CN104760924B - 一种mems麦克风芯片及其封装结构 - Google Patents
一种mems麦克风芯片及其封装结构 Download PDFInfo
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- CN104760924B CN104760924B CN201510187682.6A CN201510187682A CN104760924B CN 104760924 B CN104760924 B CN 104760924B CN 201510187682 A CN201510187682 A CN 201510187682A CN 104760924 B CN104760924 B CN 104760924B
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- mems microphone
- microphone chip
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- vibrating diaphragm
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- 239000000758 substrate Substances 0.000 claims abstract description 53
- 239000000428 dust Substances 0.000 claims abstract description 46
- 239000002210 silicon-based material Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 abstract description 9
- 238000010276 construction Methods 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000004806 packaging method and process Methods 0.000 abstract description 4
- 238000012536 packaging technology Methods 0.000 abstract description 3
- 230000001133 acceleration Effects 0.000 abstract description 2
- 238000005516 engineering process Methods 0.000 description 5
- 238000005530 etching Methods 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 241000209140 Triticum Species 0.000 description 2
- 235000021307 Triticum Nutrition 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- -1 wherein Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
Landscapes
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510187682.6A CN104760924B (zh) | 2015-04-20 | 2015-04-20 | 一种mems麦克风芯片及其封装结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510187682.6A CN104760924B (zh) | 2015-04-20 | 2015-04-20 | 一种mems麦克风芯片及其封装结构 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104760924A CN104760924A (zh) | 2015-07-08 |
CN104760924B true CN104760924B (zh) | 2017-06-06 |
Family
ID=53643095
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510187682.6A Active CN104760924B (zh) | 2015-04-20 | 2015-04-20 | 一种mems麦克风芯片及其封装结构 |
Country Status (1)
Country | Link |
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CN (1) | CN104760924B (zh) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105611720B (zh) * | 2016-03-14 | 2018-09-14 | 江苏普诺威电子股份有限公司 | Pcb声腔结构及其加工方法 |
CN107770707A (zh) * | 2016-08-22 | 2018-03-06 | 上海微联传感科技有限公司 | 一种mems麦克风 |
US10773950B2 (en) | 2016-10-08 | 2020-09-15 | Weifang Goertek Microelectronics Co., Ltd. | MEMS microphone device and electronics apparatus |
US10689248B2 (en) * | 2017-03-16 | 2020-06-23 | Advanced Semiconductor Engineering, Inc. | Semiconductor device package and method of manufacturing the same |
CN107200300B (zh) * | 2017-04-26 | 2023-07-21 | 潍坊歌尔微电子有限公司 | Mems器件及封装结构制作方法 |
US11014806B2 (en) * | 2017-05-18 | 2021-05-25 | Advanced Semiconductor Engineering, Inc. | Semiconductor device package and a method of manufacturing the same |
CN107105378A (zh) * | 2017-06-05 | 2017-08-29 | 歌尔股份有限公司 | Mems芯片、麦克风及制作方法与封装方法 |
CN110775939A (zh) * | 2019-10-31 | 2020-02-11 | 歌尔股份有限公司 | 微纳米结构组件制造方法、以及以该法制造的微纳米结构组件 |
CN111031461A (zh) * | 2019-12-31 | 2020-04-17 | 歌尔股份有限公司 | 一种用于mems器件的防尘结构及mems麦克风封装结构 |
CN111050257A (zh) * | 2019-12-31 | 2020-04-21 | 歌尔股份有限公司 | 防尘结构、麦克风封装结构以及电子设备 |
CN110933579A (zh) * | 2019-12-31 | 2020-03-27 | 歌尔股份有限公司 | 防尘结构、麦克风封装结构以及电子设备 |
CN111147995A (zh) * | 2019-12-31 | 2020-05-12 | 歌尔股份有限公司 | 防尘结构、麦克风封装结构以及电子设备 |
CN110944276A (zh) * | 2019-12-31 | 2020-03-31 | 歌尔股份有限公司 | 用于mems器件的防尘结构及mems麦克风封装结构 |
CN111510836B (zh) * | 2020-03-31 | 2022-08-16 | 歌尔微电子有限公司 | Mems封装结构及mems麦克风 |
CN111711906B (zh) * | 2020-06-30 | 2021-10-22 | 歌尔微电子有限公司 | 微型麦克风防尘装置及mems麦克风 |
CN112087696B (zh) * | 2020-06-30 | 2022-01-07 | 歌尔微电子有限公司 | 微型麦克风防尘装置及mems麦克风 |
CN114513730B (zh) * | 2022-04-20 | 2022-08-23 | 苏州敏芯微电子技术股份有限公司 | 麦克风组件及电子设备 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101106839A (zh) * | 2006-07-10 | 2008-01-16 | 雅马哈株式会社 | 压力传感器及其制造方法 |
CN202334882U (zh) * | 2011-11-30 | 2012-07-11 | 歌尔声学股份有限公司 | Mems麦克风 |
CN202425037U (zh) * | 2012-01-13 | 2012-09-05 | 歌尔声学股份有限公司 | Mems麦克风 |
CN203368747U (zh) * | 2013-05-28 | 2013-12-25 | 上海耐普微电子有限公司 | 微机械麦克风及包含所述微机械麦克风的电子设备 |
CN203883992U (zh) * | 2014-05-05 | 2014-10-15 | 歌尔声学股份有限公司 | 一种mems麦克风 |
CN204550046U (zh) * | 2015-04-20 | 2015-08-12 | 歌尔声学股份有限公司 | 一种mems麦克风芯片及其封装结构 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008022332A (ja) * | 2006-07-13 | 2008-01-31 | Yamaha Corp | 振動膜ユニット、これを備えるシリコンマイクロホン、および振動膜ユニットの製造方法 |
EP2252077B1 (en) * | 2009-05-11 | 2012-07-11 | STMicroelectronics Srl | Assembly of a capacitive acoustic transducer of the microelectromechanical type and package thereof |
JP2010268412A (ja) * | 2009-05-18 | 2010-11-25 | Panasonic Corp | Memsマイクロフォン半導体装置及びその製造方法 |
US20140093095A1 (en) * | 2012-09-28 | 2014-04-03 | Nokia Corporation | Porous cover structures for mobile device audio |
-
2015
- 2015-04-20 CN CN201510187682.6A patent/CN104760924B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101106839A (zh) * | 2006-07-10 | 2008-01-16 | 雅马哈株式会社 | 压力传感器及其制造方法 |
CN202334882U (zh) * | 2011-11-30 | 2012-07-11 | 歌尔声学股份有限公司 | Mems麦克风 |
CN202425037U (zh) * | 2012-01-13 | 2012-09-05 | 歌尔声学股份有限公司 | Mems麦克风 |
CN203368747U (zh) * | 2013-05-28 | 2013-12-25 | 上海耐普微电子有限公司 | 微机械麦克风及包含所述微机械麦克风的电子设备 |
CN203883992U (zh) * | 2014-05-05 | 2014-10-15 | 歌尔声学股份有限公司 | 一种mems麦克风 |
CN204550046U (zh) * | 2015-04-20 | 2015-08-12 | 歌尔声学股份有限公司 | 一种mems麦克风芯片及其封装结构 |
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CN104760924A (zh) | 2015-07-08 |
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Address after: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Applicant after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Applicant before: Goertek Inc. |
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Effective date of registration: 20200608 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |
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