WO2021135111A1 - 用于mems器件的防尘结构及mems麦克风封装结构 - Google Patents

用于mems器件的防尘结构及mems麦克风封装结构 Download PDF

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WO2021135111A1
WO2021135111A1 PCT/CN2020/099149 CN2020099149W WO2021135111A1 WO 2021135111 A1 WO2021135111 A1 WO 2021135111A1 CN 2020099149 W CN2020099149 W CN 2020099149W WO 2021135111 A1 WO2021135111 A1 WO 2021135111A1
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carrier layer
carrier
thermal expansion
dust
mesh
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PCT/CN2020/099149
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English (en)
French (fr)
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林育菁
宫岛博志
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潍坊歌尔微电子有限公司
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Publication of WO2021135111A1 publication Critical patent/WO2021135111A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use

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  • the invention belongs to the technical field of acoustic-electric conversion, and specifically relates to a dustproof structure for MEMS devices and a MEMS microphone packaging structure.
  • microphones are one of the most important devices in electroacoustic products.
  • microphones have been widely used in many different types of electronic products such as mobile phones, tablet computers, notebook computers, VR devices, AR devices, and smart wearables.
  • the design of the microphone packaging structure has become the focus and focus of research by those skilled in the art.
  • the existing microphone packaging structure usually includes a housing with a accommodating cavity in which components such as chip components (for example, MEMS chips and ASIC chips) are housed and fixed; and a sound pickup hole is also provided on the housing. Therefore, in long-term applications, it has been found that external dust, impurities and other particles and foreign objects are easily introduced into the microphone cavity through the pickup hole. These external particles and foreign objects can affect the chip components and other elements in the cavity. The device causes a certain amount of damage, and will eventually affect the acoustic performance and service life of the microphone.
  • chip components for example, MEMS chips and ASIC chips
  • the existing isolation assembly generally includes a support portion and an isolation mesh.
  • the isolation assembly is installed on the sound pickup hole.
  • a certain internal stress difference may occur at the connection position of the two; especially the support in the prior art
  • the part only has a single-layer structure.
  • the thermal expansion coefficients of the support part and the insulating mesh even the thermal expansion coefficients of the two may differ greatly, so the deformation after heating will be greatly different.
  • the above factors will cause warping and deformation of the omentum on the isolation mesh, which cannot guarantee that the omentum is in a flat state, and this will further reduce the quality of the product, and even affect the air flow at the omentum.
  • An object of the present invention is to provide a dustproof structure for MEMS devices and a MEMS microphone packaging structure.
  • a dust-proof structure for a MEMS device which is characterized in that it comprises:
  • a grid membrane the grid membrane has a fixed connection area and a sound-transmitting area, the fixed connection area surrounds the sound-transmitting area, and the fixed connection area is located at the edge of the grid film;
  • a carrier the carrier has a through opening, the opening corresponds to the position of the sound-transmitting area, the carrier includes at least two carrier layers, and the first carrier layer in the carrier layer is connected to the fixed connection On one side of the zone, the other layers of the carrier layer are sequentially stacked along the thickness direction of the mesh film and distributed on the side of the first carrier layer away from the mesh membrane.
  • the thermal expansion of each layer of the carrier layer The coefficients are different.
  • the thermal expansion coefficient of the mesh film is smaller than the thermal expansion coefficient of the first carrier layer, and the thermal expansion coefficients of the carrier layers of each layer decrease in a direction away from the mesh film.
  • the thermal expansion coefficient of the grid film is greater than the thermal expansion coefficient of the first carrier layer, and the thermal expansion coefficients of the carrier layers of each layer increase in a direction away from the grid film.
  • the grid film is an isolation net made of metal as a substrate.
  • At least one of the carrier layers is made of inorganic non-metallic materials or organic materials.
  • the carrier is configured to be fixed on the mesh film in advance, and the opening is formed by an etching process.
  • the orthographic projection shapes of the first carrier layer and at least another carrier layer on the mesh film are different, and the first carrier layer and the other carrier layer are configured to be used twice The etching process is formed separately.
  • the carrier includes two carrier layers, a first carrier layer and a second carrier layer, respectively, and the thermal expansion coefficient of the first carrier layer is greater than the thermal expansion coefficient of the second carrier layer;
  • the carrier includes three carrier layers, a first carrier layer, a second carrier layer, and a third carrier layer, the second carrier layer is located between the first carrier layer and the third carrier layer, so The thermal expansion coefficient of the first carrier layer is greater than the thermal expansion coefficient of the second carrier layer, and the thermal expansion coefficient of the second carrier layer is greater than the thermal expansion coefficient of the third carrier layer.
  • the thickness of the first carrier layer and at least another carrier layer are different.
  • a MEMS microphone packaging structure which includes:
  • a housing with a accommodating cavity the housing is provided with a sound hole, and the sound hole communicates the inside and the outside of the housing;
  • a microphone device the microphone device is fixedly arranged in the housing;
  • the carrier layer of the carrier far from the grid film and the shell are fixedly connected through a high-temperature adhesive curing process
  • the mesh film closes the sound hole; and/or, the mesh film is spaced between the sound hole and the microphone device.
