WO2017012122A1 - 硅麦克风装置及使用其的电子设备 - Google Patents

硅麦克风装置及使用其的电子设备 Download PDF

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Publication number
WO2017012122A1
WO2017012122A1 PCT/CN2015/084955 CN2015084955W WO2017012122A1 WO 2017012122 A1 WO2017012122 A1 WO 2017012122A1 CN 2015084955 W CN2015084955 W CN 2015084955W WO 2017012122 A1 WO2017012122 A1 WO 2017012122A1
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silicon
circuit board
printed circuit
substrate
silicon microphone
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PCT/CN2015/084955
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English (en)
French (fr)
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任艳辉
邱志强
张铁男
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华为技术有限公司
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Priority to PCT/CN2015/084955 priority Critical patent/WO2017012122A1/zh
Priority to CN201580036648.7A priority patent/CN107211224A/zh
Publication of WO2017012122A1 publication Critical patent/WO2017012122A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones

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  • the present invention relates to the field of communication devices, and in particular, to a silicon microphone device having a protection unit and an electronic device using the same.
  • silicon microphone integrates the main advantages of Micro-Electro-Mechanical System (MEMS). It is widely used due to its good consistency, stability and excellent anti-interference performance. In electronic products such as smartphones, computers, headphones, digital cameras.
  • MEMS Micro-Electro-Mechanical System
  • the thickness of the silicon diaphragm of the silicon MEMS chip used in the silicon microphone is extremely thin, generally not exceeding 1 um. When the microphone is blown by strong air currents or dust, the diaphragm is easily damaged and the silicon microphone is silent.
  • Embodiments of the present invention provide an improved silicon microphone device and an electronic device to implement a protective function of a silicon microphone device.
  • the present invention provides a silicon microphone device, the device comprising:
  • a silicon microphone body comprising: a printed circuit board, a housing, and a silicon MEMS MEMS chip housed in the cavity formed by the printed circuit board and the outer casing; the printed circuit board having the a first hole corresponding to the diaphragm of the silicon MEMS chip;
  • the shielding unit disposed on a surface of the printed circuit board located in the cavity, the shielding unit being a sheet unit having a microporous structure or a mesh structure, the microporous structure or the mesh structure covering the substrate Said first hole.
  • the protection unit is a high temperature resistant material.
  • the present invention provides an electronic device comprising: a substrate and a silicon microphone device according to any of the first aspect and the first possible implementation of the first aspect;
  • the silicon microphone body is located on a first surface of the substrate, and the substrate has a second hole corresponding to the diaphragm of the silicon MEMS chip, and the first hole and the second hole form a through sound hole.
  • the present invention provides an electronic device, the electronic device comprising:
  • a silicon microphone device comprising: a printed circuit board, a housing, and a silicon MEMS MEMS chip housed in the cavity formed by the printed circuit board and the outer casing; the printed circuit board having the a first hole corresponding to the diaphragm of the silicon MEMS chip;
  • the silicon microphone device being located on a first surface of the substrate;
  • the substrate having a second hole corresponding to the diaphragm of the silicon MEMS chip, the first hole Forming a through sound hole with the second hole;
  • the protection unit is disposed on the second surface, and the protection unit is a sheet unit having a microporous structure or a mesh structure, the microporous structure or a mesh structure covering the sound hole.
  • the protection unit is fixedly connected to the substrate to form a substrate having a protection unit, so that the silicon microphone device directly has the protection unit The substrate is connected.
  • the protection unit is a metal material or a semiconductor material.
  • the silicon microphone device provided by the embodiment of the invention has a protection unit and has the functions of dustproof and blow prevention.
  • FIG. 1 is a schematic structural view of a silicon microphone device according to Embodiment 1 of the present invention.
  • FIG. 2 is a schematic diagram showing a connection relationship of a silicon microphone device in an electronic device according to Embodiment 1 of the present invention
  • FIG. 3 is a schematic diagram showing a connection relationship of a silicon microphone device in an electronic device according to Embodiment 3 of the present invention.
  • the silicon microphone device includes: a silicon microphone body 1 and a protection unit 2.
  • the silicon microphone body 1 includes a printed circuit board 11, a casing 12, and a silicon MEMS chip 13, which is housed in a cavity formed by the printed circuit board 11 and the casing 12.
