CN104904238A - 外壳及控制外壳上的焊料蠕变的方法 - Google Patents

外壳及控制外壳上的焊料蠕变的方法 Download PDF

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CN104904238A
CN104904238A CN201380039540.4A CN201380039540A CN104904238A CN 104904238 A CN104904238 A CN 104904238A CN 201380039540 A CN201380039540 A CN 201380039540A CN 104904238 A CN104904238 A CN 104904238A
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T·K·林
K·B·弗里尔
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Knowles Electronics LLC
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Abstract

一种声学装置，该声学装置包括：基板、基板盖和多个电声部件。该基板盖被布置在基板上，并且多个电声部件被布置在基板上且在基板盖下面。该基板盖由基体金属构成，并且该基板盖包括部分镀制部。该部分镀制部被设置以防止沿着基板盖的表面的焊料蠕变。

Description

外壳及控制外壳上的焊料蠕变的方法
相关申请的交叉引用
本申请要求35U.S.C.§119(e)下的名称为“Housing and Method to Control SolderCreep on Housing”、于2012年7月27日提交的美国临时申请No.61/676,378的权益，其内容整体上通过引用并入此处。
技术领域
本申请涉及声学装置，并且更具体地，涉及这些装置的外壳。
背景技术
微电机系统(MEMS)装置包括麦克风和扬声器，从而谈及两个示例。在MEMS麦克风的情形中，声能通过声音端口进入并且使隔膜振动。这种活动产生了隔膜和布置在隔膜附近的挡板之间的电势(电压)方面的相应改变。这种电压表示已接收的声能。典型地，该电压然后被传送到电路(例如，诸如专用集成电路(ASIC)的应用的集成电路)。可以由该电路执行该信号的进一步的处理。例如，可以在集成电路对该信号执行放大或滤波功能。
麦克风的内部装置(例如，集成电路，MEMS装置)被布置在外壳或组件内。例如，这些装置可以附接到底座，并且用盖子覆盖。话句话说，由该盖子形成腔，并且内部装置(例如，集成电路，MEMS装置)被布置在该腔内的底座上。
在许多示例中，该盖子利用焊料耦接到声学装置的底座。事实上，该盖子可以通过该装置的内部(在腔内，且暴露于MEMS装置和集成电路)和外部(暴露于外部环境)两者上的焊料耦接到该底座。
为了使该焊料可以耦接到该盖子(并且因此产生到底座的连接)，整个盖子被镀制上金(或者一些其他合适的金属)，并且然后，产生盖子与底座之间的附接。但是，在许多情况中，在产生附接之后，该装置(包括焊料)被重新加热。在这些情形中，该焊料将会融化，并且继续与镀制部互相作用，并且“蠕变”到该盖子或流出。由于这发生在腔体内，一些焊料可能会从盖子流出，并且引起腔内的MEMS装置或集成电路的故障。在盖子外侧上，“蠕变”焊料会继续流出盖子到盖子的表面，并且这将影响麦克风的后续填料(gasketing)。
附图说明
为了更完整的理解本公开，将对以下详细说明和附图进行参考，其中：
图1包括根据本发明不同实施方式的麦克风组件的透视图和分解图；
图2包括根据本发明不同实施方式的麦克风组件的顶视图；
图3包括根据本发明不同实施方式的图1-2的麦克风组件的侧剖视图；
图4包括根据本发明不同实施方式的麦克风组件的侧剖视图；
图5包括根据本发明不同实施方式的图4的组件的透视图。
本领域技术人员应当意识到，为了简明和清楚图示了图中的元素。应当进一步意识到，可以按照事件的特定次序描述或者描绘某些动作和/或步骤，同时本领域技术人员应当理解实际上并不需要这种关于顺序的专一性。还应当理解的是，此处使用的术语和措辞具有与相对于它们查询和研究的相应各自领域的这些术语和措辞一致的普通含义，除非此处另外阐述其具体含义。
具体实施方式
此处介绍的方法控制焊料蠕变或者焊料流过麦克风组件的盖子或者其他位置，在一个示例中，该盖子(或外壳)至少部分地由基体金属(诸如黄铜)构成，并且在此处被称为“金属壳”。该金属可以是仅部分镀制的。通过“镀制”，这意味着另一金属的层或涂层被附接到形成盖子的基体金属的表面。由于不能完全镀制金属壳，所以实现了对可能蠕变或流过金属壳的焊料(或者某一其他传导融合材料)的控制。不想要的结合材料(例如，焊料)被阻止进入想免受这种不想要的结合材料侵害的区域或容积，从而防止损坏麦克风或其他声学装置的内部部件。
此处描述的方法不用经受过程变异性、镀制部的特定厚度、回流曲线及顾客回流工艺。在又一优点中，制造工艺不需要检验焊料蠕变的制造装置，从而降低制造成本。
