WO2021135108A1 - 防尘结构、麦克风封装结构以及电子设备 - Google Patents

防尘结构、麦克风封装结构以及电子设备 Download PDF

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Publication number
WO2021135108A1
WO2021135108A1 PCT/CN2020/099110 CN2020099110W WO2021135108A1 WO 2021135108 A1 WO2021135108 A1 WO 2021135108A1 CN 2020099110 W CN2020099110 W CN 2020099110W WO 2021135108 A1 WO2021135108 A1 WO 2021135108A1
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WO
WIPO (PCT)
Prior art keywords
dust
substrate
sound pickup
pickup hole
carrier
Prior art date
Application number
PCT/CN2020/099110
Other languages
English (en)
French (fr)
Inventor
林育菁
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潍坊歌尔微电子有限公司
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Publication of WO2021135108A1 publication Critical patent/WO2021135108A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/003—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor for diaphragms or their outer suspension
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2231/00—Details of apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor covered by H04R31/00, not provided for in its subgroups
    • H04R2231/001—Moulding aspects of diaphragm or surround

Definitions

  • the present invention relates to the technical field of electro-acoustic conversion, and more specifically, the present invention relates to a dustproof structure, a microphone packaging structure, and an electronic device.
  • the microphone as a transducer that converts sound into electrical signals, is one of the most important devices in electroacoustic products.
  • microphones have been widely used in many different types of electronic products such as mobile phones, tablet computers, notebook computers, VR devices, AR devices, smart watches and smart wearables.
  • the design of the structure has become the focus and focus of research by those skilled in the art.
  • the existing microphone packaging structure usually includes a housing with a accommodating cavity in which components such as chip components (for example, MEMS chips and ASIC chips) are housed and fixed; and a sound pickup hole is also provided on the housing.
  • chip components for example, MEMS chips and ASIC chips
  • a sound pickup hole is also provided on the housing.
  • the currently adopted solution is usually to provide a corresponding isolation component on the pickup hole of the microphone packaging structure to block the entry of foreign particles, foreign objects, etc.
  • the existing isolation assembly as shown in Figure 1, includes a carrier a2 and a screen a1.
  • the isolation component install the isolation component on the pickup hole.
  • the carrier a2 and the screen a1 are usually manufactured on a flat substrate. Its purpose is to maintain flatness to prevent the screen a1 from being damaged.
  • the isolation component is transferred to another substrate and/or flexible board. After the production is complete, the isolation component is separated from the wafer and assembled as part of the microphone a4.
  • the adhesive a3 is cured at a high temperature.
  • the expansion of the screen a1 and the carrier a2 will vary according to the CTE (Coefficient of Thermal Expansion) of each material, which usually causes the carrier to warp and/or deform.
  • the adhesive a3 Before the temperature returns to room temperature, the adhesive a3 has cured and prevents the isolation component from returning to its original size, so warpage and/or deformation still exist. The remaining warpage and/or deformation will cause wrinkles on the screen a1, and even cause the screen a1 to fail or break.
  • An object of the present invention is to provide a new technical solution for a dust-proof structure, a microphone packaging structure, and an electronic device.
  • a dust-proof structure includes a carrier and a grid part; the carrier is a hollow structure, the carrier includes a plurality of support layers arranged along a height direction, and the grid part includes a grid structure and a grid part arranged around the grid structure.
  • the fixed part is connected with the carrier, the grid structure is opposite to the hollow structure, and the thermal expansion coefficient of at least one support layer is different from the thermal expansion coefficient of other support layers except the support layer.
  • the support layer connected to the fixing portion is defined as the first support layer, and the Nth support layer is successively outward from the first support layer, where N is greater than or equal to 2, and the thermal expansion coefficient of the Nth support layer Greater than the thermal expansion coefficient of the N-1th support layer.
  • the material of the carrier is organic material, and the material of the mesh part is metal.
  • the grid portion further includes a stress buffer connected between the fixed portion and the grid structure, and the stress buffer is suspended.
  • an elastic structure is formed by hollowing out the stress buffer zone.
  • At least one of the supporting layers is prepared from a dry film resist.
  • a microphone packaging structure includes a housing with a accommodating cavity, and a sound pickup hole is provided on the housing; and also includes the above-mentioned dust-proof structure, and the dust-proof structure is arranged on the sound pickup hole.
  • the dust-proof structure is located outside the housing.
  • the housing includes a substrate and a packaging cover, and the substrate and the packaging cover surround the containing cavity;
  • the dust-proof structure is contained in the containing cavity.
  • the sound pickup hole is located on the packaging cover, and the dust-proof structure is fixedly connected to the packaging cover.
  • the sound pickup hole is located on the packaging cover, and the dust-proof structure is fixedly connected to the substrate at a position corresponding to the sound pickup hole.
  • the sound pickup hole is located on the substrate, and the dust-proof structure is fixedly provided on the substrate at a position corresponding to the sound pickup hole.
  • the sound pickup hole is located on the substrate
  • the dustproof structure is fixedly arranged on the substrate at a position corresponding to the sound pickup hole
  • the MEMS chip is arranged on the dustproof structure.
  • an electronic device includes the aforementioned microphone packaging structure.
  • Figure 1 is a side view of a conventional isolation assembly.
  • Fig. 2 is a cross-sectional view of a dust-proof structure according to an embodiment of the present disclosure.
  • Fig. 3 is a cross-sectional view of a second dust-proof structure according to an embodiment of the present disclosure.
  • Fig. 4 is a cross-sectional view of a third dust-proof structure according to an embodiment of the present disclosure.
  • FIG. 5 is a schematic diagram of a microphone packaging structure according to an embodiment of the present disclosure.
  • Fig. 6 is a schematic diagram of a second microphone packaging structure according to an embodiment of the present disclosure.
  • Fig. 7 is a schematic diagram of a third microphone packaging structure according to an embodiment of the present disclosure.
  • Fig. 8 is a top view of a supporting layer according to an embodiment of the present disclosure.
  • Fig. 9 is a partial view of a stress buffer according to an embodiment of the present disclosure.
  • FIG. 10 is a schematic diagram of a fourth microphone packaging structure according to an embodiment of the present disclosure.
  • FIG. 11 is a schematic diagram of a fifth microphone packaging structure according to an embodiment of the present disclosure.
  • a dust-proof structure is provided.
  • the dust-proof structure can be applied to, for example, a microphone packaging structure.