  • a technical effect of the present invention is that the dust-proof structure for MEMS devices provided by the embodiments of the present invention, because the carrier includes at least two carrier layers, and the thermal expansion coefficient of each carrier layer is different, it can effectively slow down heating.
  • the stress after cooling prevents large warping and deformation of the mesh membrane, and ensures that the sound-transmitting area of the mesh membrane is basically in a flat state, which is conducive to the smooth flow of air here and will not affect the movement of the airflow. Adverse effects.
  • FIG. 1 is a first schematic diagram of a dust-proof structure for MEMS devices according to an embodiment of the present invention
  • FIG. 2 is a second schematic diagram of a dust-proof structure for MEMS devices provided by an embodiment of the present invention.
  • FIG. 3 is a first schematic diagram of a MEMS microphone packaging structure provided by an embodiment of the present invention.
  • FIG. 4 is a second schematic diagram of a MEMS microphone packaging structure provided by an embodiment of the present invention.
  • FIG. 5 is a third schematic diagram of a MEMS microphone packaging structure provided by an embodiment of the present invention.
  • FIG. 6 is a fourth schematic diagram of a MEMS microphone packaging structure provided by an embodiment of the present invention.
  • FIG. 7 is a fifth schematic diagram of a MEMS microphone packaging structure provided by an embodiment of the present invention.
  • any specific value should be construed as merely exemplary and not as a limitation. Therefore, other examples of the exemplary embodiment may have different values.
  • the embodiments of the present invention provide a dust-proof structure for MEMS devices, which includes a mesh membrane 1 and a carrier 2.
  • the mesh membrane 1 has a fixed connection area 11 and a sound-transmitting area. Area 12, the fixed connection area 11 surrounds the sound-transmitting area 12, the fixed connection area 11 is located at the edge of the mesh membrane 1; the carrier 2 has a through opening 21, the opening 21 and The position of the sound-transmitting area 12 corresponds to the position of the sound-transmitting area 12, the carrier 2 includes at least two carrier layers, the first carrier layer 22 of the carrier layer is connected to one side of the fixed connection area 11, and the other layers are The carrier layer is sequentially stacked and distributed along the thickness direction of the mesh film 1 on the side of the first carrier layer 22 away from the mesh diaphragm, and the thermal expansion coefficients of the carrier layers of each layer are different.
  • the dust-proof structure When the dust-proof structure is installed in the MEMS microphone packaging structure, for example, it is installed on the PCB board in the MEMS microphone packaging structure.
  • the carrier 2 When the carrier 2 has only a single-layer structure, the carrier 2 has only a single thermal expansion coefficient. Not only is it very likely that the thermal expansion coefficient of the fixed connection area 11 of the mesh film 1 is very different, but also may be very different from the thermal expansion coefficient of the PCB board. In this way, the dust-proof structure and the PCB board are passed through the thermal curing adhesive. When combining, the deformation between the carrier 2 and the mesh film 1 and between the carrier 2 and the PCB board will have a large difference.
  • the carrier 2 and the mesh film 1 and the carrier 2 and the PCB board will constrain each other to generate stress, which will prevent the mesh film 1 from returning to its original size, so that the mesh film 1 will undergo greater warpage and deformation, which cannot ensure that the mesh film is in a flat state.
  • the carrier 2 since the carrier 2 includes at least two carrier layers, and the thermal expansion coefficients of the carrier layers of each layer are different, that is, the distance from the mesh film 1 to the PCB board is different.
  • the carrier layers with different thermal expansion coefficients are used for transition connection, which can effectively slow down the stress after heating and cooling, prevent the mesh film 1 from being warped and deformed, and ensure that the sound-transmitting area 12 of the mesh film 1 is basically flat This is conducive to the smooth flow of air here, and will not adversely affect the movement of the airflow.
  • the coefficient of thermal expansion of the mesh film 1 is smaller than the coefficient of thermal expansion of the first carrier layer 22, and the coefficient of thermal expansion of each layer of the carrier layer is along a direction away from the mesh film 1, in order Decrease.
  • the coefficient of thermal expansion of the first carrier layer 22 is the largest.
  • the coefficient of thermal expansion of the first carrier layer 22 is not only greater than that of the mesh film 1, and the coefficient of thermal expansion of the first carrier layer 22 is also greater than that of the remaining carrier layers.
  • the thermal expansion coefficient of each carrier layer gradually decreases along the direction away from the mesh film 1. This can effectively alleviate the stress between the carrier 2 and the mesh film 1 and between the carrier 2 and the PCB board after thermal expansion and temperature cooling, so as to basically ensure that the sound-transmitting area 12 maintains a flat state and avoids the sound-transmitting area 12 Warpage deformation occurs.
  • the thermal expansion coefficient of the mesh film 1 is greater than the thermal expansion coefficient of the first carrier layer 22, and the thermal expansion coefficients of the carrier layers of each layer are along a direction away from the mesh film 1, in order Increase.
