CN101379869A - 屏蔽壳和具有屏蔽壳的微机电系统传声器 - Google Patents

屏蔽壳和具有屏蔽壳的微机电系统传声器 Download PDF

Info

Publication number
CN101379869A
CN101379869A CNA2007800041936A CN200780004193A CN101379869A CN 101379869 A CN101379869 A CN 101379869A CN A2007800041936 A CNA2007800041936 A CN A2007800041936A CN 200780004193 A CN200780004193 A CN 200780004193A CN 101379869 A CN101379869 A CN 101379869A
Authority
CN
China
Prior art keywords
top plate
shield case
mems microphone
area
case
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2007800041936A
Other languages
English (en)
Chinese (zh)
Inventor
卷幡胜浩
木村教夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of CN101379869A publication Critical patent/CN101379869A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0077—Other packages not provided for in groups B81B7/0035 - B81B7/0074
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/01—Electrostatic transducers characterised by the use of electrets
    • H04R19/016—Electrostatic transducers characterised by the use of electrets for microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/163—Connection portion, e.g. seal
    • H01L2924/16315—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
  • Micromachines (AREA)
CNA2007800041936A 2006-09-15 2007-09-13 屏蔽壳和具有屏蔽壳的微机电系统传声器 Pending CN101379869A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP250915/2006 2006-09-15
JP2006250915A JP4387392B2 (ja) 2006-09-15 2006-09-15 シールドケースおよびこれを有するｍｅｍｓマイクロホン

Publications (1)

Publication Number Publication Date
CN101379869A true CN101379869A (zh) 2009-03-04

Family

ID=39183839

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2007800041936A Pending CN101379869A (zh) 2006-09-15 2007-09-13 屏蔽壳和具有屏蔽壳的微机电系统传声器

Country Status (4)

Country Link
US (2) US7904123B2 (enExample)
JP (1) JP4387392B2 (enExample)
CN (1) CN101379869A (enExample)
WO (1) WO2008032785A1 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013033949A1 (zh) * 2011-09-08 2013-03-14 苏州恒听电子有限公司 用于助听器的传声器电磁屏蔽壳
CN104254047A (zh) * 2013-06-26 2014-12-31 英飞凌科技股份有限公司 具有用于机电换能器的大背面体积的电子设备
CN104904238A (zh) * 2012-07-27 2015-09-09 美商楼氏电子有限公司 外壳及控制外壳上的焊料蠕变的方法
CN107426638A (zh) * 2017-07-06 2017-12-01 广东欧珀移动通信有限公司 麦克风组件及具有其的终端

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4017033A1 (en) 2008-03-19 2022-06-22 NEC Corporation Communication system, mobile station, base station, response decision method, resource configuration decision method, and program
US8450817B2 (en) * 2008-08-14 2013-05-28 Knowles Electronics Llc Microelectromechanical system package with strain relief bridge
JP2010081192A (ja) * 2008-09-25 2010-04-08 Rohm Co Ltd Ｍｅｍｓセンサ
JP5481852B2 (ja) 2008-12-12 2014-04-23 船井電機株式会社 マイクロホンユニット及びそれを備えた音声入力装置
JP2010161271A (ja) * 2009-01-09 2010-07-22 Panasonic Corp 半導体パッケージ
JP5321111B2 (ja) 2009-02-13 2013-10-23 船井電機株式会社 マイクロホンユニット
JP2010258720A (ja) * 2009-04-23 2010-11-11 Murata Mfg Co Ltd 音響的トランスデューサユニット
US8340735B2 (en) 2010-08-06 2012-12-25 Research In Motion Limited Electromagnetic shielding and an acoustic chamber for a microphone in a mobile electronic device
JP6034619B2 (ja) * 2011-08-22 2016-11-30 パナソニック株式会社 Ｍｅｍｓ素子およびそれを用いた電気機器
DE102012101505B4 (de) * 2012-02-24 2016-03-03 Epcos Ag Verfahren zur Herstellung eines Sensors
KR102008374B1 (ko) * 2012-08-03 2019-10-23 삼성전자주식회사 휴대용 단말기의 입력장치
KR102161546B1 (ko) * 2014-02-05 2020-10-05 삼성전자 주식회사 전자 기기 및 그의 운용 방법
DE102015100757B3 (de) 2015-01-20 2016-06-16 Epcos Ag Modul mit spannungsfrei befestigtem MEMS-Bauelement
KR101703628B1 (ko) * 2015-09-25 2017-02-07 현대자동차 주식회사 마이크로폰 및 그 제조방법
US20170240418A1 (en) * 2016-02-18 2017-08-24 Knowles Electronics, Llc Low-cost miniature mems vibration sensor
KR101893056B1 (ko) * 2016-11-15 2018-10-04 소스트 주식회사 멤스 마이크로폰 칩 구조체 및 마이크로폰 패키지
US11805342B2 (en) 2019-09-22 2023-10-31 xMEMS Labs, Inc. Sound producing package structure and manufacturing method thereof
US11395073B2 (en) * 2020-04-18 2022-07-19 xMEMS Labs, Inc. Sound producing package structure and method for packaging sound producing package structure
US11252511B2 (en) 2019-12-27 2022-02-15 xMEMS Labs, Inc. Package structure and methods of manufacturing sound producing chip, forming package structure and forming sound producing apparatus
USD905022S1 (en) 2020-07-22 2020-12-15 Crown Tech Llc Microphone isolation shield
USD910604S1 (en) 2020-07-22 2021-02-16 Crown Tech Llc Microphone isolation shield
WO2025039235A1 (zh) * 2023-08-23 2025-02-27 广州视源电子科技股份有限公司 一种交互平板

