JP2008072580A - シールドケースおよびこれを有するmemsマイクロホン - Google Patents
シールドケースおよびこれを有するmemsマイクロホン Download PDFInfo
- Publication number
- JP2008072580A JP2008072580A JP2006250915A JP2006250915A JP2008072580A JP 2008072580 A JP2008072580 A JP 2008072580A JP 2006250915 A JP2006250915 A JP 2006250915A JP 2006250915 A JP2006250915 A JP 2006250915A JP 2008072580 A JP2008072580 A JP 2008072580A
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- Prior art keywords
- shield case
- top plate
- mems microphone
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0077—Other packages not provided for in groups B81B7/0035 - B81B7/0074
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/01—Electrostatic transducers characterised by the use of electrets
- H04R19/016—Electrostatic transducers characterised by the use of electrets for microphones
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0257—Microphones or microspeakers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/146—Mixed devices
- H01L2924/1461—MEMS
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/163—Connection portion, e.g. seal
- H01L2924/16315—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
- H04R2499/10—General applications
- H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
Abstract
【解決手段】本発明のシールドケースは、基板に実装されたMEMSチップを外部から遮蔽するシールドケースであって、天板と複数の側面板とを備え、前記複数の側面板の肉厚が、前記天板の肉厚より大きいものである。この構成により、従来の均一肉厚のシールドケースと比較して、天板の面積を広くすることができる。よって、チャッキングエリアの位置・大きさ・範囲等を従来のシールドケースから変更することなく、ガスケットを天板に密着させる領域を確保することができる。
【選択図】図2
Description
図1は、本実施の形態1のMEMSマイクロホン100の外観斜視図を示す。図2は、MEMSマイクロホン100の縦断面図(図1のB−B線断面図)を示している。図1・図2に示すように、MEMSマイクロホン100は、基板101と、MEMSチップ102と、シールドケース103とを有するものである。
天板の端部に角を形成し且つ側面板を偏肉構造にして天板303aの平坦部の面積を拡大したことで、音孔103cの位置を、チャッキングエリアSと重ならない場所に配置し、かつ、音孔103cから天板103aの各端までの距離L1・L2がそれぞれ1[mm]以上の間隔を有する位置に設定することが可能となる。
次に、MEMSマイクロホン100を携帯電話に使用する例について説明する。図4は、MEMSマイクロホン100が搭載された携帯電話150の外観斜視図である。図5は、携帯電話150のマイク部付近の要部断面図(図4中のE−E線断面図)である。
101 基板
102 MEMSチップ
103 シールドケース
103a 天板
103b 側面板
103c 音孔
103d R形状部
103e はんだフィレット
103f 折曲部
150 携帯電話
151 筐体
152 筐体上の音孔
154 ガスケット
155 携帯電話の主基板
Claims (6)
- 基板に実装されたMEMSチップを外部から遮蔽するシールドケースであって、
天板と複数の側面板とを備え、
前記複数の側面板の肉厚が、前記天板の肉厚より厚いシールドケース。 - 前記天板の端部と前記側面板とで形成される折曲部が、角を有する形状である請求項1に記載のシールドケース。
- 前記複数の側面板の端部が、シールドケースの内側に向けてR形状部を有する請求項1または2に記載のシールドケース。
- 基板と、
前記基板に実装されるMEMSチップと、
前記MEMSチップを外部から遮蔽するシールドケースであって、天板と複数の側面板とを有し、前記複数の側面板の肉厚が前記天板の肉厚より厚いシールドケースと、
を備えるMEMSマイクロホン。 - 前記シールドケースの天板の端部と前記側面板とで形成される折曲部が、角を有する形状である請求項4に記載のMEMSマイクロホン。
- 前記複数の側面板の端部が、シールドケースの内側に向けてR形状部を有する請求項4または5に記載のMEMSマイクロホン。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006250915A JP4387392B2 (ja) | 2006-09-15 | 2006-09-15 | シールドケースおよびこれを有するmemsマイクロホン |
US12/160,663 US7904123B2 (en) | 2006-09-15 | 2007-09-13 | Shield case and MEMS microphone having it |
PCT/JP2007/067846 WO2008032785A1 (fr) | 2006-09-15 | 2007-09-13 | Boîtier de protection et microphone mems ayant celui-ci |
CNA2007800041936A CN101379869A (zh) | 2006-09-15 | 2007-09-13 | 屏蔽壳和具有屏蔽壳的微机电系统传声器 |
US13/014,340 US20110116661A1 (en) | 2006-09-15 | 2011-01-26 | Shield case and mems microphone having it |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006250915A JP4387392B2 (ja) | 2006-09-15 | 2006-09-15 | シールドケースおよびこれを有するmemsマイクロホン |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009174336A Division JP2009247007A (ja) | 2009-07-27 | 2009-07-27 | シールドケースおよびこれを有するmemsマイクロホン |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2008072580A true JP2008072580A (ja) | 2008-03-27 |