  • the dust-proof structure can effectively block external particles and foreign objects from entering the microphone packaging structure through the pickup hole on the microphone packaging structure, thereby effectively protecting the internal components of the microphone to avoid affecting the acoustics of the MEMS microphone chip Performance and service life.
  • the dust-proof structure includes a carrier 1 and a grid portion 2.
  • the carrier 11 is a hollow structure 104, and an air flow channel is formed inside the hollow structure 104 for the passage of vibrating air flow.
  • the carrier 1 includes a plurality of supporting layers arranged in a stack. For example, the first support layer 101, the second support layer 102, and the third support layer 103.
  • the number of support layers is not limited here, and those skilled in the art can set it according to actual needs.
  • the supporting layer has a ring shape, such as a circular ring shape, a rectangular ring shape, a racetrack shape, or other ring-shaped structures.
  • Multiple support layers are connected together to form a laminated structure.
  • the cross-sections of a plurality of supporting layers are the same to form a carrier 1 with a uniform wall thickness.
  • multiple support layers have different cross-sections, as long as they can be stacked together to form the hollow structure 104.
  • At least one of the support layers forms a stress relief portion, and the stress relief portion has a different material from other support layers other than the support layer on which it is located.
  • Different materials are, for example, that the coefficient of thermal expansion of the supporting layer is different from that of other supporting layers.
  • the coefficient of thermal expansion refers to the change in the magnitude of the length of the support layer caused by a unit temperature change.
  • the different thermal expansion coefficients cause the support layer with a higher thermal expansion coefficient to absorb more deformation during the heating and cooling process of the carrier, so that the stress of the carrier 1 is reduced.
  • the warpage and/or deformation of the carrier 1 can be effectively absorbed, thereby reducing or even avoiding wrinkles or damage of the mesh portion 2.
  • the material of the support layer can be, but is not limited to, organic materials, inorganic non-metallic materials or metallic materials.
  • organic materials include plastics and the like.
  • Inorganic non-metallic materials include silicon, silicon oxide, silicon nitride, and the like.
  • Metal materials include stainless steel, copper alloy, aluminum alloy, gold, silver and so on.
  • the material of the carrier 1 is not limited to the above-mentioned embodiment, and those skilled in the art can set it according to actual needs.
  • the cross section of the carrier 1 is rectangular, circular, elliptical, hexagonal, or the like.
  • the cross-section of the carrier 1 is square, and its side length is 800 ⁇ m-1500 ⁇ m. The sides of the square are the same length, and the deformation is small.
  • the cross section of the hollow structure 104 is circular, elliptical, triangular, rectangular, hexagonal, racetrack-shaped, and the like.
  • the cross section of the hollow structure 104 is circular, and its diameter is 500 ⁇ m-1200 ⁇ m.
  • the grid portion 2 is disposed at one end of the carrier 1 and covers the hollow structure 104.
  • the grid portion 2 includes a grid structure and an edge portion 110 arranged around the grid structure.
  • the grid structure 21 is opposite to the hollow structure 104.
  • the grid structure is formed with a screen.
  • the screen has a set mesh, which can filter out external impurities, dust, particles, etc. Those skilled in the art can set the mesh number of the screen according to actual needs.
  • the edge portion 110 is connected to the carrier 1.
  • the fixing portion 22 is connected to the edge portion 110 of the carrier 1 by means of adhesive or bonding.
  • the support layer connected to the fixing portion is defined as the first support layer 101, and the Nth support layer is successively outward from the first support layer 101, where N is greater than or equal to 2, and the Nth support layer The coefficient of thermal expansion is greater than the coefficient of thermal expansion of the N-1th support layer.
  • the first supporting layer 101 is connected to the fixing part.
  • the third support layer 103 is used to connect with external devices.
  • the third supporting layer 103 is bonded to the PCB of the external device by an adhesive.
  • the thermal expansion coefficient of the second support layer 102 is greater than the thermal expansion coefficient of the first support layer 101.
  • the thermal expansion coefficient of the third support layer 103 is greater than the thermal expansion coefficient of the second support layer 102.
  • the coefficient of thermal expansion of the support layer (for example, the first support layer 101) connected to the mesh part 2 is the smallest. In this way, it can be ensured that the part where the mesh part 2 is located has minimal deformation when the external temperature changes. .
  • the support layer connected to the external device has the largest coefficient of thermal expansion, which can make the support layer more capable of absorbing deformation, thereby reducing the stress of the carrier.
  • the thermal expansion coefficients of the first support layer 101 to the Nth support layer gradually increase, which can make the shrinkage and expansion of different support layers more adaptable, and the carrier will not undergo plastic deformation or even fracture.
  • the material of the carrier 1 is an organic material
  • the material of the mesh part is a metal.
  • each support layer is made of plastics with different thermal expansion coefficients.
  • the mesh part is made of metal material.
  • the mesh part has strong elastic deformation ability and is not easy to form wrinkles. Organic materials have high elasticity and are good for absorbing deformation.
  • the supporting layer has two layers, such as a first supporting layer 101 and a second supporting layer 102.
  • the two supporting layers 101, 102 are connected together.
  • the structure of the carrier 1 is simple.
  • One of the supporting layers (for example, the second supporting layer 102) is provided with a stress relief part; the other supporting layer (for example, the first supporting layer 101) is a solid structure.
  • At least one of the supporting layers is made of dry film resist.
  • a dry film resist is used to form a predetermined pattern, and then the excess part is etched to form the hollow structure 104, etc., and finally the support layer is formed.
  • Dry film resist has the characteristics of high molding accuracy.
  • At least one of the supporting layers has a groove 102a extending in a height direction, and at least one of the supporting layers is a solid structure.
  • the arrangement of the groove 102a can effectively absorb the deformation of the carrier 1 and prevent the grid portion 2 from wrinkling.
  • the cross-sectional shape of the groove 102a is a circle, a rectangle, an arc, an ellipse, a triangle, or other shapes.
  • the above-mentioned grooves 102a can absorb deformation.
  • the support layer (for example, the first support layer 101) connected to the mesh part 2 is a solid structure, and the support layer (for example, the second support layer 102) located below the support layer (for example, the first support layer 101) It has the groove 102a.
  • the second support layer 102 can effectively absorb the deformation of the carrier 1.
  • the first support layer 101 can cooperate with the taking and placing of the dust-proof structure.
  • the dust-proof structure can be transferred by grabbing or vacuum suction.
  • the jaws or suction nozzles of the transfer device apply force to the first support layer 101. Since the first support layer 101 is a solid structure, it has a relatively high structural strength. Compared with the second supporting layer 102, the first supporting layer 101 is less likely to be damaged by the clamping jaws or suction nozzles, so that the dust-proof structure can be kept intact during the picking and placing process.
