CN101399254B - 半导体装置 - Google Patents

半导体装置 Download PDF

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Publication number
CN101399254B
CN101399254B CN2008101663001A CN200810166300A CN101399254B CN 101399254 B CN101399254 B CN 101399254B CN 2008101663001 A CN2008101663001 A CN 2008101663001A CN 200810166300 A CN200810166300 A CN 200810166300A CN 101399254 B CN101399254 B CN 101399254B
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mentioned
electrode pad
probe
semiconductor device
wiring
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CN101399254A (zh
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高桥昌男
竹村康司
阪下俊彦
三村忠昭
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Nuvoton Technology Corp Japan
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Matsushita Electric Industrial Co Ltd
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    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor

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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Wire Bonding (AREA)
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JP2011003578A (ja) * 2009-06-16 2011-01-06 Renesas Electronics Corp 半導体装置
WO2020098623A1 (en) * 2018-11-12 2020-05-22 Changxin Memory Technologies, Inc. Semiconductor device, pad structure and fabrication method thereof
US11837623B2 (en) * 2020-10-12 2023-12-05 Raytheon Company Integrated circuit having vertical routing to bond pads

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JP2781787B2 (ja) 1996-08-29 1998-07-30 日本電気アイシーマイコンシステム株式会社 半導体チップのボンディングパッド配置構成及びその最適化方法
KR100295637B1 (ko) * 1997-12-29 2001-10-24 김영환 반도체웨이퍼의구조및반도체칩의제조방법
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CN101399254A (zh) 2009-04-01
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US20130075727A1 (en) 2013-03-28
US20090078935A1 (en) 2009-03-26
JP5027605B2 (ja) 2012-09-19
US8669555B2 (en) 2014-03-11
US8338829B2 (en) 2012-12-25

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