在另一优点中，还降低了麦克风组件的成本，因为整个金属壳或外壳不需要被镀制(用诸如金之类的贵材料)。这允许减少镀制部的量并允许该壳可以由还具有其他优点属性的更便宜材料构造。举一具体事例，本方法允许所使用的金镀制部的量的减少，并且这便于增大用于盖子的基体材料的不锈钢的用途，因为不需要全部镀制该盖子。一方面，不锈钢相比黄铜具有若干优点。例如，使用不锈钢允许比黄铜形成更“方”的盖子(例如，具有锋利的、界限清楚的角)。还可以存在其他优点。
在这些实施方式的一些中，焊料蠕变被控制到盖子的所需高度，同时还在金属壳和底座(例如，FR4构造的底座)之间提供足够的金属粘合。可以经由在镀制厂房或制造厂执行的自动化工艺实现部分镀制部。
在这些实施方式的一些中，一种声学装置包括基板、基板盖和多个电声部件。该基板盖被布置在基板上，并且多个电声部件被布置在基板上且在基板盖下面。该基板盖由基体金属构成，该基板盖包括部分镀制部。该部分镀制部被设置以防止沿着基板盖的表面的焊料蠕变。
在一些示例中，该基体金属是黄铜。在其他示例中，该基体金属是不锈钢。在一些示例中，该部分镀制部是金。在其他示例中，该部分镀制部是镍。
在一些方面中，该部分镀制部对防止焊料蠕变至基板盖的预定高度是有效的。在其他方面中，该部分镀制部包括盖的区域的大约1/4至1/3。
在一些示例中，该基板盖的表面包括基板盖的内表面。在其他示例中，该基板盖的表面包括基板盖的外表面。
现在，参照图1、2和3，描述了具有选择镀制部的麦克风组件100的一个示例。组件100包括底座101、环氧树脂附件102、环氧树脂附件103、微电机系统(MEMS)装置104、集成电路105、线106、封装107、焊膏108和盖子109。
底座101是在其上安置盖子及其他部件的基板。在一个示例中，底座101由FR-4材料构成。也可使用其他示例的材料。环氧树脂附件102和环氧树脂附件103是黏合剂，其将MEMS装置104和集成电路105附接到底座101。
MEMS装置104接收声能，并且将声能转换成电能。在这方面，MEMS装置104可以包括隔膜和挡板。声能使得隔膜运动，并且这改变了隔膜和挡板之间的电势。产生的电流或电压表示已由MEMS设备104接收的声能。
集成电路105是执行任意种类的处理功能的任意种类的集成电路，在一个示例中，集成电路105是缓冲器或放大器。其他示例的集成电路是可能的。线106是将电部件耦接在一起的连接。
封装107是覆盖集成电路105的材料(例如，硅基环氧树脂(silicone-basedepoxy))。封装107的目的是为集成电路105提供外部保护。
焊膏108是糊状焊料。焊膏的目的是将盖子和底座保持在一起。在一方面中，焊膏在盖子的内部和外部上。其他示例的传导融合材料是可能的。
盖子109是金属盖。盖子109通过焊膏108附接到底座101。盖子109由金属(例如，黄铜或不锈钢)构成。该盖子具有镀制部分120和非镀制部分122。镀制部分120是用金镀制的黄铜底座。在其他示例中，也可以使用镍、钯镍金或者锡镀制部。焊料将在镀制部分120中融化，而且将不会附接到非镀制部分122。该盖子包括端口124，声能通过端口124进入组件100。
在一个示例中，镀制区域(如图中标记尺寸126所示)是金属壳总高度的大约1/4至1/3。金属壳的高度可以根据该壳被放置的封装的高度而改变。在一个示例中，该底座大约高0.35mm，并且总壳的高度大约是1-1.5mm。减小尺寸是可能的。应当理解的是，该方法可以使用顶部端口装置和底部端口装置。
现在，参照图4和5，描述了具有选择镀制部的麦克风组件400的另一示例。组件400包括盖子402和底座404。盖子402形成附接到底座404的金属壳。为了简洁，在图4中未示出金属壳内的内部部件(例如，MEMS装置、集成电路)。
在这个示例中，盖子或壳402是金属盖。盖子402通过焊膏406附接到底座404。盖子402由金属(例如，所提到的两个示例的黄铜或者不锈钢)构成。盖子402包括非镀制部分408和镀制部分410。在一方面中，镀制部分410是用金镀制的黄铜底座。在另一示例中，可以使用镍。焊料将在镀制部分410中融化，而且将不会附接到非镀制部分408。在这个示例中，盖子402包括端口412，其使图4的示例成为顶部端口装置。在其他示例中，该端口位于底部(即，经由底座404)上，其使组件400成为底部端口装置。
由于金属壳402没有被完全镀制，所以实现了对可能蠕变或流过金属壳402的焊料(或者某一其他传导融合材料)的控制。不想要的结合材料(例如，焊料)被阻止进入想免受这种不想要的结合材料侵害的区域或容积，从而防止损坏麦克风或其他声学装置的内部部件。在这个示例中，焊料将不会上升到超过壳上由414标记的线指示的水平线。在一个示例中，镀制区域是金属壳高度的大约1/4至1/3，并且该壳大约1mm高。其他尺寸是可能的。
此处描述了本发明的优选实施方式，包括对用于实现本发明的发明人所熟知的最佳方式。应该理解的是，所图示的实施方式仅是示范性的，并且不应该看作限制本发明的范围。