  • the coefficient of thermal expansion of the first carrier layer 22 is the smallest.
  • the coefficient of thermal expansion of the first carrier layer 22 is not only smaller than the coefficient of thermal expansion of the mesh film 1, and the coefficient of thermal expansion of the first carrier layer 22 is also smaller than that of the remaining carrier layers.
  • the thermal expansion coefficient of each carrier layer gradually increases along the direction away from the mesh film 1. This can effectively alleviate the stress between the carrier 2 and the mesh film 1 and between the carrier 2 and the PCB board after thermal expansion and temperature cooling, so as to basically ensure that the sound-transmitting area 12 maintains a flat state and avoids the sound-transmitting area 12 Warpage deformation occurs.
  • the dust-proof structure provided by the embodiment of the present invention is applied to the MEMS microphone packaging structure, since the sound-transmitting area 12 on the mesh membrane 1 is basically in a flat state, this is conducive to the smooth flow of air here. Have an adverse effect on the movement of airflow.
  • the mesh film 1 is an isolation mesh made of metal as a substrate.
  • the isolation mesh can be, for example, a metal mesh with a mesh aperture of less than about 10 ⁇ m, so that the air flow can pass smoothly, and at the same time, it can effectively block the ingress of external dust, impurities and other particles.
  • the metal screen has the characteristics of good durability, does not need to be replaced frequently, and has a long service life.
  • the isolation net can also be a mesh fabric of other pore sizes and other materials, for example, a non-woven fabric can be used.
  • Non-woven fabric has the characteristics of moisture-proof, breathable, flexible, light weight, non-combustible, easy to decompose, non-toxic and non-irritating, low price, recyclable and so on.
  • shape of the mesh on the isolation net may be, for example, a circle, a square, a triangle, or the like.
  • At least one of the carrier layers is made of inorganic non-metallic materials or organic materials.
  • the carrier layer using at least one layer of inorganic non-metallic material or organic material has low cost and light weight, which facilitates the installation of the dust-proof structure in the MEMS microphone packaging structure.
  • the carrier 2 is configured to be fixed on the mesh film 1 in advance, and the opening 21 is formed by an etching process.
  • the etching process specifically includes: arranging the carrier 2 opposite to the lithography equipment, and disposing a mask on the side of the carrier 2 close to the lithography equipment.
  • the mask is provided with a through hole at a position opposite to the opening 21 to make the light
  • the etching equipment performs photo-etching on the carrier 2 to obtain the carrier 2 with the opening 21, and finally the mask is removed.
  • the orthographic projection shape of the first carrier layer 22 and at least another carrier layer on the mesh film 1 is different, and the first carrier layer 22 is surrounded by another carrier layer. It is configured to be separately formed by two etching processes.
  • the width of the orthographic projection of the carrier layer on the mesh film 1 becomes wider and wider, so that the dust-proof structure can be strengthened after the dust-proof structure is installed in the MEMS microphone packaging structure.
  • the stability along the direction away from the mesh film 1, the width of the orthographic projection of the carrier layer on the mesh film 1 becomes narrower, which can effectively reduce the weight of the dust-proof structure.
  • a stepped structure is formed at the connection of each carrier layer. After the dust-proof structure is bonded to the MEMS microphone packaging structure through an adhesive, after the adhesive overflows, the stepped structure can block the adhesive Function to prevent the adhesive from climbing along the side wall of the carrier 2. Since the orthographic projection shapes of the first carrier layer 22 and at least another carrier layer on the mesh film 1 are different, it is necessary to use two etching processes to form them separately.
  • the carrier 2 includes two carrier layers, a first carrier layer 22 and a second carrier layer 23, and the first carrier layer 22 has a larger thermal expansion coefficient than the second carrier layer 23.
  • the provision of two or three carrier layers can not only effectively alleviate the stress caused by thermal expansion and temperature cooling between the carrier 2 and the mesh film 1 and between the carrier 2 and the PCB board, but also the manufacturing process of the carrier 2 will not be too great. Too complicated, conducive to cost control.
  • the thickness of the first carrier layer 22 is different from that of at least another carrier layer.
  • the carrier layer of other layers is thinner than the first carrier layer 22, which is beneficial to reduce the weight of the entire dust-proof structure.
  • the embodiment of the present invention also provides a MEMS microphone packaging structure, which includes a housing 3 with a accommodating cavity, the housing 3 is provided with a sound hole 4, and the sound hole 4 communicates the inside and the outside of the housing 3; It includes a microphone device and the dustproof structure as described above, the microphone device is fixedly arranged in the housing 3; the carrier layer of the carrier 2 away from the mesh film 1 and the housing 3 are bonded by high temperature The solidification process is fixedly connected; the mesh film 1 closes the sound hole 4; and/or, the mesh film 1 is spaced between the sound hole and the microphone device.
  • the MEMS microphone packaging structure can be applied to various types of electronic products such as mobile phones, notebook computers, Ipads, VR devices, and smart wearable devices, and its applications are relatively wide.