  • the printed circuit board 11 has a first hole 111 corresponding to the diaphragm of the silicon MEMS chip 13.
  • the silicon MEMS chip 13 is fixed on the surface of the printed circuit board 11 located in the cavity; the silicon microphone body 1 further includes an Application Specific Integrated Circuit (ASIC) chip 15 , and the ASIC chip 15 is fixed on the printed circuit.
  • the circuit board 11 is located on the surface of the cavity and is electrically connected to the silicon MEMS chip 13 by a semiconductor bond alloy wire.
  • the printed circuit board 11 and the outer casing 12 are fixed together by soldering, and form a cavity for accommodating electronic components such as the silicon MEMS chip 13 and the ASIC chip 15.
  • the protection unit 2 is disposed between the silicon MEMS chip 13 and the printed circuit board 11. Specifically, the protection unit 2 is fixed to the cavity of the printed circuit board 11 by soldering or fixing adhesive bonding or the like. On the surface, the silicon MEMS chip 13 is fixed on the protection unit 2 by soldering or fixing adhesive bonding or the like.
  • the protection unit 2 is specifically a sheet-like unit having a microporous structure or a mesh structure, and the microporous structure or the mesh structure covers the first hole 111. The impact of the large airflow on the silicon MEMS chip 13 through the sound hole is prevented, and at the same time, the foreign matter is prevented from entering the cavity, and the dust is prevented from being blown.
  • the entire protection unit may have a microporous structure or a mesh structure, or may have a microporous structure or a mesh structure only at a relative position of the first hole 111.
  • the material of the protection unit 2 in the embodiment of the present invention may be a high temperature resistant material, for example, a steel sheet, an aluminum alloy sheet or a silicon wafer or the like. Since the protection unit 2 is disposed inside the silicon microphone device, the internal electronic components generate heat during use, and therefore, the present embodiment is preferably a high temperature resistant material.
  • the silicon microphone device of the embodiment of the present invention can effectively protect the silicon diaphragm by providing a protection unit inside the silicon microphone device, which has the functions of dustproof and blow protection.
  • the silicon microphone device has its own protection unit, when the silicon microphone device is assembled to the electronic device, as long as the silicon microphone device and the substrate are mounted, the protection unit for protecting the silicon diaphragm can be provided, and it is not necessary to separately install the protective film.
  • the link simplifies the assembly process and improves production efficiency.
  • Embodiments of the present invention relate to an electronic device having a substrate, and the silicon microphone device of the first embodiment.
  • the electronic device in the embodiment of the present invention may be a mobile phone, a PDA (personal digital assistant), a tablet computer, etc., which is not limited in this embodiment.
  • the electronic device has a substrate 3, and the silicon microphone device is connected to the electronic device through the substrate 3, specifically, the silicon microphone device is located on the first surface 3a of the substrate 3.
  • the substrate 3 has a second hole 31 corresponding to the diaphragm of the silicon MEMS chip 13, and the first hole 111 and the second hole 31 constitute a sound hole 14 penetrating therethrough.
  • FIG. 2 only refers to the substrate 3 related to the arrangement of the silicon microphone device, but the electronic device further includes other parts not shown. Parts, such as display devices, input and output devices, control units, etc., are not described herein.
  • the electronic device of the embodiment of the invention has a silicon microphone device with a guard unit.
  • the silicon microphone device has the functions of dustproof and blow-proof, which can effectively protect the silicon diaphragm and protect the performance of the electronic device microphone.
  • the silicon microphone device has its own protection unit, when the silicon microphone device is assembled to the electronic device, as long as the silicon microphone device and the substrate are mounted, the protection unit for protecting the silicon diaphragm can be provided, and it is not necessary to separately install the protective film.
  • the link simplifies the assembly process and improves production efficiency.
  • Embodiments of the present invention relate to an electronic device including a silicon microphone device, a substrate, and a guard unit.
  • the electronic device in the embodiment of the present invention may be a mobile phone, a PDA (personal digital assistant), a tablet computer, etc., which is not limited in this embodiment.
  • the silicon microphone device and the protection unit 2 are connected to the electronic device through the substrate 3. Specifically, the silicon microphone device is disposed on the first surface 3a of the substrate 3, and the shielding unit 2 is disposed on the second surface of the substrate 3. On the surface 3b.