  • the positions of the first support layer 101 and the second support layer 102 are interchanged, and the dust-proof structure can be taken and placed in a vacuum suction manner.
  • a plurality of trenches 102a are formed on the second support layer 102. A plurality of them are distributed at different positions on the end surface of the second supporting layer 102. In this way, the plurality of grooves 102a can absorb the deformation of the carrier 1 from different directions.
  • a plurality of trenches 102a are evenly distributed around the hollow structure 104. In this way, the ability of the carrier 1 to absorb deformation is stronger.
  • the through hole includes a plurality of arc-shaped grooves 102a arranged concentrically.
  • a connecting portion 112 is formed between adjacent arc-shaped grooves 102a.
  • the cross section of the hollow structure 104 is circular.
  • a plurality of arc-shaped grooves 102 a are arranged around the hollow structure 104.
  • the arc-shaped groove 102 a is arranged concentrically with respect to the center of the hollow structure 104.
  • the arc-shaped groove 102a can effectively absorb the deformation of the edge portion 110.
  • FIG. 8 there are four arc-shaped grooves 102a, and they respectively cover the four corners of the square carrier 1, and have a symmetrical structure with respect to the diagonal line, or cover four sides relative to where they are.
  • the vertical lines of the sides are symmetrical. This arrangement makes the elastic structure's ability to absorb deformation more balanced.
  • a plurality of arc-shaped grooves 102 a are provided in the radial direction of the carrier 1.
  • multiple arc-shaped grooves 102a are arranged in the radial direction.
  • Each layer is provided with a plurality of arc-shaped grooves 102a.
  • the multi-layer arc-shaped groove 102a can more effectively absorb the deformation of the carrier 1 and reduce the stress concentration.
  • each layer together form a skeleton structure, which has a greater elastic restoring force, making the carrier 1 more capable of restoring deformation.
  • the number of layers of the arc-shaped trench 102a is less than five. This makes the structural strength and deformation resistance of the carrier 1 stronger.
  • the arc-shaped groove 102a in FIG. 8 has two layers, so that the structure of the carrier 1 becomes simple.
  • the connecting portions 112 of two adjacent layers are staggered.
  • the two connecting portions 112 are not located in the same diametrical direction.
  • the connecting portion 112 and the parts of each layer up to the present can form a grid connection.
  • the deformation will spread to other parts through the grid connection, and the deformation will be scattered in various parts of the grid connection. This makes the elastic structure more balanced with respect to the ability of the hollow structure 104 to absorb deformation in all directions.
  • the connecting portions 112 of multiple layers are connected together to form a radial shape.
  • the arc-shaped grooves 102a corresponding to the positions of the multiple layers are distributed in the same fan-shaped structure.
  • the radial connection structure makes the elastic structure stronger.
  • the inner side of the buffer portion forms a closed annular wall portion.
  • the ring-shaped wall can form a barrier to the elastic structure and improve the durability of the elastic structure.
  • the grid portion 2 includes a grid structure 21, a stress buffer 23 arranged around the grid structure, and a fixing portion 22 arranged around the stress buffer 23.
  • the grid structure 21 and the stress buffer zone 23 are suspended.
  • the fixing portion 22 can be used to connect the grid portion 2 to the carrier 1, for example, the fixing portion 22 is connected to an edge portion, so that the grid portion 2 can be stably covered on the carrier 1. on.
  • the stress buffer zone 23 is a reserved area that is not provided with meshes and is not connected to the edge. The stress buffer 23 can further reduce the influence of the deformation of the carrier on the grid structure.
  • a material removal process is performed on a portion of the first support layer 101 corresponding to the stress buffer zone 23 to form a stepped structure 101a, so that the stress buffer zone 23 is suspended.
  • the stress buffer 23 is a ring structure with a predetermined width ⁇ . It should be noted that the stress buffer 23 may be, for example, a circular ring structure with a predetermined width ⁇ , a square ring structure with a predetermined width ⁇ , or other ring structures with a predetermined width ⁇ .
  • the technical personnel can flexibly adjust according to the specific situation, which is not limited in the present disclosure.
  • the stress buffer zone 23 is hollowed out to form an elastic structure.
  • the stress buffer zone 23 is hollowed out to form an elastic stretchable structure 23a.
  • An annular belt 23b is formed between the hollow hole and the grid structure to ensure that the grid structure 21 has sufficient strength.
  • the elastic stretch structure 23a can be elastically deformed, so as to absorb the deformation of the carrier 1. This prevents the deformation of the carrier 1 from being transmitted to the grid structure 21.
  • A represents a contracted state
  • B represents a stretched state.
  • Fig. 3 is a cross-sectional view of a dust-proof structure according to another embodiment of the present disclosure.
  • the carrier also includes a third supporting layer 103.
  • the third supporting layer 103 is a solid structure and is connected to the lower end surface of the second supporting layer 102.
  • the third supporting layer 103 functions as a reinforcing structure and can prevent the groove 102a from being exposed, which makes the structural strength of the carrier higher.
  • the groove 102a is provided on at least one of the first supporting layer 101 and the third supporting layer 103. This arrangement can also play a role in absorbing the deformation of the carrier.
  • a microphone packaging structure is provided.
  • the microphone packaging structure can be applied to various types of electronic products such as mobile phones, notebook computers, tablet computers, game consoles, walkie-talkies, VR devices, and smart wearable devices.
  • the microphone packaging structure can effectively prevent internal chip components and other components from being damaged by external dust, impurities and other particles and foreign objects. It can extend the service life of the MEMS microphone chip and also keep the MEMS microphone chip Excellent acoustic performance.
  • the microphone packaging structure provided by the embodiment of the present disclosure includes a housing 3 with a containing cavity, and a sound pickup hole 4 is provided on the housing 3.
  • the microphone packaging structure provided by the present disclosure also includes the dust-proof structure as described above, and the dust-proof structure is fixedly installed on the sound pickup hole 2.
  • the dust-proof structure can effectively protect the components inside the microphone packaging structure.
  • the shape of the sound pickup hole may be a circle, a square, a triangle, an ellipse, etc., for example.
  • the sound pickup holes can be set to one or more according to needs.
  • the specific location of the sound pickup hole can also be flexibly adjusted according to the specific situation of the microphone packaging structure, which is not limited in the present disclosure.