  • the MEMS microphone packaging structure provided by the embodiment of the present invention can effectively prevent internal microphone devices and other components from being damaged by external dust, impurities and other particles and foreign objects, and can prolong the service life of the microphone and also make The microphone maintains excellent acoustic performance.
  • the microphone packaging structure of the present invention has a housing 3 structure that includes a substrate 32 and a packaging cover 31, and the substrate 32 and the packaging cover 31 are combined to form the accommodating cavity .
  • the dust-proof structure is contained in the containing cavity of the housing 3.
  • the sound hole 4 is opened on the substrate 32, and the microphone device includes a MEMS chip 5 and a signal amplifier 6 connected to each other.
  • the MEMS chip 5 includes a substrate and a sensing film
  • the substrate is a hollow structure.
  • the sensing film is, for example, a piezoelectric element, a capacitive element, a piezoresistive element, and the like.
  • the sensing film is arranged at one end of the substrate and covers the hollow structure of the substrate.
  • the hollow structure forms a back cavity which communicates with the acoustic hole 4 and the MEMS chip 5 is mounted on the substrate 32.
  • the dust-proof structure is located in the accommodating cavity of the housing 3 and covers the sound hole 4.
  • the carrier 2 is connected to the base plate 32.
  • the mesh membrane 1 is arranged on and around the sound hole 4, and the mesh membrane 1 is arranged opposite to the sound hole 4 to block external dust, impurities and other particles and foreign matter from entering the housing cavity of the housing 3 from the sound hole 4.
  • the dust-proof structure is entirely located in the back cavity of the MEMS chip 5. The external airflow first passes through the filtering effect of the mesh membrane 1 of the dust-proof structure and then enters the back cavity of the chip 5. Inside.
  • the dust-proof structure is located in the accommodating cavity of the housing 3 and covers the sound hole 4.
  • the carrier 2 is connected to the base plate 32.
  • the mesh membrane 1 is arranged on and around the sound hole 4, and the mesh membrane 1 is arranged opposite to the sound hole 4 to block external dust, impurities and other particles and foreign matter from entering the housing cavity of the housing 3 from the sound hole 4.