  • the silicon microphone device includes a printed circuit board 11, a casing 12, and a silicon MEMS chip 13, which is housed in a cavity formed by the printed circuit board 11 and the casing 12.
  • the printed circuit board 11 has a first hole 111 corresponding to the diaphragm of the silicon MEMS chip 13.
  • the silicon MEMS chip 13 is fixed on the surface of the printed circuit board 11 located in the cavity; the silicon microphone body 1 may further include an integrated circuit ASIC chip 15 fixed in the cavity of the printed circuit board 11 On the surface, and electrically connected to the silicon MEMS chip 13 through a semiconductor bond alloy wire.
  • the printed circuit board 11 and the outer casing 12 are fixed together by soldering, and form a cavity for accommodating electronic components such as the silicon MEMS chip 13 and the ASIC chip 15.
  • the substrate 3 has a first surface 3a and a second surface 3b.
  • the silicon microphone device is located on the first surface 3a of the substrate 3.
  • the substrate 3 has a second hole 31 corresponding to the diaphragm of the silicon MEMS chip 13, the first hole 111 and the second hole 31 constitute a sound hole 14 that penetrates.
  • the protection unit 2 is disposed on the second surface 3b of the substrate 3.
  • the protection unit 2 is specifically micro A sheet-like unit of a pore structure or a network structure, the microporous structure or the network structure covering the sound hole 14. The impact of the large airflow on the silicon MEMS chip 13 through the sound hole is prevented, and at the same time, foreign matter is prevented from entering the cavity, and the dust is prevented from being blown.
  • the protection unit 2 is fixedly connected to the substrate 3, and can form a substrate with a protection unit, so as to be assembled with the silicon microphone device as a whole, as long as the two are installed, the protection unit for protecting the silicon diaphragm can be provided, and there is no need to have a separate
  • the process of installing the protective film simplifies the assembly process and improves the production efficiency.
  • the entire sheet-like unit may have a microporous structure or a mesh structure, or may have a microporous structure or a mesh structure only at the relative positions of the acoustic holes 14.
  • the guard unit 2 may be a metal material or a semiconductor material, for example, a steel sheet with micro-laser holes is used as the guard unit 2. Since the protection unit 2 is disposed on the second surface of the substrate, preferably a metal material or a semiconductor material, it is advantageous to achieve automatic production by soldering.
  • the electronic device in this embodiment has a protection unit covering the sound hole to prevent the silicon microphone from being subjected to the impact of a large airflow and foreign matter such as dust, thereby effectively protecting the silicon diaphragm and thereby protecting the performance of the electronic device microphone.
  • the protection unit is connected to the second surface of the substrate, and the substrate provided with the protection unit is integrally assembled with the silicon microphone device. As long as the two are installed, the protection unit for protecting the silicon diaphragm can be provided. The separate mounting of the protective film simplifies the assembly process and increases production efficiency.
  • the silicon MEMS chip 13 transmits the received audio signal to the ASIC chip 15, and the ASIC chip 15 converts and amplifies the high-resistance audio signal into a low-resistance audio signal, and simultaneously passes through the anti-noise circuit. Filtering, outputting electrical signals, and realizing the conversion of acoustic signals to electrical signals. The recognition of the sound is achieved by reading the electrical signal.
