CN101408556B - 电子器件和电子模块以及它们的制造方法 - Google Patents

电子器件和电子模块以及它们的制造方法 Download PDF

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Publication number
CN101408556B
CN101408556B CN2008101685852A CN200810168585A CN101408556B CN 101408556 B CN101408556 B CN 101408556B CN 2008101685852 A CN2008101685852 A CN 2008101685852A CN 200810168585 A CN200810168585 A CN 200810168585A CN 101408556 B CN101408556 B CN 101408556B
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CN
China
Prior art keywords
electrode
substrate
electron device
resin
cut
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CN2008101685852A
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English (en)
Chinese (zh)
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CN101408556A (zh
Inventor
小野淳
小林祥宏
北村昇二郎
松永雅敬
原明稔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Epson Toyocom Corp
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Filing date
Publication date
Application filed by Epson Toyocom Corp filed Critical Epson Toyocom Corp
Publication of CN101408556A publication Critical patent/CN101408556A/zh
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Publication of CN101408556B publication Critical patent/CN101408556B/zh
Expired - Fee Related legal-status Critical Current
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G01P1/02—Housings
    • G01P1/023—Housings for acceleration measuring devices

Landscapes

  • Wire Bonding (AREA)
  • Gyroscopes (AREA)
  • Pressure Sensors (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
CN2008101685852A 2007-10-10 2008-10-10 电子器件和电子模块以及它们的制造方法 Expired - Fee Related CN101408556B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2007-264443 2007-10-10
JP2007264443 2007-10-10
JP2007264443 2007-10-10
JP2008052277A JP2009109472A (ja) 2007-10-10 2008-03-03 電子デバイス及び電子モジュール並びにこれらの製造方法
JP2008-052277 2008-03-03
JP2008052277 2008-03-03

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201110213998XA Division CN102285626A (zh) 2007-10-10 2008-10-10 电子器件和电子模块

Publications (2)

Publication Number Publication Date
CN101408556A CN101408556A (zh) 2009-04-15
CN101408556B true CN101408556B (zh) 2011-09-14

Family

ID=40571653

Family Applications (2)

Application Number Title Priority Date Filing Date
CN2008101685852A Expired - Fee Related CN101408556B (zh) 2007-10-10 2008-10-10 电子器件和电子模块以及它们的制造方法
CN201110213998XA Pending CN102285626A (zh) 2007-10-10 2008-10-10 电子器件和电子模块

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201110213998XA Pending CN102285626A (zh) 2007-10-10 2008-10-10 电子器件和电子模块

Country Status (2)

Country Link
JP (2) JP2009109472A (enExample)
CN (2) CN101408556B (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5481634B2 (ja) * 2009-10-14 2014-04-23 多摩川精機株式会社 慣性センサを収容するモールド構造およびそれを用いたセンサシステム
JP2013115136A (ja) * 2011-11-25 2013-06-10 Ibiden Co Ltd 電子部品内蔵基板及びその製造方法
JP6662437B2 (ja) * 2018-11-21 2020-03-11 大日本印刷株式会社 植物由来ポリエチレンを用いた包装材用シーラントフィルム、包装材用積層フィルム、および包装袋
JP6699710B2 (ja) * 2018-11-21 2020-05-27 大日本印刷株式会社 植物由来ポリエチレンを用いた包装材用シーラントフィルム、包装材用積層フィルム、および包装袋
JP6852830B2 (ja) * 2020-07-17 2021-03-31 大日本印刷株式会社 植物由来ポリエチレンを用いた包装材用シーラントフィルム、包装材用積層フィルム、および包装袋
JP2023105388A (ja) * 2022-01-19 2023-07-31 セイコーエプソン株式会社 センサーモジュール
CN119309558B (zh) * 2024-12-10 2025-03-25 北京晨晶电子有限公司 一种角速度传感器

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5554806A (en) * 1994-06-15 1996-09-10 Nippondenso Co., Ltd. Physical-quantity detecting device
US5898218A (en) * 1996-04-26 1999-04-27 Denso Corporation Structure for mounting electronic components and method for mounting the same

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2877034B2 (ja) * 1994-06-15 1999-03-31 株式会社デンソー 加速度検出装置および加速度センサ
JPH0815302A (ja) * 1994-06-27 1996-01-19 Taiyo Yuden Co Ltd 加速度センサー
JPH0951199A (ja) * 1995-08-08 1997-02-18 Hitachi Ltd 半導体装置
JPH11340366A (ja) * 1998-05-28 1999-12-10 Toshiba Corp 半導体装置
JP3391282B2 (ja) * 1998-07-02 2003-03-31 株式会社村田製作所 電子部品の製造方法
JP3589928B2 (ja) * 2000-02-22 2004-11-17 株式会社東芝 半導体装置
JP2002359320A (ja) * 2001-06-01 2002-12-13 Toyo Commun Equip Co Ltd 電子部品の外部電極パターン
JP2003060327A (ja) * 2001-08-08 2003-02-28 Matsushita Electric Ind Co Ltd 電子部品およびその製造方法
JP2004119661A (ja) * 2002-09-26 2004-04-15 Murata Mfg Co Ltd 積層型電子部品
JP2004327855A (ja) * 2003-04-25 2004-11-18 Nec Electronics Corp 半導体装置およびその製造方法
JP4511333B2 (ja) * 2004-12-22 2010-07-28 新光電気工業株式会社 センサ搭載のモジュール及び電子部品
JP2006229121A (ja) * 2005-02-21 2006-08-31 Seiko Epson Corp 圧電デバイス及び圧電装置並びに電子機器
JP2006337196A (ja) * 2005-06-02 2006-12-14 Kayaba Ind Co Ltd 多軸加速度検出装置
JP2007132687A (ja) * 2005-11-08 2007-05-31 Sensata Technologies Japan Ltd センサ用パッケージおよびこれを用いた検出装置
WO2007069427A1 (ja) * 2005-12-15 2007-06-21 Matsushita Electric Industrial Co., Ltd. 電子部品内蔵モジュールとその製造方法
JP5192825B2 (ja) * 2006-01-17 2013-05-08 スパンション エルエルシー 半導体装置およびその製造方法、ならびに積層半導体装置の製造方法
US7536909B2 (en) * 2006-01-20 2009-05-26 Memsic, Inc. Three-dimensional multi-chips and tri-axial sensors and methods of manufacturing the same
JP2007258635A (ja) * 2006-03-27 2007-10-04 Matsushita Electric Ind Co Ltd 部品内蔵基板の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5554806A (en) * 1994-06-15 1996-09-10 Nippondenso Co., Ltd. Physical-quantity detecting device
US5898218A (en) * 1996-04-26 1999-04-27 Denso Corporation Structure for mounting electronic components and method for mounting the same

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
JP特开平10-253652A 1998.09.25 *
JP特开平7-72167A 1995.03.17 *

Also Published As

Publication number Publication date
CN101408556A (zh) 2009-04-15
JP2010166061A (ja) 2010-07-29
JP5494947B2 (ja) 2014-05-21
JP2009109472A (ja) 2009-05-21
CN102285626A (zh) 2011-12-21

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Owner name: SEIKO EPSON CORP.

Free format text: FORMER OWNER: EPSON TOYOCOM CORP.

Effective date: 20111014

C41 Transfer of patent application or patent right or utility model
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Effective date of registration: 20111014

Address after: Tokyo, Japan

Patentee after: Seiko Epson Corp.

Address before: Japan Tokyo Hino Hino 421-8

Patentee before: Epson Toyocom Corp.

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110914

Termination date: 20181010

CF01 Termination of patent right due to non-payment of annual fee