  • the MEMS chip 5 is connected to the side of the mesh membrane 1 of the dust-proof structure away from the carrier 2, specifically connected to the side of the fixed connection area 11 away from the carrier 2. The airflow first passes through the filtering effect of the mesh membrane 1 of the dust-proof structure, and then enters the back cavity of the chip 5.
  • the dust-proof structure of the present invention can also have other settings:
  • the sound hole 4 is opened on the packaging cover 31, and the dust-proof structure cover is provided on the packaging cover 31 at a position corresponding to the sound hole 4 and located outside the housing 3.
  • the sound hole 4 is opened on the packaging cover 31, and the dust-proof structure cover is provided on the packaging cover 31 at a position corresponding to the sound hole 4 and located in the accommodating cavity of the housing 3.
  • the position of the dust-proof structure corresponds to the sound hole 4, which can prevent external particles and foreign objects from being introduced into the microphone packaging structure through the sound hole 4.
  • the sound hole 4 is located on the packaging cover 31, and the dust-proof structure is fixedly connected to the substrate 32 at a position corresponding to the sound hole 4. At this time, the dust-proof structure
  • the microphone device in the microphone packaging structure can be effectively protected.

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  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
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Abstract

本发明公开了一种用于MEMS器件的防尘结构及MEMS麦克风封装结构，所述用于MEMS器件的防尘结构包括网格膜及载体，所述网格膜具有固定连接区和透声区，所述固定连接区环绕在所述透声区周围，所述固定连接区位于所述网格膜的边缘；所述载体具有贯通的开口，所述开口与所述透声区的位置相对应，所述载体包括至少两层载体层，所述载体层中的第一载体层连接在所述固定连接区的一侧，其它各层所述载体层沿所述网格膜的厚度方向依次层叠分布于所述第一载体层的远离于所述网隔膜的一侧，各层所述载体层的热膨胀系数不同。

Description

用于MEMS器件的防尘结构及MEMS麦克风封装结构 技术领域
本发明属于声电转换技术领域，具体地，涉及一种用于MEMS器件的防尘结构及MEMS麦克风封装结构。
背景技术
随着电声技术的快速发展，各种电声产品层出不穷。麦克风作为一种将声音信号转换为电信号的换能器件，是电声产品中非常重要的器件之一。如今，麦克风已经被广泛应用于手机、平板电脑、笔记本电脑、VR设备、AR设备以及智能穿戴等多种不同类型的电子产品中。近年来，对于麦克风封装结构的设计成为了本领域技术人员研究的重点和热点。
现有的麦克风封装结构通常为：包括具有容纳腔的外壳，在容纳腔内收容固定有芯片组件(例如，MEMS芯片和ASIC芯片)等元器件；并且，在外壳上还设置有拾音孔。因此，在长期的应用中发现，外界的灰尘、杂质等颗粒物和异物很容易经由拾音孔而被引入到麦克风的容纳腔中，这些外界的颗粒物、异物会对容纳腔中的芯片组件等元器件造成一定的损伤，并且最终会影响到麦克风的声学性能以及使用寿命。