Claims (18)

1.一种声学装置，该声学装置包括：
基板；
基板盖，该基板盖布置在所述基板上；
多个电声部件，该多个电声部件布置在所述基板上且在所述基板盖下面；
其中，所述基板盖由基体金属构成，并且其中，所述基板盖包括部分镀制部，所述部分镀制部被设置以防止沿着所述基板盖的表面的焊料蠕变。
2.如权利要求1所述的声学装置，其中，所述基体金属是黄铜。
3.如权利要求1所述的声学装置，其中，所述部分镀制部是金。
4.如权利要求1所述的声学装置，其中，所述基体金属是不锈钢。
5.如权利要求1所述的声学装置，其中，所述部分镀制部对防止焊料蠕变至所述基板盖的预定高度是有效的。
6.如权利要求1所述的声学装置，其中，所述部分镀制部包括所述盖的区域的大约1/4至1/3。
7.如权利要求1所述的声学装置，其中，所述部分镀制部是镍。
8.如权利要求1所述的声学装置，其中，所述基板盖的表面包括所述基板盖的内表面。
9.如权利要求1所述的声学装置，其中，所述基板盖的表面包括所述基板盖的外表面。
10.一种用于声学装置的盖，所述盖包括：
基体金属部分；以及
镀制部，该镀制部被部分布置在所述基体金属部分上，所述镀制部被设置以防止沿着所述盖的表面的焊料蠕变；
其中，所述盖被配置以附接到声学装置的基板。
11.如权利要求10所述的盖，其中，所述基体金属是黄铜。
12.如权利要求10所述的盖，其中，所述镀制部是金。
13.如权利要求10所述的盖，其中，所述基体金属是不锈钢。
14.如权利要求10所述的盖，其中，所述镀制部对防止焊料蠕变至所述盖的预定高度是有效的。
15.如权利要求10所述的盖，其中，所述镀制部包括所述盖的区域的大约1/4至1/3。
16.如权利要求10所述的盖，其中，部分镀制部是镍。
17.如权利要求10所述的盖，其中，所述盖的表面包括所述盖的内表面。
18.如权利要求10所述的盖，其中，所述盖的表面包括所述盖的外表面。
CN201380039540.4A 2012-07-27 2013-07-25 外壳及控制外壳上的焊料蠕变的方法 Pending CN104904238A (zh)

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