CN108124228A - 麦克风芯片及麦克风 - Google Patents
麦克风芯片及麦克风 Download PDFInfo
- Publication number
- CN108124228A CN108124228A CN201810167622.1A CN201810167622A CN108124228A CN 108124228 A CN108124228 A CN 108124228A CN 201810167622 A CN201810167622 A CN 201810167622A CN 108124228 A CN108124228 A CN 108124228A
- Authority
- CN
- China
- Prior art keywords
- chip
- microphone
- substrate
- support member
- vibrating diaphragm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 61
- 239000012790 adhesive layer Substances 0.000 claims abstract description 14
- 239000010410 layer Substances 0.000 claims description 14
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 9
- 238000005538 encapsulation Methods 0.000 abstract description 7
- 230000035945 sensitivity Effects 0.000 abstract description 7
- 239000003292 glue Substances 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 3
- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 239000004831 Hot glue Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/003—Mems transducers or their use
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810167622.1A CN108124228A (zh) | 2018-02-28 | 2018-02-28 | 麦克风芯片及麦克风 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810167622.1A CN108124228A (zh) | 2018-02-28 | 2018-02-28 | 麦克风芯片及麦克风 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN108124228A true CN108124228A (zh) | 2018-06-05 |
Family
ID=62234569
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810167622.1A Pending CN108124228A (zh) | 2018-02-28 | 2018-02-28 | 麦克风芯片及麦克风 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN108124228A (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109703157A (zh) * | 2019-03-01 | 2019-05-03 | 络派科技(深圳)有限公司 | 用于mems的膜组件及其制造方法 |
CN111050257A (zh) * | 2019-12-31 | 2020-04-21 | 歌尔股份有限公司 | 防尘结构、麦克风封装结构以及电子设备 |
CN111422820A (zh) * | 2020-03-30 | 2020-07-17 | 歌尔微电子有限公司 | 传感器的封装结构及封装方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101141835A (zh) * | 2006-09-04 | 2008-03-12 | 雅马哈株式会社 | 半导体传声器单元 |
CN204733382U (zh) * | 2015-06-30 | 2015-10-28 | 歌尔声学股份有限公司 | 一种mems麦克风 |
CN207854170U (zh) * | 2018-02-28 | 2018-09-11 | 上海微联传感科技有限公司 | 麦克风芯片及麦克风 |
-
2018
- 2018-02-28 CN CN201810167622.1A patent/CN108124228A/zh active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101141835A (zh) * | 2006-09-04 | 2008-03-12 | 雅马哈株式会社 | 半导体传声器单元 |
CN204733382U (zh) * | 2015-06-30 | 2015-10-28 | 歌尔声学股份有限公司 | 一种mems麦克风 |
CN207854170U (zh) * | 2018-02-28 | 2018-09-11 | 上海微联传感科技有限公司 | 麦克风芯片及麦克风 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109703157A (zh) * | 2019-03-01 | 2019-05-03 | 络派科技(深圳)有限公司 | 用于mems的膜组件及其制造方法 |
CN109703157B (zh) * | 2019-03-01 | 2020-08-11 | 络派科技(深圳)有限公司 | 用于mems的膜组件及其制造方法 |
CN111050257A (zh) * | 2019-12-31 | 2020-04-21 | 歌尔股份有限公司 | 防尘结构、麦克风封装结构以及电子设备 |
CN111422820A (zh) * | 2020-03-30 | 2020-07-17 | 歌尔微电子有限公司 | 传感器的封装结构及封装方法 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP3094112B1 (en) | Silicon mems microphone and manufacturing method therefor | |
US9236275B2 (en) | MEMS acoustic transducer and method for fabricating the same | |
US4558184A (en) | Integrated capacitive transducer | |
EP3249952B1 (en) | Integrated structure of mems microphone and pressure sensor, and manufacturing method thereof | |
US7386136B2 (en) | Sound detecting mechanism | |
CN103139691B (zh) | 采用多孔soi硅硅键合的mems硅麦克风及其制造方法 | |
US20180091906A1 (en) | Mems device and process | |
CN110022519B (zh) | 微机电系统麦克风 | |
CN108124228A (zh) | 麦克风芯片及麦克风 | |
US8436435B2 (en) | MEMS capacitive microphone | |
US8428281B2 (en) | Small hearing aid | |
US10425744B2 (en) | Microphone and manufacturing method thereof | |
KR101703628B1 (ko) | 마이크로폰 및 그 제조방법 | |
CN104378724A (zh) | 一种无背部大声学腔体的mems硅麦克风 | |
US11459230B2 (en) | MEMS microphone | |
CN203104765U (zh) | 采用多孔soi硅硅键合的mems硅麦克风 | |
US9936584B2 (en) | Printed circuit board, waterproof microphone and production process thereof | |
US10277983B2 (en) | Microphone device | |
CN101371614A (zh) | 用于电容式传声器隔膜的支撑设备 | |
CN207854170U (zh) | 麦克风芯片及麦克风 | |
CN104754480A (zh) | 微型机电系统麦克风及其制造方法 | |
US20230234837A1 (en) | Mems microphone with an anchor | |
CN112104961B (zh) | 微机电结构与mems麦克风 | |
CN109327784B (zh) | 一种无边框设备的mems麦克风 | |
US20190100429A1 (en) | Mems devices and processes |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20190123 Address after: Room 118, Building 20, No. 83 Lane 1-42, Hongxiang North Road, Wanxiang Town, Pudong New Area, Shanghai, 201318 Applicant after: Maigan Microelectronics (Shanghai) Co.,Ltd. Address before: 201203 2, 3 building, 439 Chunchun Road, Pudong New Area, Shanghai. Applicant before: MICROLINK SENSTECH SHANGHAI Ltd. |
|
TA01 | Transfer of patent application right |
Effective date of registration: 20240426 Address after: 214135 China Sensor Network International Innovation Park F2, 200 Linghu Avenue, Xinwu District, Wuxi City, Jiangsu Province Applicant after: SV SENSTECH (WUXI) CO.,LTD. Country or region after: China Address before: Room 118, Building 20, No. 83 Lane 1-42, Hongxiang North Road, Wanxiang Town, Pudong New Area, Shanghai, 201318 Applicant before: Maigan Microelectronics (Shanghai) Co.,Ltd. Country or region before: China |