针对上述技术问题，目前所采用的解决方案通常是，在麦克风封装结构的拾音孔上设置相应的隔离组件，用以阻挡外界颗粒物、异物等的进入。现有的隔离组件一般包括支撑部和隔离网布，在使用该隔离组件时，将隔离组件安装在拾音孔上。但现有的隔离组件，由于支撑部与隔离网布在尺寸、材料、结构等方面存在着差异，在二者连接的位置很可能会产生一定的内部应力差；尤其是现有技术中的支撑部只具备单层结构，在热压结合 时，由于支撑部与隔离网布的热膨胀系数不同，甚至二者的热膨胀系数可能会相差较大，因此在受热之后的形变量会有较大差异。以上这些因素将会导致隔离网布上的网膜产生翘曲变形，不能保证网膜处于平整状态，而这将会进而造成产品的品质下降，甚至还会影响到网膜处的气流流动。
发明内容
本发明的一个目的是提供一种用于MEMS器件的防尘结构及MEMS麦克风封装结构。
根据本发明的第一方面，提供了一种用于MEMS器件的防尘结构，其特征在于，包括：
网格膜，所述网格膜具有固定连接区和透声区，所述固定连接区环绕在所述透声区周围，所述固定连接区位于所述网格膜的边缘；
载体，所述载体具有贯通的开口，所述开口与所述透声区的位置相对应，所述载体包括至少两层载体层，所述载体层中的第一载体层连接在所述固定连接区的一侧，其它各层所述载体层沿所述网格膜的厚度方向依次层叠分布于所述第一载体层的远离于所述网隔膜的一侧，各层所述载体层的热膨胀系数不同。
可选地，所述网格膜的热膨胀系数小于所述第一载体层的热膨胀系数，各层所述载体层的热膨胀系数沿着远离于所述网格膜的方向，依次减小。
可选地，所述网格膜的热膨胀系数大于所述第一载体层的热膨胀系数，各层所述载体层的热膨胀系数沿着远离于所述网格膜的方向，依次增大。
可选地，所述网格膜为以金属作为基材制成的隔离网。
可选地，至少一层所述载体层采用无机非金属材料或有机材料制成。
可选地，所述载体被配置为预先固定在所述网格膜上，并通过刻蚀工艺形成所述开口。
可选地，所述第一载体层与至少另一层载体层在所述网格膜上的正投影形状不同，所述第一载体层与另一层所述载体层被配置为采用两次刻蚀工艺分别形成。
可选地，所述载体包括两层所述载体层，分别为第一载体层和第二载体层，所述第一载体层的热膨胀系数大于所述第二载体层的热膨胀系数；
或者，所述载体包括三层载体层，分别为第一载体层、第二载体层和第三载体层，所述第二载体层位于所述第一载体层和第三载体层之间，所述第一载体层的热膨胀系数大于所述第二载体层的热膨胀系数，所述第二载体层的热膨胀系数大于所述第三载体层的热膨胀系数。
可选地，所述第一载体层与至少另一层载体层的厚度不同。
根据本发明的另一方面，提供了一种MEMS麦克风封装结构，其包括：
具有容纳腔的外壳，所述外壳上设有声孔，所述声孔将所述外壳的内部和外部连通；
麦克风器件，所述麦克风器件固定设置在所述外壳内；
如上所述的防尘结构，所述载体的远离于所述网格膜的载体层与所述外壳通过高温粘接固化工艺固定连接；
所述网格膜封闭所述声孔；和/或，所述网格膜间隔于所述声孔与所述麦克风器件之间。
本发明的一个技术效果在于，本发明实施例提供的一种用于MEMS器件的防尘结构，由于载体包括至少两层载体层，并且各层所述载体层的热膨胀系数不同，能够有效减缓加热冷却后的应力作用，防止网格膜发生较大的翘曲变形，确保网格膜的透声区基本处于平整的状态，这样有利于空气在此处的顺利流动，不会对气流的运动产生不良影响。
通过以下参照附图对本发明的示例性实施例的详细描述，本发明的其它特征及其优点将会变得清楚。
附图说明
被结合在说明书中并构成说明书的一部分的附图示出了本发明的实施例，并且连同其说明一起用于解释本发明的原理。
图1为本发明实施例提供的一种用于MEMS器件的防尘结构的示意图一；
图2为本发明实施例提供的一种用于MEMS器件的防尘结构的示意图二；
图3为本发明实施例提供的一种MEMS麦克风封装结构的示意图一；
图4为本发明实施例提供的一种MEMS麦克风封装结构的示意图二；
图5为本发明实施例提供的一种MEMS麦克风封装结构的示意图三；
图6为本发明实施例提供的一种MEMS麦克风封装结构的示意图四；
图7为本发明实施例提供的一种MEMS麦克风封装结构的示意图五。
具体实施方式
现在将参照附图来详细描述本发明的各种示例性实施例。应注意到：除非另外具体说明，否则在这些实施例中阐述的部件和步骤的相对布置、数字表达式和数值不限制本发明的范围。
以下对至少一个示例性实施例的描述实际上仅仅是说明性的，决不作为对本发明及其应用或使用的任何限制。
对于相关领域普通技术人员已知的技术、方法和设备可能不作详细讨论，但在适当情况下，所述技术、方法和设备应当被视为说明书的一部分。
在这里示出和讨论的所有例子中，任何具体值应被解释为仅仅是示例 性的，而不是作为限制。因此，示例性实施例的其它例子可以具有不同的值。
应注意到：相似的标号和字母在下面的附图中表示类似项，因此，一旦某一项在一个附图中被定义，则在随后的附图中不需要对其进行进一步讨论。
参考图1、图2所示，本发明实施例提供了一种用于MEMS器件的防尘结构，其包括网格膜1及载体2，所述网格膜1具有固定连接区11和透声区12，所述固定连接区11环绕在所述透声区12周围，所述固定连接区11位于所述网格膜1的边缘；所述载体2具有贯通的开口21，所述开口21与所述透声区12的位置相对应，所述载体2包括至少两层载体层，所述载体层中的第一载体层22连接在所述固定连接区11的一侧，其它各层所述载体层沿所述网格膜1的厚度方向依次层叠分布于所述第一载体层22的远离于所述网隔膜的一侧，各层所述载体层的热膨胀系数不同。