  • the ASIC chip 15 is only an example, and is not limited thereto in practical applications.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Micromachines (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)

Abstract

本发明实施例涉及一种硅麦克风装置，该装置包括硅麦克风本体和防护单元；硅麦克风本体包括：印制电路板、外壳以及容置于印制电路板和外壳形成的腔体中的硅微机电系统MEMS芯片；印制电路板上具有与硅MEMS芯片的振膜相对应的第一孔；防护单元，设置于印制电路板的位于腔体内的表面上，防护单元为具有微孔结构或网状结构的片状单元，微孔结构或网状结构覆盖第一孔。该装置中的防护单元具有防尘、防吹击的作用；同时，在装配过程中无需具有单独安装保护膜的环节，简化了装配工序，提高了生产效率。

Description

硅麦克风装置及使用其的电子设备 技术领域
本发明涉及通讯设备领域，尤其涉及一种具有防护单元的硅麦克风装置及使用其的电子设备。
背景技术
硅麦克风作为微电子机械系统中的重要成员，集成了微机电系统(Micro-Electro-Mechanical System，MEMS)的主要优点，由于其良好的一致性、稳定性、优秀的抗干扰性能，被广泛应用于智能手机、电脑、耳机、数码相机等电子产品中。但是硅麦克风所用的硅MEMS芯片的硅振膜厚度极薄，一般不超过1um。当麦克风受到强气流吹击或者粉尘污染的时候，振膜极易受到损坏导致硅麦克风无声故障。
因此，如何保护硅振膜成为亟待解决的问题。
发明内容
本发明实施例提供了一种改进的硅麦克风装置及电子设备，以实现硅麦克风装置的防护功能。
第一方面，本发明提供了一种硅麦克风装置，该装置包括：
硅麦克风本体，包括：印制电路板、外壳以及容置于所述印制电路板和所述外壳形成的腔体中的硅微机电系统MEMS芯片；所述印制电路板上具有与所述硅MEMS芯片的振膜相对应的第一孔；
防护单元，设置于所述印制电路板的位于腔体内的表面上，所述防护单元为具有微孔结构或网状结构的片状单元，所述微孔结构或网状结构覆盖所 述第一孔。
结合第一方面，在第一种可能的实现方式中，所述防护单元为耐高温材料。
第二方面，本发明提供了电子设备，该电子设备包括：基板与第一方面和第一方面的第一种可能实现方式的任一项所述的硅麦克风装置；
所述硅麦克风本体位于所述基板的第一表面，所述基板上具有与所述硅MEMS芯片的振膜相对应的第二孔，所述第一孔与所述第二孔构成贯通的声孔。
第三方面，本发明提供了电子设备，该电子设备包括：
硅麦克风装置，包括：印制电路板、外壳以及容置于所述印制电路板和所述外壳形成的腔体中的硅微机电系统MEMS芯片；所述印制电路板上具有与所述硅MEMS芯片的振膜相对应的第一孔；
基板，具有第一表面和第二表面，所述硅麦克风装置位于基板的第一表面上；所述基板上具有与所述硅MEMS芯片的振膜相对应的第二孔，所述第一孔与所述第二孔构成贯通的声孔；
防护单元，所述防护单元设置于所述第二表面上，所述防护单元为具有微孔结构或网状结构的片状单元，所述微孔结构或网状结构覆盖所述声孔。
结合第三方面的实现方式，在第一种可能的实现方式中，所述防护单元与所述基板固定连接，构成具有防护单元的基板，以便于所述硅麦克风装置直接与所述具有防护单元的基板连接。
结合第三方面的实现方式，在第二种可能的实现方式中，所述防护单元为金属材料或半导体材料。
本发明实施例提供的硅麦克风装置，具有防护单元，具有防尘、防吹击的作用。
附图说明
图1为本发明实施例一的硅麦克风装置的结构示意图；
图2为本发明实施例一的硅麦克风装置在电子设备中的连接关系示意图；
图3为本发明实施例三的硅麦克风装置在电子设备中的连接关系示意图。
具体实施方式
下面通过附图和实施例，对本发明的技术方案做进一步的详细描述。
为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
为便于对本发明实施例的理解，下面将结合附图以具体实施例做进一步的解释说明，实施例并不构成对本发明实施例的限定。
实施例一
图1为本发明实施例一的硅麦克风装置的结构示意图，如图所示，硅麦克风装置包括：硅麦克风本体1和防护单元2。
