-07-30 Toshiba Corp 薄膜トランジスタ
US5473168A (en) 1993-04-30 1995-12-05 Sharp Kabushiki Kaisha Thin film transistor
KR950000937U (ko) 1993-06-30 1995-01-03 운전식 균형장치
JPH07131030A (ja) 1993-11-05 1995-05-19 Sony Corp 表示用薄膜半導体装置及びその製造方法
JPH08172195A (ja) 1994-12-16 1996-07-02 Sharp Corp 薄膜トランジスタ
US5920772A (en) 1997-06-27 1999-07-06 Industrial Technology Research Institute Method of fabricating a hybrid polysilicon/amorphous silicon TFT
KR100393324B1 (ko) * 1998-06-19 2003-07-31 띤 필름 일렉트로닉스 에이에스에이 집적 무기/유기 보상 박막 트랜지스터 회로 및 그 제조방법
JP2001053283A (ja) 1999-08-12 2001-02-23 Semiconductor Energy Lab Co Ltd 半導体装置及びその作製方法
TW508830B (en) 2001-08-28 2002-11-01 Hannstar Display Corp Thin film transistor structure having four procedures of mask processing and the manufacturing method
JP4748954B2 (ja) 2003-07-14 2011-08-17 株式会社半導体エネルギー研究所 液晶表示装置
EP1537938A3 (en) 2003-12-02 2009-02-18 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation apparatus, laser irradiation method, and method for manufacturing semiconductor device
JP5159021B2 (ja) 2003-12-02 2013-03-06 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP2005167051A (ja) * 2003-12-04 2005-06-23 Sony Corp 薄膜トランジスタおよび薄膜トランジスタの製造方法
TWI258048B (en) * 2004-06-15 2006-07-11 Taiwan Tft Lcd Ass Structure of TFT electrode for preventing metal layer diffusion and manufacturing method thereof
US7537976B2 (en) 2005-05-20 2009-05-26 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of thin film transistor
US7807516B2 (en) 2005-06-30 2010-10-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method of the same
KR20070009321A (ko) 2005-07-15 2007-01-18 삼성전자주식회사 박막 트랜지스터 기판 및 이의 제조 방법
WO2007097068A1 (ja) * 2006-02-24 2007-08-30 Sharp Kabushiki Kaisha アクティブマトリクス基板、表示装置、テレビジョン受像機
KR101261609B1 (ko) 2006-07-06 2013-05-06 삼성디스플레이 주식회사 박막 트랜지스터, 표시판 및 그 제조 방법
KR101294260B1 (ko) 2006-08-18 2013-08-06 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
US7786485B2 (en) 2008-02-29 2010-08-31 Semicondutor Energy Laboratory Co., Ltd. Thin-film transistor and display device
US7812348B2 (en) 2008-02-29 2010-10-12 Semiconductor Energy Laboratory Co., Ltd. Thin-film transistor and display device
US7968880B2 (en) 2008-03-01 2011-06-28 Semiconductor Energy Laboratory Co., Ltd. Thin film transistor and display device
US7821012B2 (en) 2008-03-18 2010-10-26 Semiconductor Energy Laboratory Co., Ltd. Thin film transistor

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5071779A (en) * 1988-07-13 1991-12-10 Seikosha Co., Ltd. Method for producing a silicon thin film transistor
US5109260A (en) * 1989-07-10 1992-04-28 Seikosha Co., Ltd. Silicon thin film transistor and method for producing the same
US5825050A (en) * 1995-05-25 1998-10-20 Nec Corporation Thin film transistor having tapered active layer formed by controlling defect density and process of fabrication thereof
JP2005322845A (ja) * 2004-05-11 2005-11-17 Sekisui Chem Co Ltd 半導体デバイスと、その製造装置、および製造方法

Also Published As

Publication number Publication date
TWI492386B (zh) 2015-07-11
US20090236600A1 (en) 2009-09-24
JP2009260277A (ja) 2009-11-05
US8624321B2 (en) 2014-01-07
TW201003922A (en) 2010-01-16
JP5411528B2 (ja) 2014-02-12
CN101540342A (zh) 2009-09-23

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