在将该防尘结构安装于MEMS麦克风封装结构中时，例如安装到MEMS麦克风封装结构中的PCB板上，当载体2只具备单层结构时，载体2只具备单一的热膨胀系数，该热膨胀系数不仅极有可能跟网格膜1的固定连接区11的热膨胀系数相差很大，并且还有可能与PCB板的热膨胀系数相差很大，这样，在将该防尘结构与PCB板通过热固化胶进行结合时，载体2与网格膜1之间以及载体2与PCB板之间的形变量均会产生较大的差异，当温度降至室温后，载体2与网格膜1之间以及载体2与PCB板之间会互相约束产生应力，该应力会阻止网格膜1恢复到原始的尺寸，由此网格膜1会发生较大的翘曲变形，这样无法保证网膜处于平整状态。在本发明实施例提供的用于MEMS器件的防尘结构中，由于载体2包括至少两层载体层，并且各层所述载体层的热膨胀系数不同，即在从网格膜1到PCB板的方向上由不同热膨胀系数的载体层进行过渡连接，这样能有效减缓加热冷却后的应力作用，防止网格膜1发生较大的翘曲变形，确保网格膜1 的透声区12基本处于平整的状态，这样有利于空气在此处的顺利流动，不会对气流的运动产生不良影响。
在一个实施例中，所述网格膜1的热膨胀系数小于所述第一载体层22的热膨胀系数，各层所述载体层的热膨胀系数沿着远离于所述网格膜1的方向，依次减小。
在该实施例中，第一载体层22的热膨胀系数最大，第一载体层22的热膨胀系数不仅大于网格膜1的热膨胀系数，并且第一载体层22的热膨胀系数还大于其余各层载体层的热膨胀系数，此外，各层载体层的热膨胀系数沿着远离于网格膜1的方向为依次逐渐减小。这样能够有效缓解载体2与网格膜1之间以及载体2与PCB板之间受热膨胀及温度冷却后的应力作用，从而可以基本保证透声区12保持一个平整的状态，避免透声区12发生翘曲变形。
在一个实施例中，所述网格膜1的热膨胀系数大于所述第一载体层22的热膨胀系数，各层所述载体层的热膨胀系数沿着远离于所述网格膜1的方向，依次增大。
在该实施例中，第一载体层22的热膨胀系数最小，第一载体层22的热膨胀系数不仅小于网格膜1的热膨胀系数，并且第一载体层22的热膨胀系数还小于其余各层载体层的热膨胀系数，此外，各层载体层的热膨胀系数沿着远离于网格膜1的方向为依次逐渐增大。这样能够有效缓解载体2与网格膜1之间以及载体2与PCB板之间受热膨胀及温度冷却后的应力作用，从而可以基本保证透声区12保持一个平整的状态，避免透声区12发生翘曲变形。
在将本发明实施例提供的防尘结构应用于MEMS麦克风封装结构上后，由于网格膜1上的透声区12基本处于平整的状态，这样有利于空气在此处的顺利流动，不会对气流的运动产生不良影响。
在一个实施例中，所述网格膜1为以金属作为基材制成的隔离网。所 述隔离网例如可以采用网孔孔径小于10μm左右的金属筛网，以使气流能够顺利地通过，同时还可以有效阻挡住外界的灰尘、杂质等颗粒物进入。而且，金属材质的筛网具有耐用性好的特点，无需频繁更换，具有较长的使用寿命。当然，所述隔离网也可以采用其它孔径尺寸和其它材质的网布，例如，可以采用无纺布。无纺布具有防潮、透气、柔韧、质轻、不助燃、容易分解、无毒无刺激性、价格低廉、可循环再用等特点。并且，所述隔离网上网孔的形状例如可以为圆形、方形、三角形等形状。本领域技术人员可以根据具体需要灵活进行调整，本发明对此不作限制。
在一个实施例中，至少一层所述载体层采用无机非金属材料或有机材料制成。采用至少一层的无机非金属材料或有机材料的载体层成本较低，并且重量较轻，有利于将该防尘结构安装于MEMS麦克风封装结构中。
在一个实施例中，所述载体2被配置为预先固定在所述网格膜1上，并通过刻蚀工艺形成所述开口21。所述刻蚀工艺具体为，将载体2与光刻设备相对设置，在载体2靠近光刻设备的一侧设置掩膜，所述掩膜上与开口21相对的位置设有通孔，使光刻设备对载体2进行光刻蚀，得到具有开口21的载体2，最后去除掉掩膜即可。
在一个实施例中，所述第一载体层22与至少另一层载体层在所述网格膜1上的正投影形状不同，所述第一载体层22与另一层所述载体层被配置为采用两次刻蚀工艺分别形成。
例如，沿着远离网格膜1的方向，载体层在网格膜1上的正投影的宽度越来越宽，这样在将防尘结构安装于MEMS麦克风封装结构中后能够加强该防尘结构的稳定性。再例如，沿着远离网格膜1的方向，载体层在网格膜1上的正投影的宽度越来越窄，这样能够有效减轻防尘结构的重量。再例如，在各个载体层的连接处形成台阶结构，当将防尘结构通过粘结剂粘结于MEMS麦克风封装结构中后，粘接剂溢出后，台阶结构能够对粘接剂起到阻挡的作用，避免粘接剂顺着载体2的侧壁爬升。而由于第一载体 层22与至少另一层载体层在所述网格膜1上的正投影形状不同，因此需要采用两次刻蚀工艺分别形成。
在一个实施例中，所述载体2包括两层所述载体层，分别为第一载体层22和第二载体层23，所述第一载体层22的热膨胀系数大于所述第二载体层23的热膨胀系数；或者，所述载体2包括三层载体层，分别为第一载体层22、第二载体层23和第三载体层24，所述第二载体层23位于所述第一载体层22和第三载体层24之间，所述第一载体层22的热膨胀系数大于所述第二载体层23的热膨胀系数，所述第二载体层23的热膨胀系数大于所述第三载体层24的热膨胀系数。
设置两层或三层载体层不仅能够有效效缓解载体2与网格膜1之间以及载体2与PCB板之间受热膨胀及温度冷却后的应力作用，并且载体2的制成工艺不会太过复杂，有利于成本控制。
在一个实施例中，所述第一载体层22与至少另一层载体层的厚度不同。例如其他层的载体层比第一载体层22较薄，有利于减轻整个防尘结构的重量。
本发明实施例还提供了一种MEMS麦克风封装结构，其包括具有容纳腔的外壳3，所述外壳3上设有声孔4，所述声孔4将所述外壳3的内部和外部连通；还包括麦克风器件及如上所述的防尘结构，所述麦克风器件固定设置在所述外壳3内；所述载体2的远离于所述网格膜1的载体层与所述外壳3通过高温粘接固化工艺固定连接；所述网格膜1封闭所述声孔4；和/或，所述网格膜1间隔于所述声孔与所述麦克风器件之间。