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1202713A (en) 1984-03-16 1986-04-01 Beverley W. Gumb Transmitter assembly for a telephone handset
JP3113832B2 (ja) 1997-02-20 2000-12-04 松下電器産業株式会社 マイクロホン・ホルダー
US7023066B2 (en) 2001-11-20 2006-04-04 Knowles Electronics, Llc. Silicon microphone
JP3956356B2 (ja) 2002-05-20 2007-08-08 シチズン電子株式会社 マイクロホン
JP4309643B2 (ja) 2002-11-29 2009-08-05 日本特殊陶業株式会社 セラミック電子部品の製造方法
WO2005086534A1 (ja) 2004-03-03 2005-09-15 Matsushita Electric Industrial Co., Ltd. エレクトレットコンデンサーマイクロフォンユニット
JP3926350B2 (ja) 2004-06-10 2007-06-06 Ｎｅｃアクセステクニカ株式会社 携帯端末の前面外装カバー、携帯端末及び携帯電話機
JP4483514B2 (ja) 2004-10-08 2010-06-16 株式会社村田製作所 金属ケース付き電子部品の製造方法および製造装置
JP2006211468A (ja) 2005-01-31 2006-08-10 Sanyo Electric Co Ltd 半導体センサ

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013033949A1 (zh) * 2011-09-08 2013-03-14 苏州恒听电子有限公司 用于助听器的传声器电磁屏蔽壳
CN104904238A (zh) * 2012-07-27 2015-09-09 美商楼氏电子有限公司 外壳及控制外壳上的焊料蠕变的方法
CN104254047A (zh) * 2013-06-26 2014-12-31 英飞凌科技股份有限公司 具有用于机电换能器的大背面体积的电子设备
CN104254047B (zh) * 2013-06-26 2018-03-27 英飞凌科技股份有限公司 具有用于机电换能器的大背面体积的电子设备
CN107426638A (zh) * 2017-07-06 2017-12-01 广东欧珀移动通信有限公司 麦克风组件及具有其的终端
CN107426638B (zh) * 2017-07-06 2023-08-25 深圳市欢太科技有限公司 麦克风组件及具有其的终端

Also Published As

Publication number Publication date
US20110116661A1 (en) 2011-05-19
WO2008032785A1 (en) 2008-03-20
US7904123B2 (en) 2011-03-08
JP4387392B2 (ja) 2009-12-16
US20100167799A1 (en) 2010-07-01
JP2008072580A (ja) 2008-03-27

Similar Documents

Publication Publication Date Title
CN101379869A (zh) 屏蔽壳和具有屏蔽壳的微机电系统传声器
US8041064B2 (en) Card type MEMS microphone
JP4751057B2 (ja) コンデンサマイクロホンとその製造方法
US8571249B2 (en) Silicon microphone package
US8126166B2 (en) Condenser microphone and packaging method for the same
US8331589B2 (en) MEMS microphone
JP5029727B2 (ja) 半導体装置及びマイクロフォン
CN102190278B (zh) 半导体装置及传声器
US20070058826A1 (en) Condenser microphone
CN106331965B (zh) 微机电麦克风
US8818010B2 (en) Microphone unit
JP4779002B2 (ja) Ｐｃｂに音孔が形成されたｍｅｍｓマイクロホンパッケージ
EP2378789A1 (en) Microphone unit
JP2010187076A (ja) マイクロホンユニット
JP4328347B2 (ja) マイクロホン及びその実装構造
WO2008059643A1 (en) Three-dimensional electronic circuit apparatus
US8218796B2 (en) Microphone unit and method of manufacturing the same
JP5354045B2 (ja) マイクロフォン
JP2009247007A (ja) シールドケースおよびこれを有するｍｅｍｓマイクロホン
JP2008211466A (ja) マイクロホン用パッケージ、マイクロホン搭載体、マイクロホン装置
JP2015046552A (ja) 電子装置、多数個取り枠体および多数個取り電子装置
JP6236367B2 (ja) センサーモジュール及びセンサーモジュールの製造方法
JP2007071821A (ja) 半導体装置
JP2005064821A (ja) 表面弾性波素子の実装構造

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20090304