  • the dust-proof structure may be located outside the housing 3. That is, the sound pickup hole 4 is protected from the outside.
  • the dust-proof structure is installed on the outside of the microphone packaging structure, and the space inside the microphone packaging structure is not occupied.
  • the position of the dustproof structure can be reasonably installed according to the position of the pickup hole 4, so that the dustproof structure can be aligned with the pickup hole 4, so as to prevent external particles and foreign objects from passing through the pickup hole 4. It is introduced into the microphone packaging structure.
  • the present disclosure is not limited to arranging the dust-proof structure outside the housing 3, and the dust-proof structure may also be arranged in the receiving cavity of the housing 3.
  • the present disclosure can flexibly adjust the location of the dust-proof structure according to specific needs.
  • the microphone packaging structure has a housing 3 structure including a substrate 32 and a packaging cover 31, and the substrate 32 and the packaging cover 31 together surround the receiving cavity.
  • the dust-proof structure is contained in the containing cavity of the housing 3.
  • the sound pickup hole is located on the packaging cover 31, and the dust-proof structure is fixedly connected to the packaging cover.
  • the position of the dust-proof structure corresponds to the sound pickup hole 4, which can prevent external particles and foreign objects from being introduced into the microphone packaging structure through the sound pickup hole 4.
  • the sound pickup hole is located on the packaging cover 31, and the dust-proof structure is fixedly connected to the substrate 32 at a position corresponding to the sound pickup hole 4. At this time, the dust-proof structure can effectively protect the chips in the microphone packaging structure.
  • the sound pickup hole 4 is not limited to being opened on the packaging cover 31 of the housing 3, and may also be opened on the substrate 32.
  • the sound pickup hole 4 is located on the substrate 32, and the dust-proof structure is fixedly provided on the substrate 32 at a position corresponding to the sound pickup hole 4.
  • the sound pickup hole 4 is located on the substrate 32, the dustproof structure is fixedly provided on the substrate 32 at a position corresponding to the sound pickup hole 4, and the MEMS chip 5 is provided On the dust-proof structure.
  • the packaging cover 31 has a dish-like structure as a whole, which has an open end.
  • the material of the packaging cover 31 can be, for example, a metal material, a plastic material, or a PCB board.
  • the shape of the packaging cover 31 may be, for example, a cylindrical shape, a rectangular parallelepiped shape, or the like. Those skilled in the art can flexibly adjust according to actual needs, and there is no restriction on this.
  • the substrate 32 may be a circuit board well-known in the art, for example, a PCB board, etc., which is not limited.
  • the packaging cover 31 and the substrate 32 can be fixed together by, for example, adhesive bonding or solder paste welding. Those skilled in the art can flexibly choose according to their needs, and there is no limitation on this.
  • a microphone device is fixedly accommodated in the accommodating cavity of the housing 3.
  • the microphone device may include, for example, a MEMS chip 5 and a signal amplifier 6.
  • the MEMS chip 5 includes a substrate and a sensing film.
  • the substrate is also a hollow structure.
  • the sensing film is, for example, a piezoelectric element, a capacitive element, a piezoresistive element, and the like.
  • the sensing film is arranged at one end of the substrate and covers the hollow structure of the substrate.
  • the hollow structure forms a back cavity.
  • the MEMS chip 5 can be mounted on the substrate 32.
  • the MEMS chip 5 can also be mounted on the package cover 31, for example, a special adhesive can be used to bond the MEMS chip 5 on the package cover 31.
  • the MEMS chip 5 can also be turned on through the circuit layout in the substrate 32 in a flip-chip manner, which belongs to the common knowledge of those skilled in the art, and the present invention will not be described in detail here.
  • the signal amplifier 6 can be mounted on the package cover 31, of course, can also be mounted on the substrate 32.
  • the signal amplifier 6 can be, for example, an ASIC chip.
  • the ASIC chip is connected to the MEMS chip 5.
  • the electrical signal output by the MEMS chip 5 can be transmitted to the ASIC chip, processed and output by the ASIC chip.
  • the MEMS chip 5 and the ASIC chip 6 can be electrically connected through metal wires (bonding wires) to achieve mutual conduction between the two.
  • the MEMS chip 5 and/or the signal amplifier 6 may also be embedded in the substrate 32 or half embedded in the substrate 32.
  • a conductor is provided in the substrate 32, and a pad is provided on the substrate 32.
  • the conductor is, for example, a metalized through hole provided in the substrate 32.
  • the pad is electrically connected to the MEMS chip 5 and the signal amplifier 6 through a conductor.
  • the MEMS chip 5 and the signal amplifier 6 are buried in the substrate 32, at least one metal layer needs to be provided above and below the MEMS chip 5 and the signal amplifier 6 directly opposite. Ground the metal layer as a shield. A plurality of metal conductors are arranged around the MEMS chip 5 and the signal amplifier 6 to form a shielding structure together with the above-mentioned metal layer.
  • the design of embedding the MEMS chip 5 and the signal amplifier 6 in the substrate 32 eliminates the need to cover the surface of the signal amplifier 6 with protective glue, which simplifies the process and improves the optical noise resistance of the product.
  • the embodiment of the present disclosure also provides an electronic device.
  • the electronic device includes the microphone packaging structure as described above.
  • the electronic device may be a mobile phone, a notebook computer, a tablet computer, a VR device, a smart wearable device, etc., which is not limited in the present disclosure.