JP2008072580A5 JP2008072580A5 (ja) | 2009-06-18 |
JP4387392B2 JP4387392B2 (ja) | 2009-12-16 |
Family
ID=39183839
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006250915A Expired - Fee Related JP4387392B2 (ja) | 2006-09-15 | 2006-09-15 | シールドケースおよびこれを有するmemsマイクロホン |
Country Status (4)
Country | Link |
---|---|
US (2) | US7904123B2 (ja) |
JP (1) | JP4387392B2 (ja) |
CN (1) | CN101379869A (ja) |
WO (1) | WO2008032785A1 (ja) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010081192A (ja) * | 2008-09-25 | 2010-04-08 | Rohm Co Ltd | Memsセンサ |
WO2010092856A1 (ja) | 2009-02-13 | 2010-08-19 | 船井電機株式会社 | マイクロホンユニット |
JP2010258720A (ja) * | 2009-04-23 | 2010-11-11 | Murata Mfg Co Ltd | 音響的トランスデューサユニット |
US8823115B2 (en) | 2008-12-12 | 2014-09-02 | Funai Electric Co., Ltd. | Microphone unit and voice input device using same |
US8918150B2 (en) | 2010-08-06 | 2014-12-23 | Blackberry Limited | Electromagnetic shielding and an acoustic chamber for a microphone in a mobile electronic device |
JP2018510069A (ja) * | 2015-01-20 | 2018-04-12 | Tdk株式会社 | 応力フリーに固定されたmemsデバイスを有するモジュール |
KR101893056B1 (ko) * | 2016-11-15 | 2018-10-04 | 소스트 주식회사 | 멤스 마이크로폰 칩 구조체 및 마이크로폰 패키지 |
EP3654671A1 (en) | 2008-03-19 | 2020-05-20 | NEC Corporation | Communication system, mobile station, base station, response decision method, resource configuration decision method, and program |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8450817B2 (en) * | 2008-08-14 | 2013-05-28 | Knowles Electronics Llc | Microelectromechanical system package with strain relief bridge |
JP2010161271A (ja) * | 2009-01-09 | 2010-07-22 | Panasonic Corp | 半導体パッケージ |
JP6034619B2 (ja) * | 2011-08-22 | 2016-11-30 | パナソニック株式会社 | Mems素子およびそれを用いた電気機器 |
CN103002390A (zh) * | 2011-09-08 | 2013-03-27 | 苏州恒听电子有限公司 | 用于助听器的传声器电磁屏蔽壳 |
DE102012101505B4 (de) * | 2012-02-24 | 2016-03-03 | Epcos Ag | Verfahren zur Herstellung eines Sensors |
US9402118B2 (en) * | 2012-07-27 | 2016-07-26 | Knowles Electronics, Llc | Housing and method to control solder creep on housing |
KR102008374B1 (ko) * | 2012-08-03 | 2019-10-23 | 삼성전자주식회사 | 휴대용 단말기의 입력장치 |
US9521499B2 (en) * | 2013-06-26 | 2016-12-13 | Infineon Technologies Ag | Electronic device with large back volume for electromechanical transducer |
KR102161546B1 (ko) * | 2014-02-05 | 2020-10-05 | 삼성전자 주식회사 | 전자 기기 및 그의 운용 방법 |
KR101703628B1 (ko) * | 2015-09-25 | 2017-02-07 | 현대자동차 주식회사 | 마이크로폰 및 그 제조방법 |
US20170240418A1 (en) * | 2016-02-18 | 2017-08-24 | Knowles Electronics, Llc | Low-cost miniature mems vibration sensor |
CN107426638B (zh) * | 2017-07-06 | 2023-08-25 | 深圳市欢太科技有限公司 | 麦克风组件及具有其的终端 |
US11805342B2 (en) | 2019-09-22 | 2023-10-31 | xMEMS Labs, Inc. | Sound producing package structure and manufacturing method thereof |
US11395073B2 (en) * | 2020-04-18 | 2022-07-19 | xMEMS Labs, Inc. | Sound producing package structure and method for packaging sound producing package structure |
