JP4387392B2 - シールドケースおよびこれを有するｍｅｍｓマイクロホン - Google Patents

シールドケースおよびこれを有するｍｅｍｓマイクロホン Download PDF

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Publication number
JP4387392B2
JP4387392B2 JP2006250915A JP2006250915A JP4387392B2 JP 4387392 B2 JP4387392 B2 JP 4387392B2 JP 2006250915 A JP2006250915 A JP 2006250915A JP 2006250915 A JP2006250915 A JP 2006250915A JP 4387392 B2 JP4387392 B2 JP 4387392B2
Authority
JP
Japan
Prior art keywords
top plate
shield case
mems microphone
plate
mems
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006250915A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008072580A5 (enExample
JP2008072580A (ja
Inventor
勝浩 巻幡
教夫 木村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2006250915A priority Critical patent/JP4387392B2/ja
Priority to CNA2007800041936A priority patent/CN101379869A/zh
Priority to US12/160,663 priority patent/US7904123B2/en
Priority to PCT/JP2007/067846 priority patent/WO2008032785A1/ja
Publication of JP2008072580A publication Critical patent/JP2008072580A/ja
Publication of JP2008072580A5 publication Critical patent/JP2008072580A5/ja
Application granted granted Critical
Publication of JP4387392B2 publication Critical patent/JP4387392B2/ja
Priority to US13/014,340 priority patent/US20110116661A1/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0077—Other packages not provided for in groups B81B7/0035 - B81B7/0074
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/01—Electrostatic transducers characterised by the use of electrets
    • H04R19/016—Electrostatic transducers characterised by the use of electrets for microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/163—Connection portion, e.g. seal
    • H01L2924/16315—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
  • Micromachines (AREA)
JP2006250915A 2006-09-15 2006-09-15 シールドケースおよびこれを有するｍｅｍｓマイクロホン Expired - Fee Related JP4387392B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2006250915A JP4387392B2 (ja) 2006-09-15 2006-09-15 シールドケースおよびこれを有するｍｅｍｓマイクロホン
CNA2007800041936A CN101379869A (zh) 2006-09-15 2007-09-13 屏蔽壳和具有屏蔽壳的微机电系统传声器
US12/160,663 US7904123B2 (en) 2006-09-15 2007-09-13 Shield case and MEMS microphone having it
PCT/JP2007/067846 WO2008032785A1 (en) 2006-09-15 2007-09-13 Shield case and mems microphone having the same
US13/014,340 US20110116661A1 (en) 2006-09-15 2011-01-26 Shield case and mems microphone having it

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006250915A JP4387392B2 (ja) 2006-09-15 2006-09-15 シールドケースおよびこれを有するｍｅｍｓマイクロホン

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2009174336A Division JP2009247007A (ja) 2009-07-27 2009-07-27 シールドケースおよびこれを有するｍｅｍｓマイクロホン

Publications (3)

Publication Number Publication Date
JP2008072580A JP2008072580A (ja) 2008-03-27
JP2008072580A5 JP2008072580A5 (enExample) 2009-06-18
JP4387392B2 true JP4387392B2 (ja) 2009-12-16

Family

ID=39183839

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006250915A Expired - Fee Related JP4387392B2 (ja) 2006-09-15 2006-09-15 シールドケースおよびこれを有するｍｅｍｓマイクロホン

Country Status (4)

