CN101423969B - 连续电镀处理装置 - Google Patents

连续电镀处理装置 Download PDF

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Publication number
CN101423969B
CN101423969B CN2008101732961A CN200810173296A CN101423969B CN 101423969 B CN101423969 B CN 101423969B CN 2008101732961 A CN2008101732961 A CN 2008101732961A CN 200810173296 A CN200810173296 A CN 200810173296A CN 101423969 B CN101423969 B CN 101423969B
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China
Prior art keywords
workpiece
mentioned
plating tank
power subsystem
current value
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CN2008101732961A
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English (en)
Chinese (zh)
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CN101423969A (zh
Inventor
野田朝裕
赤松一俊
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Almex Technologies Inc
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Almex PE Inc
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Coating Apparatus (AREA)
CN2008101732961A 2007-11-01 2008-10-31 连续电镀处理装置 Active CN101423969B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007-284841 2007-11-01
JP2007284841 2007-11-01
JP2007284841 2007-11-01

Publications (2)

Publication Number Publication Date
CN101423969A CN101423969A (zh) 2009-05-06
CN101423969B true CN101423969B (zh) 2013-08-07

Family

ID=40514646

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008101732961A Active CN101423969B (zh) 2007-11-01 2008-10-31 连续电镀处理装置

Country Status (6)

Country Link
US (1) US8940137B2 (OSRAM)
JP (2) JP5457010B2 (OSRAM)
KR (1) KR101540474B1 (OSRAM)
CN (1) CN101423969B (OSRAM)
DE (1) DE102008053965B4 (OSRAM)
TW (1) TWI415977B (OSRAM)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3009532A1 (en) 2009-06-08 2016-04-20 Modumetal, Inc. Electrodeposited nanolaminate coatings and claddings for corrosion protection
JP5613499B2 (ja) * 2010-08-25 2014-10-22 アルメックスPe株式会社 表面処理装置
JP2012046783A (ja) * 2010-08-25 2012-03-08 Almex Pe Inc 表面処理装置
JP5602553B2 (ja) * 2010-09-17 2014-10-08 アルメックスPe株式会社 表面処理装置
JP5833355B2 (ja) * 2011-06-30 2015-12-16 アルメックスPe株式会社 表面処理装置
DE102012012990B4 (de) 2011-06-30 2014-09-04 Almex Pe Inc. Oberflächenbehandlungssystem und Werkstückhaltestütze
JP5795514B2 (ja) * 2011-09-29 2015-10-14 アルメックスPe株式会社 連続メッキ装置
JP6129497B2 (ja) * 2011-09-29 2017-05-17 アルメックスPe株式会社 連続メッキ装置
JP5766091B2 (ja) * 2011-10-24 2015-08-19 京セラサーキットソリューションズ株式会社 めっき装置
CN102677134A (zh) * 2012-05-31 2012-09-19 无锡市喷特环保工程有限公司 连续镀槽
CN103590079A (zh) * 2012-08-14 2014-02-19 亚洲电镀器材有限公司 一种电镀方法
CA2905575C (en) 2013-03-15 2022-07-12 Modumetal, Inc. A method and apparatus for continuously applying nanolaminate metal coatings