Abstract

本发明公开了一种防尘结构、麦克风封装结构以及电子设备。该防尘结构包括载体和网格部；所述载体为中空结构，所述载体包括沿高度方向设置的多个支撑层，所述网格部包括网格结构和围绕所述网格结构设置的固定部，所述固定部与所述载体连接，所述网格结构与所述中空结构相对，至少一个所述支撑层的热膨胀系数与该支撑层以外的其他支撑层的热膨胀系数不同。

Description

防尘结构、麦克风封装结构以及电子设备 技术领域
本发明涉及电声转换技术领域，更具体地，本发明涉及一种防尘结构、麦克风封装结构以及电子设备。
背景技术
随着电声技术的快速发展，各种电声产品层出不穷。麦克风作为一种将声音转换为电信号的换能器，是电声产品中非常重要的器件之一。如今，麦克风已经被广泛的应用于手机、平板电脑、笔记本电脑、VR设备、AR设备、智能手表以及智能穿戴等多种不同类型的电子产品中。近年来，对于麦克风封装结构而言，对其结构的设计成为了本领域技术人员研究的重点和热点。
现有的麦克风封装结构通常为：包括具有容纳腔的外壳，在容纳腔内收容固定有芯片组件(例如，MEMS芯片和ASIC芯片)等元器件；并且，在外壳上还设置有拾音孔。然而，在长期的应用中发现，外界的灰尘、杂质等颗粒物和异物很容易经拾音孔而被引入到麦克风的容纳腔中，而这些外界的颗粒物、异物会对容纳腔中的芯片组件等元器件造成一定的损伤，最终会影响到麦克风的声学性能以及使用寿命。
针对上述的问题，目前所采用的解决方案通常是，在麦克风封装结构的拾音孔上设置相应的隔离组件，用以阻挡外界颗粒物、异物等的进入。现有的隔离组件，如图1所示，包括有载体a2和筛网a1。在使用该隔离组件时，将隔离组件安装在拾音孔上。然而，载体a2和筛网a1通常是在平坦的基板上制造的。其目的是保持平面度，以防止筛网a1被破坏。在制作完成后，隔离组件被转移到另一个基板和/或柔性板上。在制作完成后，隔离组件被从晶圆上分离，并组装成为麦克风a4的一部分。
例如，采用芯片键合工艺，并在高温下进行胶粘剂a3固化。隔离组件被加热时，筛网a1和载体a2会的膨胀会根据每种材料的CTE(热膨胀 系数)不同而不同，通常会导致载体的翘曲和/或变形。在温度恢复到室温之前，胶粘剂a3已固化并阻止隔离组件恢复其原始尺寸，因此翘曲和/或变形仍然存在。残留的翘曲和/或变形，会引起筛网a1产生皱纹，甚至导致筛网a1失效或者破损。
发明内容
本发明的一个目的是提供一种防尘结构、麦克风封装结构以及电子设备的新技术方案。
根据本发明的第一方面，提供了一种防尘结构。该防尘结构包括载体和网格部；所述载体为中空结构，所述载体包括沿高度方向设置的多个支撑层，所述网格部包括网格结构和围绕所述网格结构设置的固定部，所述固定部与所述载体连接，所述网格结构与所述中空结构相对，至少一个所述支撑层的热膨胀系数与该支撑层以外的其他支撑层的热膨胀系数不同。
可选地，定义与所述固定部连接的支撑层为第一支撑层，由所述第一支撑层向外依次为第N支撑层，其中N大于或等于2，第N支撑层的热膨胀系数大于第N-1支撑层的热膨胀系数。
可选地，所述支撑层为三个。
可选地，所述载体的材质为有机材料，所述网格部的材质为金属。
可选地，所述网格部还包括连接在所述固定部和所述网格结构之间的应力缓冲区，所述应力缓冲区悬空设置。
可选地，在所述应力缓冲区通过镂空形成弹性结构。
可选地，至少一个所述支撑层由干膜抗蚀剂制备而成。
根据本公开的第二方面，提供了一种麦克风封装结构。该封装结构包括具有容纳腔的外壳，在所述外壳上设置有拾音孔；还包括上述的防尘结构，所述防尘结构设置在所述拾音孔上。
可选地，所述防尘结构位于所述外壳的外部。
可选地，所述外壳包括基板和封装盖，所述基板和所述封装盖围合成所述容纳腔；
所述防尘结构收容在所述容纳腔内。
可选地，拾音孔位于所述封装盖上，所述防尘结构与所述封装盖固定连接。
可选地，拾音孔位于所述封装盖上，所述防尘结构固定连接在所述基板上对应于所述拾音孔的位置。
可选地，拾音孔位于所述基板上，在所述基板上对应于拾音孔的位置固定设置有所述防尘结构。
可选地，拾音孔位于所述基板上，在所述基板上对应于拾音孔的位置固定设置有所述防尘结构，所述MEMS芯片设置在所述防尘结构上。
根据本公开的第三方面，提供了一种电子设备。该电子设备包括上述的麦克风封装结构。
通过以下参照附图对本发明的示例性实施例的详细描述，本发明的其它特征及其优点将会变得清楚。
附图说明
被结合在说明书中并构成说明书的一部分的附图示出了本发明的实施例，并且连同其说明一起用于解释本发明的原理。
图1是现有的隔离组件的侧视图。
图2是根据本公开实施例的一种防尘结构的剖视图。
图3是根据本公开实施例的第二种防尘结构的剖视图。
图4是根据本公开实施例的第三种防尘结构的剖视图。
图5是根据本公开实施例的麦克风封装结构的示意图。
图6是根据本公开实施例的第二种麦克风封装结构的示意图。
图7是根据本公开实施例的第三种麦克风封装结构的示意图。
图8是根据本公开实施例的一种支撑层的俯视图。
图9是根据本公开实施例的一种应力缓冲区的局部视图。
图10是根据本公开实施例的第四种麦克风封装结构的示意图。
图11是根据本公开实施例的第五种麦克风封装结构的示意图。
具体实施方式
现在将参照附图来详细描述本发明的各种示例性实施例。应注意到：除非另外具体说明，否则在这些实施例中阐述的部件和步骤的相对布置、数字表达式和数值不限制本发明的范围。
以下对至少一个示例性实施例的描述实际上仅仅是说明性的，决不作为对本发明及其应用或使用的任何限制。
对于相关领域普通技术人员已知的技术、方法和设备可能不作详细讨论，但在适当情况下，所述技术、方法和设备应当被视为说明书的一部分。
在这里示出和讨论的所有例子中，任何具体值应被解释为仅仅是示例性的，而不是作为限制。因此，示例性实施例的其它例子可以具有不同的值。
应注意到：相似的标号和字母在下面的附图中表示类似项，因此，一旦某一项在一个附图中被定义，则在随后的附图中不需要对其进行进一步讨论。