US11252511B2 (en) | 2019-12-27 | 2022-02-15 | xMEMS Labs, Inc. | Package structure and methods of manufacturing sound producing chip, forming package structure and forming sound producing apparatus |
USD910604S1 (en) | 2020-07-22 | 2021-02-16 | Crown Tech Llc | Microphone isolation shield |
USD905022S1 (en) | 2020-07-22 | 2020-12-15 | Crown Tech Llc | Microphone isolation shield |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA1202713A (en) | 1984-03-16 | 1986-04-01 | Beverley W. Gumb | Transmitter assembly for a telephone handset |
JP3113832B2 (ja) | 1997-02-20 | 2000-12-04 | 松下電器産業株式会社 | マイクロホン・ホルダー |
US7023066B2 (en) | 2001-11-20 | 2006-04-04 | Knowles Electronics, Llc. | Silicon microphone |
JP3956356B2 (ja) | 2002-05-20 | 2007-08-08 | シチズン電子株式会社 | マイクロホン |
JP4309643B2 (ja) | 2002-11-29 | 2009-08-05 | 日本特殊陶業株式会社 | セラミック電子部品の製造方法 |
JP4264103B2 (ja) | 2004-03-03 | 2009-05-13 | パナソニック株式会社 | エレクトレットコンデンサーマイクロホン |
JP3926350B2 (ja) | 2004-06-10 | 2007-06-06 | Necアクセステクニカ株式会社 | 携帯端末の前面外装カバー、携帯端末及び携帯電話機 |
JP4483514B2 (ja) | 2004-10-08 | 2010-06-16 | 株式会社村田製作所 | 金属ケース付き電子部品の製造方法および製造装置 |
JP2006211468A (ja) | 2005-01-31 | 2006-08-10 | Sanyo Electric Co Ltd | 半導体センサ |
-
2006
- 2006-09-15 JP JP2006250915A patent/JP4387392B2/ja not_active Expired - Fee Related
-
2007
- 2007-09-13 US US12/160,663 patent/US7904123B2/en active Active
- 2007-09-13 CN CNA2007800041936A patent/CN101379869A/zh active Pending
- 2007-09-13 WO PCT/JP2007/067846 patent/WO2008032785A1/ja active Application Filing
-
2011
- 2011-01-26 US US13/014,340 patent/US20110116661A1/en not_active Abandoned
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3654671A1 (en) | 2008-03-19 | 2020-05-20 | NEC Corporation | Communication system, mobile station, base station, response decision method, resource configuration decision method, and program |
EP4017033A1 (en) | 2008-03-19 | 2022-06-22 | NEC Corporation | Communication system, mobile station, base station, response decision method, resource configuration decision method, and program |
JP2010081192A (ja) * | 2008-09-25 | 2010-04-08 | Rohm Co Ltd | Memsセンサ |
US8823115B2 (en) | 2008-12-12 | 2014-09-02 | Funai Electric Co., Ltd. | Microphone unit and voice input device using same |
WO2010092856A1 (ja) | 2009-02-13 | 2010-08-19 | 船井電機株式会社 | マイクロホンユニット |
US8818010B2 (en) | 2009-02-13 | 2014-08-26 | Funai Electric Co., Ltd. | Microphone unit |
JP2010258720A (ja) * | 2009-04-23 | 2010-11-11 | Murata Mfg Co Ltd | 音響的トランスデューサユニット |
US8918150B2 (en) | 2010-08-06 | 2014-12-23 | Blackberry Limited | Electromagnetic shielding and an acoustic chamber for a microphone in a mobile electronic device |
JP2018510069A (ja) * | 2015-01-20 | 2018-04-12 | Tdk株式会社 | 応力フリーに固定されたmemsデバイスを有するモジュール |
US10351416B2 (en) | 2015-01-20 | 2019-07-16 | Tdk Corporation | Module comprising a MEMS component mounted without subjecting same to stress |
KR101893056B1 (ko) * | 2016-11-15 | 2018-10-04 | 소스트 주식회사 | 멤스 마이크로폰 칩 구조체 및 마이크로폰 패키지 |
Also Published As
Publication number | Publication date |
---|---|
US20100167799A1 (en) | 2010-07-01 |
JP4387392B2 (ja) | 2009-12-16 |
WO2008032785A1 (fr) | 2008-03-20 |
CN101379869A (zh) | 2009-03-04 |
US7904123B2 (en) | 2011-03-08 |
US20110116661A1 (en) | 2011-05-19 |
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