所述MEMS麦克风封装结构可应用于例如手机、笔记本电脑、Ipad、VR设备以及智能穿戴设备等多种类型的电子产品中，其应用较为广泛。本发明实施例提供的MEMS麦克风封装结构，能够有效避免内部的麦克风器件等元器件受到外部灰尘、杂质等颗粒物、异物的影响而遭到破坏的现象， 可以延长麦克风的使用寿命，而且还能使麦克风保持优良的声学性能。
参考图3-图7所示，本发明的麦克风封装结构，其外壳3的结构为：包括基板32和封装盖31，并由所述基板32和所述封装盖31一起围合成所述容纳腔。所述防尘结构收容在外壳3的容纳腔内。具体地，所述声孔4开在基板32上，所述麦克风器件包括相连接的MEMS芯片5和信号放大器6。其中，所述MEMS芯片5包括有衬底和感应膜，衬底为中空结构。感应膜例如为压电元件、电容元件、压阻元件等。感应膜设置在衬底的一端，并覆盖衬底的中空结构，该中空结构形成背腔，背腔与所述声孔4相连通，MEMS芯片5贴装在基板32上。
在本发明一个可选的例子中，如图3所示，所述防尘结构位于外壳3的容纳腔内并且盖设于所述声孔4处，具体地，所述载体2连接在基板32上并且围绕设置在声孔4周围，所述网格膜1与声孔4相对设置用于阻挡外部的灰尘、杂质等颗粒物、异物从声孔4进入到外壳3的容纳腔内。在图3所示的实施例中，所述防尘结构整体位于MEMS芯片5的背腔内，外部的气流首先经过防尘结构的网格膜1的过滤作用后再进入到芯片5的背腔内。
在本发明一个可选的例子中，如图4所示，所述防尘结构位于外壳3的容纳腔内并且盖设于所述声孔4处，具体地，所述载体2连接在基板32上并且围绕设置在声孔4周围，所述网格膜1与声孔4相对设置用于阻挡外部的灰尘、杂质等颗粒物、异物从声孔4进入到外壳3的容纳腔内。在图4所示的实施例中，所述MEMS芯片5连接在防尘结构的网格膜1远离载体2的一侧，具体是连接在固定连接区11上远离载体2的一侧，外部的气流首先经过防尘结构的网格膜1的过滤作用后再进入到芯片5的背腔内。
当然，本发明的防尘结构也可以有其他的设置方式：
例如，如图5所示，声孔4开设在封装盖31上，防尘结构盖设在封装盖31上与声孔4对应的位置处且位于外壳3的外部。例如，如图6所示， 声孔4开设在封装盖31上，防尘结构盖设在封装盖31上与声孔4对应的位置处且位于外壳3的容纳腔内。防尘结构的位置对应于声孔4，能够避免外界的颗粒物、异物经声孔4而引入到麦克风封装结构内部。再例如，如图7所示，声孔4位于所述封装盖31上，所述防尘结构固定连接在所述基板32上对应于所述声孔4的位置处，此时，防尘结构能够对麦克风封装结构内的麦克风器件进行有效的保护。
虽然已经通过例子对本发明的一些特定实施例进行了详细说明，但是本领域的技术人员应该理解，以上例子仅是为了进行说明，而不是为了限制本发明的范围。本领域的技术人员应该理解，可在不脱离本发明的范围和精神的情况下，对以上实施例进行修改。本发明的范围由所附权利要求来限定。

Claims (10)

  1. 一种用于MEMS器件的防尘结构，其特征在于，包括：
    网格膜，所述网格膜具有固定连接区和透声区，所述固定连接区环绕在所述透声区周围，所述固定连接区位于所述网格膜的边缘；
    载体，所述载体具有贯通的开口，所述开口与所述透声区的位置相对应，所述载体包括至少两层载体层，所述载体层中的第一载体层连接在所述固定连接区的一侧，其它各层所述载体层沿所述网格膜的厚度方向依次层叠分布于所述第一载体层的远离于所述网隔膜的一侧，各层所述载体层的热膨胀系数不同。
  2. 根据权利要求1所述的防尘结构，其特征在于，所述网格膜的热膨胀系数小于所述第一载体层的热膨胀系数，各层所述载体层的热膨胀系数沿着远离于所述网格膜的方向，依次减小。
  3. 根据权利要求1所述的防尘结构，其特征在于，所述网格膜的热膨胀系数大于所述第一载体层的热膨胀系数，各层所述载体层的热膨胀系数沿着远离于所述网格膜的方向，依次增大。
  4. 根据权利要求1所述的防尘结构，其特征在于，所述网格膜为以金属作为基材制成的隔离网。
  5. 根据权利要求1所述的防尘结构，其特征在于，至少一层所述载体层采用无机非金属材料或有机材料制成。
  6. 根据权利要求1所述的防尘结构，其特征在于，所述载体被配置为预先固定在所述网格膜上，并通过刻蚀工艺形成所述开口。
  7. 根据权利要求6所述的防尘结构，其特征在于，所述第一载体层与至少另一层载体层在所述网格膜上的正投影形状不同，所述第一载体层与另一层所述载体层被配置为采用两次刻蚀工艺分别形成。
  8. 根据权利要求1所述的防尘结构，其特征在于，所述载体包括两层 所述载体层，分别为第一载体层和第二载体层，所述第一载体层的热膨胀系数大于所述第二载体层的热膨胀系数；
    或者，所述载体包括三层载体层，分别为第一载体层、第二载体层和第三载体层，所述第二载体层位于所述第一载体层和第三载体层之间，所述第一载体层的热膨胀系数大于所述第二载体层的热膨胀系数，所述第二载体层的热膨胀系数大于所述第三载体层的热膨胀系数。
  9. 根据权利要求1所述的防尘结构，其特征在于，所述第一载体层与至少另一层载体层的厚度不同。
  10. 一种MEMS麦克风封装结构，其特征在于，包括：
    具有容纳腔的外壳，所述外壳上设有声孔，所述声孔将所述外壳的内部和外部连通；
    麦克风器件，所述麦克风器件固定设置在所述外壳内；
    权利要求1-9任意之一所述的防尘结构，所述载体的远离于所述网格膜的载体层与所述外壳通过高温粘接固化工艺固定连接；
    所述网格膜封闭所述声孔；和/或，所述网格膜间隔于所述声孔与所述麦克风器件之间。
PCT/CN2020/099149 2019-12-31 2020-06-30 用于mems器件的防尘结构及mems麦克风封装结构 WO2021135111A1 (zh)

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