根据本公开的一个实施例，提供了一种防尘结构。该防尘结构可应用在例如麦克风封装结构上。该防尘结构能有效阻隔外界的颗粒物、异物经麦克风封装结构上的拾音孔进入到麦克风封装结构的内部，从而能有效地保护麦克风内部的各元器件，以避免影响到MEMS麦克风芯片的声学性能和使用寿命。
如图2-3所示，该防尘结构包括有载体1以及网格部2。
其中，所述载体11为中空结构104，并在所述中空结构104内部形成气流通道，用以供振动气流通过。所述载体1包括层叠设置的多个支撑层。例如，第一支撑层101，第二支撑层102，第三支撑层103。当然，支撑层的数量在此不做限定，本领域技术人员可以根据实际需要进行设置。
例如，支撑层呈环形，例如圆环形、矩形环形、跑道形或者其他形状的环形结构。多个支撑层连接在一起，以形成层叠结构。
例如，多个支撑层的横截面相同，以形成壁厚均匀地载体1。
例如，多个支撑层的横截面不同，只要能层叠在一起，以形成中空结构104即可。
至少一个所述支撑层形成应力消除部，所述应力消除部具有与其所在 支撑层以外的其他支撑层不同的材质。不同的材质例如是该支撑层与其他支撑层的热膨胀系数不同。热膨胀系数是指单位温度变化所导致支撑层的长度量值的变化。热膨胀系数不同，导致载体在受热、冷却过程中，热膨胀系数较高的支撑层能吸收更多的形变，使得载体1的应力减小。
在本公开实施例中，通过设置应力消除部，能够有效地吸收载体1的翘曲和/或变形，从而减少甚至避免网格部2的产生皱纹或者破损。
支撑层的材质可以是但不限于有机材料、无机非金属材料或者金属材料。例如，有机材料包括塑料等。无机非金属材料包括硅、氧化硅、氮化硅等。金属材料包括不锈钢、铜合金、铝合金、金、银等。
当然，载体1的材质不限于上述实施例，本领域技术人员可以根据实际需要进行设置。
载体1的横截面呈长方形、圆形、椭圆形、六边形等。例如，在该例子中，载体1的横截面呈正方形，其边长为800μm-1500μm。正方形的边长相等，变形小。
中空结构104的横截面呈圆形、椭圆形、三角形、长方形、六边形、跑道形等。例如，中空结构104的横截面呈圆形，其直径为500μm-1200μm。
所述网格部2设置在所述载体1的一端并覆盖所述中空结构104。所述网格部2包括网格结构、围绕所述网格结构设置的边缘部110。所述网格结构21与所述中空结构104相对。网格结构形成有筛网。筛网具有设定的目数，从而能够将外部的杂质、灰尘、颗粒等过滤掉。本领域技术人员可以根据实际需要设置筛网的目数。
所述边缘部110与所述载体1连接。例如，通过粘结剂或者键合的方式将所述固定部22与载体1的边缘部110连接。
在一个例子中，定义与所述固定部连接的支撑层为第一支撑层101，由所述第一支撑层101向外依次为第N支撑层，其中N大于或等于2，第N支撑层的热膨胀系数大于第N-1支撑层的热膨胀系数。
例如，如图3所示，在该例子中，设置有层叠在一起的三个支撑层。第一支撑层101与固定部连接。第三支撑层103用于与外部设备连接。例 如，通过粘结剂将第三支撑层103粘结在外部设备的PCB上。第二支撑层102的热膨胀系数大于第一支撑层101的热膨胀系数。第三支撑层103的热膨胀系数大于第二支撑层102的热膨胀系数。
在该例子中，与网格部2连接的支撑层(例如第一支撑层101)的热膨胀系数最小，通过这种方式，能保证网格部2所在的部位在外部温度发生变化时，变形最小。
此外，与外部设备连接的支撑层(例如第三支撑层103)的热膨胀系数最大，能使得该支撑层吸收变形的能力更强，从而使得载体的应力减小。
此外，第一支撑层101到第N支撑层的热膨胀系数逐渐增加，能够使得不同的支撑层的收缩、膨胀更适应，载体不会发生塑性形变、甚至断裂的现象。
在一个例子中，载体1的材质为有机材料，网格部的材质为金属。例如各个支撑层由热膨胀系数不同的塑料制备而成。网格部由金属材料制备而成。网格部的弹性变形能力强，不易形成褶皱。有机材料的弹性大，有利于吸收变形。
在一个例子中，如图2所示，所述支撑层为两层，例如第一支撑层101和第二支撑层102。两个支撑层101,102连接在一起。该载体1的结构简单。在其中一个支撑层(例如，第二支撑层102)设置有应力消除部；另一个支撑层(例如，第一支撑层101)为实体结构。
例如，至少一个所述支撑层由干膜抗蚀剂制备而成。例如通过干膜抗蚀剂形成设定的图案，再蚀刻掉多余部位以形成中空结构104等，最终形成支撑层。干膜抗蚀剂具有成型精度高的特点。
在一个例子中，如图3所示，至少一个所述支撑层具有沿高度方向延伸的沟槽102a，至少一个所述支撑层为实体结构。沟槽102a的设置能够有效地吸收载体1的形变，避免网格部2发生褶皱。
沟槽102a的截面形状为圆形、矩形、弧形、椭圆形、三角形或者其他形状。上述沟槽102a均能吸收变形。
例如，与网格部2连接的支撑层(例如，第一支撑层101)为实体结构，位于该支撑层(例如，第一支撑层101)下方的支撑层(例如，第二 支撑层102)具有所述沟槽102a。在该例子中，第二支撑层102能有效地吸收载体1的变形。
此外，第一支撑层101能够配合防尘结构的取、放。例如，采用抓取或者真空吸取的方式转移防尘结构。转移设备的夹爪或者吸嘴对第一支撑层101施力，由于第一支撑层101为实体结构，故具有较高的结构强度。相比于第二支撑层102，第一支撑层101更不易被夹爪或者吸嘴损坏，从而在取、放过程中，能保持防尘结构的完整。
当然，在其他示例中，第一支撑层101和第二支撑层102的位置互换，可以采用真空吸取的方式对防尘结构进行取、放。
在一个例子中，如图8所示，所述沟槽102a为多个，并且均匀地分布在应力消除部所在的支撑层上。例如，第二支撑层102上形成有多个沟槽102a。多个分布在第二支撑层102的端面上的不同部位。通过这种方式，多个沟槽102a能够吸收载体1的来自不同方位的变形。
例如，多个沟槽102a围绕中空结构104均匀分布。通过这种方式，载体1的吸收变形的能力更强。
在一个例子中，如图8所示，所述通孔包括同心设置的多个弧形的沟槽102a。相邻的弧形的沟槽102a之间形成连接部112。例如，中空结构104的横截面呈圆形。多个弧形的沟槽102a围绕中空结构104设置。弧形的沟槽102a相对于中空结构104的中心同心设置。弧形的沟槽102a能够有效地吸收边缘部110的变形。