Country Link
US (2) US7904123B2 (enExample)
JP (1) JP4387392B2 (enExample)
CN (1) CN101379869A (enExample)
WO (1) WO2008032785A1 (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4017033A1 (en) 2008-03-19 2022-06-22 NEC Corporation Communication system, mobile station, base station, response decision method, resource configuration decision method, and program
US8450817B2 (en) * 2008-08-14 2013-05-28 Knowles Electronics Llc Microelectromechanical system package with strain relief bridge
JP2010081192A (ja) * 2008-09-25 2010-04-08 Rohm Co Ltd Ｍｅｍｓセンサ
JP5481852B2 (ja) 2008-12-12 2014-04-23 船井電機株式会社 マイクロホンユニット及びそれを備えた音声入力装置
JP2010161271A (ja) * 2009-01-09 2010-07-22 Panasonic Corp 半導体パッケージ
JP5321111B2 (ja) 2009-02-13 2013-10-23 船井電機株式会社 マイクロホンユニット
JP2010258720A (ja) * 2009-04-23 2010-11-11 Murata Mfg Co Ltd 音響的トランスデューサユニット
US8340735B2 (en) 2010-08-06 2012-12-25 Research In Motion Limited Electromagnetic shielding and an acoustic chamber for a microphone in a mobile electronic device
JP6034619B2 (ja) * 2011-08-22 2016-11-30 パナソニック株式会社 Ｍｅｍｓ素子およびそれを用いた電気機器
CN103002390A (zh) * 2011-09-08 2013-03-27 苏州恒听电子有限公司 用于助听器的传声器电磁屏蔽壳
DE102012101505B4 (de) * 2012-02-24 2016-03-03 Epcos Ag Verfahren zur Herstellung eines Sensors
US9402118B2 (en) * 2012-07-27 2016-07-26 Knowles Electronics, Llc Housing and method to control solder creep on housing
KR102008374B1 (ko) * 2012-08-03 2019-10-23 삼성전자주식회사 휴대용 단말기의 입력장치
US9521499B2 (en) * 2013-06-26 2016-12-13 Infineon Technologies Ag Electronic device with large back volume for electromechanical transducer
KR102161546B1 (ko) * 2014-02-05 2020-10-05 삼성전자 주식회사 전자 기기 및 그의 운용 방법
DE102015100757B3 (de) 2015-01-20 2016-06-16 Epcos Ag Modul mit spannungsfrei befestigtem MEMS-Bauelement
KR101703628B1 (ko) * 2015-09-25 2017-02-07 현대자동차 주식회사 마이크로폰 및 그 제조방법
US20170240418A1 (en) * 2016-02-18 2017-08-24 Knowles Electronics, Llc Low-cost miniature mems vibration sensor
KR101893056B1 (ko) * 2016-11-15 2018-10-04 소스트 주식회사 멤스 마이크로폰 칩 구조체 및 마이크로폰 패키지
CN107426638B (zh) * 2017-07-06 2023-08-25 深圳市欢太科技有限公司 麦克风组件及具有其的终端
US11805342B2 (en) 2019-09-22 2023-10-31 xMEMS Labs, Inc. Sound producing package structure and manufacturing method thereof
US11395073B2 (en) * 2020-04-18 2022-07-19 xMEMS Labs, Inc. Sound producing package structure and method for packaging sound producing package structure
US11252511B2 (en) 2019-12-27 2022-02-15 xMEMS Labs, Inc. Package structure and methods of manufacturing sound producing chip, forming package structure and forming sound producing apparatus
USD905022S1 (en) 2020-07-22 2020-12-15 Crown Tech Llc Microphone isolation shield
USD910604S1 (en) 2020-07-22 2021-02-16 Crown Tech Llc Microphone isolation shield
WO2025039235A1 (zh) * 2023-08-23 2025-02-27 广州视源电子科技股份有限公司 一种交互平板

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CA1202713A (en) 1984-03-16 1986-04-01 Beverley W. Gumb Transmitter assembly for a telephone handset
JP3113832B2 (ja) 1997-02-20 2000-12-04 松下電器産業株式会社 マイクロホン・ホルダー
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JP3956356B2 (ja) 2002-05-20 2007-08-08 シチズン電子株式会社 マイクロホン
JP4309643B2 (ja) 2002-11-29 2009-08-05 日本特殊陶業株式会社 セラミック電子部品の製造方法
WO2005086534A1 (ja) 2004-03-03 2005-09-15 Matsushita Electric Industrial Co., Ltd. エレクトレットコンデンサーマイクロフォンユニット
JP3926350B2 (ja) 2004-06-10 2007-06-06 Ｎｅｃアクセステクニカ株式会社 携帯端末の前面外装カバー、携帯端末及び携帯電話機
JP4483514B2 (ja) 2004-10-08 2010-06-16 株式会社村田製作所 金属ケース付き電子部品の製造方法および製造装置
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Also Published As

Publication number Publication date
US20110116661A1 (en) 2011-05-19
WO2008032785A1 (en) 2008-03-20
CN101379869A (zh) 2009-03-04
US7904123B2 (en) 2011-03-08
US20100167799A1 (en) 2010-07-01
JP2008072580A (ja) 2008-03-27

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