EP2971265A4 (en) 2013-03-15 2016-12-14 Modumetal Inc NICKEL CHROME NANOLAMINE COATING WITH HIGH HARDNESS
HK1220741A1 (zh) 2013-03-15 2017-05-12 Modumetal, Inc. 纳米层压涂层
WO2016044720A1 (en) * 2014-09-18 2016-03-24 Modumetal, Inc. A method and apparatus for continuously applying nanolaminate metal coatings
CA2905536C (en) 2013-03-15 2023-03-07 Modumetal, Inc. Electrodeposited compositions and nanolaminated alloys for articles prepared by additive manufacturing processes
BR112017005534A2 (pt) 2014-09-18 2017-12-05 Modumetal Inc métodos de preparação de artigos por processos de eletrodeposição e fabricação aditiva
CN104313657A (zh) * 2014-11-10 2015-01-28 临安振有电子有限公司 Hdi印制线路板通孔的电沉积装置
CN106149039B (zh) * 2015-04-08 2017-11-24 亚硕企业股份有限公司 电镀设备
CN104862768B (zh) * 2015-05-27 2017-09-22 广州杰赛科技股份有限公司 一种电路板的电镀方法及装置
KR102579796B1 (ko) * 2015-10-20 2023-09-15 프로세스 오토메이션 인터내셔날 리미티드 전기도금 머신 및 전기도금 방법
TWI698554B (zh) * 2015-10-20 2020-07-11 香港商亞洲電鍍器材有限公司 電鍍機器及電鍍方法
JP6117891B2 (ja) * 2015-10-29 2017-04-19 アルメックスPe株式会社 表面処理装置
EP3510185A1 (en) 2016-09-08 2019-07-17 Modumetal, Inc. Processes for providing laminated coatings on workpieces, and articles made therefrom
EP3509812B1 (en) 2016-09-09 2025-04-09 Modumetal, Inc. Manufacturing of molds by deposition of material layers on a workpiece, molds and articles obtained by said process
CN109963966B (zh) 2016-09-14 2022-10-11 莫杜美拓有限公司 用于可靠、高通量、复杂电场生成的系统以及由其生产涂层的方法
KR20190057319A (ko) * 2016-09-29 2019-05-28 아루멕쿠스 피이 가부시키가이샤 워크 유지 지그 및 표면처리 장치
CN110114210B (zh) 2016-11-02 2022-03-04 莫杜美拓有限公司 拓扑优化的高界面填充结构
US11286575B2 (en) 2017-04-21 2022-03-29 Modumetal, Inc. Tubular articles with electrodeposited coatings, and systems and methods for producing the same
WO2018221395A1 (ja) 2017-05-30 2018-12-06 アルメックスPe株式会社 表面処理装置及び搬送治具
CN107119309A (zh) * 2017-06-15 2017-09-01 临安金奥科技有限公司 一种对板材表面进行单面连续处理的装置
CN111247273B (zh) * 2017-10-20 2022-12-20 Almex 科技株式会社 表面处理装置和工件保持夹具
WO2019210264A1 (en) 2018-04-27 2019-10-31 Modumetal, Inc. Apparatuses, systems, and methods for producing a plurality of articles with nanolaminated coatings using rotation
CN109468677A (zh) * 2018-12-05 2019-03-15 珠海杰赛科技有限公司 一种垂直连续电镀方法
CN215925133U (zh) * 2021-06-30 2022-03-01 厦门海辰新能源科技有限公司 一种用于镀膜机的阳极板及镀膜机
CN114775023A (zh) * 2022-05-26 2022-07-22 枣庄睿诺光电信息有限公司 一种电镀装置
CN115505996B (zh) * 2022-11-04 2023-03-10 昆山东威科技股份有限公司 一种电镀装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2724691A (en) * 1951-06-13 1955-11-22 Western Electric Co Apparatus for electroplating articles
DE3929728A1 (de) * 1989-09-07 1991-03-14 Werner M Kraemer Anlage zur herstellung von leiterplatten und verfahren zum betreiben der anlage