例如，如图8所示，弧形的沟槽102a为四个，并且分别覆盖正方形的载体1的四个角部，并且相对于对角连线呈对称结构，或者覆盖四条边，相对于所在边的中垂线呈对称结构。这种设置方式使得弹性结构的吸收变形能力更均衡。
在一个例子中，如图8所示，在所述载体1的径向设置有多层所述弧形的沟槽102a。例如，多层弧形的沟槽102a沿径向排列。每层设置有多个所述弧形的沟槽102a。多层的弧形的沟槽102a能够更有效地吸收载体1的变形，减小应力集中。
此外，多层之间以及每层的连接部112一起形成骨架结构，这种结构 具有更大的弹性回复力，使得载体1的回复变形能力更强。
例如，弧形的沟槽102a的层数小于5层。这使得载体1的结构强度以及抗变形能力更强。图8中所述弧形的沟槽102a为2层，从而使得载体1的结构变得简单。
在一个例子中，如图8所示，相邻的两层的连接部112错开设置。也就是说，在两个连接部112没有位于同一条直径方向上。通过这种方式，连接部112与各层至今的部分能够形成网格连接。这样，只要载体1的局部发生形变，那么这种形变会经由网格连接扩散到其他部分，形变会分散在网格连接的各个部位。这使得弹性结构相对于中空结构104的各个方向的吸收变形的能力更均衡。
还可以是，多层的连接部112连接在一起，以形成辐射状。在该例子中，多层的位置相对应的弧形的沟槽102a分布在相同的扇形结构内。辐射状的连接结构使得弹性结构的强度更大。
在一个例子中，所述缓冲部的内侧形成封闭的环形壁部。环形壁部能够对弹性结构形成屏障，提高了弹性结构的耐用性。
在一个例子中，如图4所示，所述网格部2包括有网格结构21、围绕所述网格结构设置的应力缓冲区23以及围绕所述应力缓冲区23设置的固定部22。其中，所述网格结构21与所述应力缓冲区23为悬空设置。其中，所述固定部22可用于将所述网格部2与所述载体1连接起来，例如固定部22与边缘部连接，以使所述网格部2能够稳定的覆盖在所述载体1上。应力缓冲区23为预留出来未设置网孔，也未与边缘部连接的区域。应力缓冲区23能够进一步减弱载体的变形对网格结构的影响。
在一个例子中，如图4所示，在第一支撑层101的与应力缓冲区23对应的部位做去料处理，以形成台阶结构101a，从而使得应力缓冲区23悬空设置。
所述应力缓冲区23为具有预定宽度α的环状结构。需要说明的是，所述应力缓冲区23例如可以为具有预定宽度α的圆环状结构，也可以为具有预定宽度α的方环结构，或者是具有预定宽度α的其它环状结构，本领域技术人员可以根据具体情况灵活的进行调整，本公开对此不作限制。
在一个例子中，如图9所示，在所述应力缓冲区23通过镂空形成弹性结构。例如，在应力缓冲区23通过镂空处理以形成弹性伸缩结构23a。镂空的孔与网格结构之间形成环形带23b，以保证网格结构21具有足够的强度。弹性伸缩结构23a能够发生弹性形变，从而吸收载体1的形变。这使得载体1的形变不会传递到网格结构21上。图9中A表示收缩状态，B表示伸张状态。
图3是根据本公开的另一个实施例的防尘结构的剖视图。在该例子中，载体还包括第三支撑层103。第三支撑层103为实体结构，并且连接在第二支撑层102的下端面上。在该例子中，第三支撑层103起到了加强结构的作用，能防止沟槽102a外露，这使得载体的结构强度更高。
在其他示例中，在第一支撑层101、第三支撑层103的至少一个上设置有所述沟槽102a。这种设置方式同样能够起到吸收载体的变形的作用。
根据本公开的另一个实施例，提供了一种麦克风封装结构。所述麦克风封装结构可应用于例如手机、笔记本电脑、平板电脑、游戏机、对讲机、VR设备以及智能穿戴设备等多种类型的电子产品中。
该麦克风封装结构，能够有效避免内部的芯片组件等元器件受到外部灰尘、杂质等颗粒物、异物的影响而遭到破坏的现象，可以延长MEMS麦克风芯片的使用寿命，而且还能使MEMS麦克风芯片保持优良的声学性能。
以下就本公开实施例提供的麦克风封装结构的具体结构进行进一步地说明。
如图5-7以及10-11所示，本公开实施例提供的麦克风封装结构，其包括具有容纳腔的外壳3，在所述外壳3上设置有拾音孔4。本公开提供的麦克风封装结构还包括如上所述的防尘结构，所述防尘结构被固定安装在所述拾音孔2上。防尘结构能有效保护麦克风封装结构内部的元器件。
在一个例子中，所述拾音孔的形状例如可以为圆形、方形、三角形、椭圆形等。所述拾音孔可以根据需要设置为一个或者多个。所述拾音孔的具体设置位置也可以根据麦克风封装结构的具体情况灵活进行调整，本公开对此不作限制。
在一个例子中，如图5所示，所述防尘结构可以位于所述外壳3的外 部。即，从外部对拾音孔4进行防护。在本例子中，将防尘结构安装在麦克风封装结构的外部，不占用麦克风封装结构内部的空间。在安装防尘结构时，可以根据拾音孔4的位置，合理安装防尘结构的位置，以使防尘结构能对准拾音孔4，从而能避免外界的颗粒物、异物经拾音孔4而引入到麦克风封装结构内部。
当然，本公开中并不限于将防尘结构设置在外壳3的外部，也可以将防尘结构设置在外壳3的容纳腔中。本领域技术人员可以根据具体需要灵活调整防尘结构的设置位置。
在一个例子中，麦克风封装结构，其外壳3的结构为：包括基板32和封装盖31，并由所述基板32和所述封装盖31一起围合成所述容纳腔。所述防尘结构收容在外壳3的容纳腔内。
在一个例子中，如图6所示，拾音孔位于所述封装盖31上，所述防尘结构与所述封装盖固定连接。防尘结构的位置对应于拾音孔4，能避免外界的颗粒物、异物经拾音孔4而引入到麦克风封装结构内部。
在一个例子中，如图7所示，拾音孔位于所述封装盖31上，所述防尘结构固定连接在所述基板32上对应于所述拾音孔4的位置。此时，防尘结构能对麦克风封装结构内的芯片进行有效的保护。