硅麦克风本体1包括：印制电路板11、外壳12以及硅MEMS芯片13，硅MEMS芯片13容置于印制电路板11和外壳12形成的腔体中。印制电路板11上具有与硅MEMS芯片13的振膜相对应的第一孔111。
具体地，硅MEMS芯片13固定在印制电路板11的位于腔体内的表面上；硅麦克风本体1中还包括专用集成电路(Application Specific Integrated Circuit，ASIC)芯片15，ASIC芯片15固定在印制电路板11的位于腔体内的表面上，且与硅MEMS芯片13通过半导体键合金线进行电连接。印制电路板11与外壳12通过焊接固定在一起，并形成腔体，该腔体用于容置硅MEMS芯片13和ASIC芯片15等电子元器件。
防护单元2，设置于硅MEMS芯片13与印制电路板11之间。具体地，防护单元2通过焊接或者固定胶粘结等方式固定在印制电路板11的位于腔体内 的表面上，硅MEMS芯片13通过焊接或者固定胶粘结等方式固定在防护单元2上。
防护单元2具体为具有微孔结构或网状结构的片状单元，该微孔结构或网状结构覆盖第一孔111。防止大气流通过声孔对硅MEMS芯片13的冲击，同时防止异物进入腔体，起到防尘、防吹击的作用。
需要进一步说明的，在防护单元2中，可以整个防护单元都具有微孔结构或网状结构，也可以仅仅在第一孔111的相对位置处具有微孔结构或网状结构。
优选地，本发明实施例中的防护单元2的材料可以为耐高温材料，例如，钢片、铝合金片或者是硅片等。由于防护单元2设置于硅麦克风装置内部，内部的电子元件在使用过程中会发热，因此，本实施例优选耐高温材料。
本发明实施例的硅麦克风装置，通过在硅麦克风装置的内部设置有防护单元，具有防尘、防吹击的作用，可以有效保护硅振膜。
进一步的，因为硅麦克风装置自带防护单元，在硅麦克风装置组装到电子设备上时，只要硅麦克风装置与基板安装好，即可具备保护硅振膜的防护单元，无需具有单独安装保护膜的环节，简化了装配工序，提高了生产效率。
实施例二
本发明实施例涉及一电子设备，该电子设备具有基板，和前述实施例一中的硅麦克风装置。本发明实施例中的电子设备可以为手机，PDA(personal digital assistant)，平板电脑等，本实施例不做限定。
如图2所示，电子设备具有基板3，硅麦克风装置通过基板3连接在与电子设备内，具体地，硅麦克风装置位于基板3的第一表面3a上。基板3上具有与硅MEMS芯片13的振膜相对应的第二孔31，第一孔111与第二孔31构成贯通的声孔14。
本领域技术人员可以理解，本发明实施例为了方便理解，图2中仅涉及与硅麦克风装置的设置有关的基板3，但是电子设备还包括其他未图示的部 件，比如显示装置，输入输出装置，控制单元等等，在此不再赘述。
本发明实施例的电子设备，具有带防护单元的硅麦克风装置。该硅麦克风装置具有防尘、防吹击的功能，可以有效保护硅振膜，进而保护电子设备麦克风的性能。
进一步地，因为硅麦克风装置自带防护单元，在硅麦克风装置组装到电子设备上时，只要硅麦克风装置与基板安装好，即可具备保护硅振膜的防护单元，无需具有单独安装保护膜的环节，简化了装配工序，提高了生产效率。
实施例三
本发明实施例涉及一电子设备，该电子设备包括硅麦克风装置、基板和防护单元。本发明实施例中的电子设备可以为手机，PDA(personal digital assistant)，平板电脑等，本实施例不做限定。
如图3所示，硅麦克风装置和防护单元2通过基板3连接在与电子设备内，具体地，硅麦克风装置设置于基板3的第一表面3a上，防护单元2设置于基板3的第二表面3b上。
硅麦克风装置，包括印制电路板11、外壳12以及硅MEMS芯片13，硅MEMS芯片13容置于印制电路板11和外壳12形成的腔体中。印制电路板11上具有与硅MEMS芯片13的振膜相对应的第一孔111。
具体地，硅MEMS芯片13固定在印制电路板11的位于腔体内的表面上；硅麦克风本体1中还可以包括集成电路ASIC芯片15，ASIC芯片15固定在印制电路板11的位于腔体内的表面上，且与硅MEMS芯片13通过半导体键合金线进行电连接。印制电路板11与外壳12通过焊接固定在一起，并形成腔体，该腔体用于容置硅MEMS芯片13和ASIC芯片15等电子元器件。
基板3，具有第一表面3a和第二表面3b，硅麦克风装置位于基板3的第一表面3a上，基板3上具有与硅MEMS芯片13的振膜相对应的第二孔31，第一孔111与第二孔31构成贯通的声孔14。
防护单元2，设置于基板3的第二表面3b上。防护单元2具体为具有微 孔结构或网状结构的片状单元，该微孔结构或网状结构覆盖声孔14。防止大气流通过声孔对硅MEMS芯片13的冲击，同时，防止异物进入腔体，起到防尘、防吹击的作用。