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2724690A (en) * 1951-06-13 1955-11-22 Western Electric Co Apparatus for electroplating articles
US2935989A (en) * 1957-12-04 1960-05-10 Hanson Van Winkle Munning Co Processing apparatus
US3455809A (en) * 1966-11-25 1969-07-15 Baker Bros Inc Adjustable electrode transporter for lateral electrode spacing during electroplating
GB1557017A (en) * 1976-07-20 1979-12-05 Heritage Silversmiths Ltd Electropolishing of stainless steel
JPS5321048A (en) * 1976-08-10 1978-02-27 Nippon Electric Co Constant current density plating device
US4184927A (en) * 1976-12-30 1980-01-22 Riken Keikinzoku Kogyo Kabushiki Kaisha Process and apparatus for effecting surface treatment of workpieces
FR2390517A1 (fr) * 1977-05-10 1978-12-08 Coppertron Sa Installation pour l'electro-production de cuivre en feuilles destinees a etre appliquees en particulier sur des materiaux dielectriques
US4189360A (en) * 1979-03-12 1980-02-19 Woods Craig P Process for continuous anodizing of aluminum
US4263122A (en) * 1979-12-03 1981-04-21 Programmed Coating Systems, Inc. Electrocoating equipment
DE2951708A1 (de) * 1979-12-19 1981-07-02 Schering Ag Berlin Und Bergkamen, 1000 Berlin Verfahren und vorrichtung zur automatischen regelung von teilstromstaerken eines gleichrichters
US4337134A (en) * 1980-02-27 1982-06-29 Elfab Corporation Continuous truck mounted printed circuit board plating system
US4401522A (en) * 1980-09-29 1983-08-30 Micro-Plate, Inc. Plating method and apparatus
US4378281A (en) * 1981-06-25 1983-03-29 Napco, Inc. High speed plating of flat planar workpieces
US4534843A (en) * 1983-01-28 1985-08-13 Technic, Inc. Apparatus for electroplating and chemically treating contact elements of encapsulated electronic components and their like
JPS61133400A (ja) * 1984-12-03 1986-06-20 Kosaku:Kk 電気めつき装置
US4775046A (en) * 1986-01-17 1988-10-04 Future Automation, Inc. Transport belt for production parts
DE3939681A1 (de) * 1989-12-01 1991-06-06 Schering Ag Verfahren zur steuerung des ablaufes von galvanischen anlagen, sowie zur durchfuehrung des verfahrens dienender anordnung
JPH0774479B2 (ja) * 1990-03-22 1995-08-09 三菱電機株式会社 電気めっき装置
JPH06346289A (ja) * 1993-06-14 1994-12-20 Fujikura Ltd 陽極酸化処理装置および陽極酸化処理方法
US5833816A (en) * 1994-05-11 1998-11-10 Siemens S.A. Apparatus for treating printed circuit boards
DE19539868C1 (de) * 1995-10-26 1997-02-20 Lea Ronal Gmbh Transportvorrichtung und Transportsystem zur vertikalen Führung von plattenähnlichen Gegenständen zur chemischen oder elektrolytischen Oberflächenbehandlung
DE19717510C1 (de) * 1997-04-25 1998-10-01 Atotech Deutschland Gmbh Vorrichtung zur Abblendung von Galvanisiergut in Durchlaufanlagen
TW373034B (en) * 1997-10-30 1999-11-01 Kazuo Ohba Automatic plating method and apparatus thereof
TW438906B (en) * 1998-06-11 2001-06-07 Kazuo Ohba Continuous plating apparatus
US6471846B1 (en) * 1998-09-25 2002-10-29 Kazuo Ohba Electric feeding method and apparatus for a continuous plating apparatus
JP3025254B1 (ja) * 1999-02-05 2000-03-27 藤本電気商事有限会社 めっき装置およびめっき方法
JP3754262B2 (ja) * 2000-02-16 2006-03-08 株式会社アルメックス 表面処理装置
US6793792B2 (en) * 2001-01-12 2004-09-21 Unitive International Limited Curaco Electroplating methods including maintaining a determined electroplating voltage and related systems
JP4157308B2 (ja) * 2001-06-27 2008-10-01 シャープ株式会社 めっき膜の形成方法及び該方法によりめっき膜が形成された電子部品
DE10153171B4 (de) * 2001-10-27 2004-09-16 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum elektrolytischen Behandeln von Teilen in Durchlaufanlagen
US20060141157A1 (en) * 2003-05-27 2006-06-29 Masahiko Sekimoto Plating apparatus and plating method
KR100539239B1 (ko) * 2003-06-25 2005-12-27 삼성전자주식회사 도금 중단에 의해 불량이 발생되는 것을 방지하는 도금방법 및 이에 이용되는 도금 장비
JP2005097721A (ja) * 2003-08-27 2005-04-14 Yamaha Corp 両面メッキ装置および両面メッキ方法
JP4707941B2 (ja) * 2003-09-02 2011-06-22 アルメックスPe株式会社 めっき処理装置およびめっき処理方法
JP2006037134A (ja) * 2004-07-23 2006-02-09 Chuo Seisakusho Ltd 連続搬送式めっき装置の電流制御方法
US20060213778A1 (en) * 2005-03-23 2006-09-28 Taiwan Semiconductor Manufacturing Co., Ltd. Method for electrochemical plating on semiconductor wafers
JP4937154B2 (ja) * 2008-02-06 2012-05-23 デュポン神東・オートモティブ・システムズ株式会社 電着膜厚自動制御方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2724691A (en) * 1951-06-13 1955-11-22 Western Electric Co Apparatus for electroplating articles
DE3929728A1 (de) * 1989-09-07 1991-03-14 Werner M Kraemer Anlage zur herstellung von leiterplatten und verfahren zum betreiben der anlage

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开2000-226697A 2000.08.15

Also Published As

Publication number Publication date
JP5457010B2 (ja) 2014-04-02
JP2009132999A (ja) 2009-06-18
TW200930845A (en) 2009-07-16
US20090114530A1 (en) 2009-05-07
DE102008053965A1 (de) 2009-05-07
TWI415977B (zh) 2013-11-21
JP2014074237A (ja) 2014-04-24
JP5740014B2 (ja) 2015-06-24
CN101423969A (zh) 2009-05-06
KR20090045119A (ko) 2009-05-07
KR101540474B1 (ko) 2015-07-29
US8940137B2 (en) 2015-01-27
DE102008053965B4 (de) 2021-03-25

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