在本发明中，拾音孔4并不限于开设在外壳3的封装盖31上，也可以开设在基板32上。例如，如图10所示，拾音孔4位于所述基板32上，在所述基板32上对应于拾音孔4的位置固定设置有所述防尘结构。又例如，如图11所示，拾音孔4位于所述基板32上，在所述基板32上对应于拾音孔4的位置固定设置有所述防尘结构，且所述MEMS芯片5设置在所述防尘结构上。需要说明的是，当将拾音孔4开设在基板32上时，本领域技术人员可以根据具体情况调整防尘结构的安装位置，只要能阻止外界的颗粒物、异物进入或者能对内部芯片进行保护即可，对此不作限制。
其中，所述封装盖31整体呈皿状结构，其具有敞开端。所述封装盖31的材质例如可以为金属材料、塑料材料或者PCB板等。所述封装盖31的形状例如可以为圆柱状、长方体状等。本领域技术人员可以根据实际需要灵活调整，对此不作限制。
其中，所述基板32可以采用本领域熟知的电路板，例如可以采用PCB板等，对此不作限制。所述封装盖31与所述基板32之间例如可以通过粘结剂粘接或者锡膏焊接结合固定在一起，本领域技术人员可以根据需要灵活选择，对此不作限制。
本发明提供的麦克风封装结构，在外壳3的容纳腔中固定收容有麦克风器件。具体地，如图5-7以及10-11所示，所述麦克风器件例如可以包括有MEMS芯片5和信号放大器6。
其中，所述MEMS芯片5包括有衬底和感应膜。衬底也为中空结构。感应膜例如为压电元件、电容元件、压阻元件等。感应膜设置在衬底的一端，并覆盖衬底的中空结构。该中空结构形成背腔。在收容腔内固定MEMS芯片5时，MEMS芯片5可以贴装在基板32上。当然，MEMS芯片5也可以贴装在封装盖31上，例如可以采用专门的胶黏剂将MEMS芯片5粘接在封装盖31上。MEMS芯片5也可以采用倒装的方式通过基板32中的电路布图导通，这属于本领域技术人员的公知常识，本发明在此不再具体说明。
其中，所述信号放大器6可以贴装在封装盖31，当然也可以贴装在基板32上。信号放大器6例如可以采用ASIC芯片。ASIC芯片与MEMS芯片5连接。MEMS芯片5输出的电信号可以传输到ASIC芯片中，并被ASIC芯片处理、输出。MEMS芯片5与ASIC芯片6之间可以通过金属导线(焊线)进行电性连接，以实现二者之间的相互导通。
此外，MEMS芯片5和/或信号放大器6也可以埋入到基板32内，或者半埋入基板32内。例如，在基板32内设置导体，并在基板32上设置焊盘。导体例如为设置在基板32内的金属化通孔。焊盘与MEMS芯片5、信号放大器6通过导体电连接。将MEMS芯片5和信号放大器6埋设到基板32内的设计，有助于实现麦克风的小型化。
需要说明的是，当将MEMS芯片5和信号放大器6埋入基板32内时，需要在MEMS芯片5和信号放大器6正对的上方和下方至少各设置一层金属层。将金属层接地作为屏蔽。MEMS芯片5和信号放大器6周围区域布置有多个金属导体，用于与上述金属层一起构成屏蔽结构。将MEMS芯片5和信号放大器6埋入基板32内的设计，使得不必在信号放大器6表面包覆保护 胶，这样可以简化工艺，同时提升了产品的光噪声抵抗能力。
本公开实施例还提供了一种电子设备。所述电子设备包括如前所述的麦克风封装结构。
其中，所述电子设备可以是手机、笔记本电脑、平板电脑、VR设备、智能穿戴设备等，本公开对此不作限制。
虽然已经通过例子对本发明的一些特定实施例进行了详细说明，但是本领域的技术人员应该理解，以上例子仅是为了进行说明，而不是为了限制本发明的范围。本领域的技术人员应该理解，可在不脱离本发明的范围和精神的情况下，对以上实施例进行修改。本发明的范围由所附权利要求来限定。

Claims (15)

  1. 一种防尘结构，其特征在于：包括载体和网格部；
    所述载体为中空结构，所述载体包括沿高度方向设置的多个支撑层，
    所述网格部包括网格结构和围绕所述网格结构设置的固定部，所述固定部与所述载体连接，所述网格结构与所述中空结构相对，至少一个所述支撑层的热膨胀系数与该支撑层以外的其他支撑层的热膨胀系数不同。
  2. 根据权利要求1所述的防尘结构，其特征在于：定义与所述固定部连接的支撑层为第一支撑层，由所述第一支撑层向外依次为第N支撑层，其中N大于或等于2，第N支撑层的热膨胀系数大于第N-1支撑层的热膨胀系数。
  3. 根据权利要求2所述的防尘结构，其特征在于：所述支撑层为三个。
  4. 根据权利要求1所述的防尘结构，其特征在于：所述载体的材质为有机材料，所述网格部的材质为金属。
  5. 根据权利要求1所述的防尘结构，其特征在于：所述网格部还包括连接在所述固定部和所述网格结构之间的应力缓冲区，所述应力缓冲区悬空设置。
  6. 根据权利要求5所述的防尘结构，其特征在于：在所述应力缓冲区通过镂空形成弹性结构。
  7. 根据权利要求1所述的防尘结构，其特征在于：至少一个所述支撑层由干膜抗蚀剂制备而成。
  8. 一种麦克风封装结构，其特征在于：包括具有容纳腔的外壳，在所述外壳上设置有拾音孔；
    还包括如权利要求1-7中任意一项所述的防尘结构，所述防尘结构设置在所述拾音孔上。
  9. 根据权利要求8所述的麦克风封装结构，其特征在于：所述防尘结构位于所述外壳的外部。
  10. 根据权利要求8所述的麦克风封装结构，其特征在于：所述外壳包括基板和封装盖，所述基板和所述封装盖围合成所述容纳腔；
    所述防尘结构收容在所述容纳腔内。
  11. 根据权利要求8所述的麦克风封装结构，其特征在于：拾音孔位于所述封装盖上，所述防尘结构与所述封装盖固定连接。
  12. 根据权利要求8所述的麦克风封装结构，其特征在于：拾音孔位于所述封装盖上，所述防尘结构固定连接在所述基板上对应于所述拾音孔的位置。
  13. 根据权利要求8所述的麦克风封装结构，其特征在于：拾音孔位于所述基板上，在所述基板上对应于拾音孔的位置固定设置有所述防尘结构。
  14. 根据权利要求8所述的麦克风封装结构，其特征在于：拾音孔位于所述基板上，在所述基板上对应于拾音孔的位置固定设置有所述防尘结构，所述MEMS芯片设置在所述防尘结构上。
  15. 一种电子设备，其特征在于：包括如权利要求8-14中任意一项所述的麦克风封装结构。
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