优选地，防护单元2与基板3固定连接，可以构成具有防护单元的基板，从而作为整体与硅麦克风装置进行装配，只要两者安装好，即可具备保护硅振膜的防护单元，无需具有单独安装保护膜的环节，简化了装配工序，提高了生产效率。
需要进一步说明的，在防护单元2中，可以整个片状单元都具有微孔结构或网状结构，也可以仅仅在声孔14的相对位置处具有微孔结构或网状结构。
优选地，防护单元2可以为金属材料或者半导体材料，例如，使用带微激光孔的钢片作为防护单元2。由于防护单元2设置于基板的第二表面上，优选金属材料或者半导体材料，有利于通过焊接固定，实现自动化生产。
本实施例中的电子设备，具有防护单元，覆盖在声孔上，防止硅麦克风受到大气流的冲击，以及灰尘等异物的侵入，可以有效保护硅振膜，进而保护电子设备麦克风的性能。
进一步地，将防护单元连接于基板的第二表面上，再将设置有防护单元的基板作为整体与硅麦克风装置进行装配，只要两者安装好，即可具备保护硅振膜的防护单元，无需具有单独安装保护膜的环节，简化了装配工序，提高了生产效率。
在硅麦克风装置的具体工作过程中，硅MEMS芯片13将接收到的音频信号传输给ASIC芯片15，ASIC芯片15将高阻的音频信号转换并放大成低阻的音频信号，同时经抗噪电路滤波，输出电信号，实现声信号向电信号的转换。通过对电信号的读取，从而实现对声音的识别。其中ASIC芯片15仅作为示例，在实际应用中并不限制于此。
以上所述的具体实施方式，对本发明的目的、技术方案和有益效果进行了进一步详细说明，所应理解的是，以上所述仅为本发明的具体实施方式而 已，并不用于限定本发明的保护范围，凡在本发明的精神和原则之内，所做的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。

Claims (6)

  1. 一种硅麦克风装置，其特征在于，所述装置包括：
    硅麦克风本体，包括：印制电路板、外壳以及容置于所述印制电路板和所述外壳形成的腔体中的硅微机电系统MEMS芯片；所述印制电路板上具有与所述硅MEMS芯片的振膜相对应的第一孔；
    防护单元，设置于所述印制电路板的位于腔体内的表面上，所述防护单元为具有微孔结构或网状结构的片状单元，所述微孔结构或网状结构覆盖所述第一孔。
  2. 根据权利要求1所述的硅麦克风装置，其特征在于，所述防护单元由耐高温材料制成。
  3. 一种电子设备，其特征在于，所述电子设备包括：基板和权利要求1-2任一项所述的硅麦克风装置；
    所述硅麦克风本体位于所述基板的第一表面，所述基板上具有与所述硅MEMS芯片的振膜相对应的第二孔，所述第一孔与所述第二孔构成贯通的声孔。
  4. 一种电子设备，其特征在于，所述电子设备包括：
    硅麦克风装置，包括：印制电路板、外壳以及容置于所述印制电路板和所述外壳形成的腔体中的硅微机电系统MEMS芯片；所述印制电路板上具有与所述硅MEMS芯片的振膜相对应的第一孔；
    基板，具有第一表面和第二表面，所述硅麦克风装置位于基板的第一表面上；所述基板上具有与所述硅MEMS芯片的振膜相对应的第二孔，所述第一孔与所述第二孔构成贯通的声孔；
    防护单元，所述防护单元设置于所述第二表面上，所述防护单元为具有微孔结构或网状结构的片状单元，所述微孔结构或网状结构覆盖所述声孔。
  5. 根据权利要求4所述的电子设备，其特征在于，所述防护单元与所述基板固定连接，构成具有防护单元的基板，以便于所述硅麦克风装置直接与所述具有防护单元的基板连接。
  6. 根据权利要求4所述的电子设备，其特征在于，所述防护单元由金属材料或半导体材料制成。
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WO2019060599A1 (en) * 2017-09-21 2019-03-28 Knowles Electronics, Llc MEMS DEVICE RAISED IN A MICROPHONE WITH INPUT PROTECTION
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CN115767989A (zh) * 2022-11-21 2023-03-07 无锡美科微电子技术有限公司 芯片驱动模组和电子装置
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