WO2021135118A1 - 防尘结构、麦克风封装结构以及电子设备 - Google Patents

防尘结构、麦克风封装结构以及电子设备 Download PDF

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Publication number
WO2021135118A1
WO2021135118A1 PCT/CN2020/099244 CN2020099244W WO2021135118A1 WO 2021135118 A1 WO2021135118 A1 WO 2021135118A1 CN 2020099244 W CN2020099244 W CN 2020099244W WO 2021135118 A1 WO2021135118 A1 WO 2021135118A1
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WIPO (PCT)
Prior art keywords
mesh
dust
meshes
microphone
structure according
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PCT/CN2020/099244
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English (en)
French (fr)
Inventor
林育菁
佐佐木宽充
畠山庸平
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潍坊歌尔微电子有限公司
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Publication of WO2021135118A1 publication Critical patent/WO2021135118A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use

Definitions

  • the present invention relates to the technical field of electro-acoustic conversion, and more specifically, the present invention relates to a dustproof structure, a microphone packaging structure, and an electronic device.
  • the microphone as a transducer that converts sound into electrical signals, is one of the most important devices in electroacoustic products.
  • microphones have been widely used in many different types of electronic products such as mobile phones, tablet computers, notebook computers, VR devices, AR devices, smart watches and smart wearables.
  • the design of the structure has become the focus and focus of research by those skilled in the art.
  • the existing microphone packaging structure usually includes a housing with a accommodating cavity in which components such as chip components (for example, MEMS chips and ASIC chips) are housed and fixed; and a sound pickup hole is also provided on the housing.
  • chip components for example, MEMS chips and ASIC chips
  • a sound pickup hole is also provided on the housing.
  • the currently adopted solution is usually to provide an isolation component for blocking the entry of foreign particles, foreign objects, etc., on the pickup hole of the microphone packaging structure.
  • the existing isolation components usually include a carrier and an isolation net.
  • the number of holes usually opened on it is small, and this will make the opening rate of the isolation net lower.
  • the low aperture ratio of the isolation net will greatly reduce the signal-to-noise ratio (SNR) of the microphone, thereby affecting the acoustic performance of the microphone.
  • SNR signal-to-noise ratio
  • An object of the present invention is to provide a new technical solution for a dust-proof structure, a microphone packaging structure, and an electronic device.
  • a dust-proof structure including a carrier and a grid part
  • the carrier is a hollow structure
  • the mesh part includes a filter screen and a fixing part arranged around the filter screen; wherein a mesh structure is formed on the filter screen; the sum of the area of each mesh on the mesh structure and the mesh The area ratio of the part is the aperture ratio of the mesh part, and the aperture ratio of the mesh part is ⁇ 75%;
  • the grid part is arranged at one end of the carrier and covers the hollow structure, the filter screen is opposite to the hollow structure, and the fixing part is connected to the carrier.
  • the mesh structure has a double helix shape.
  • the mesh structure includes a plurality of meshes arranged in a matrix, and the matrix is a hexagonal structure;
  • each of the meshes is hexagonal.
  • the mesh structure is in the shape of an Archimedes spiral.
  • the mesh structure includes a plurality of first meshes and a plurality of second meshes;
  • first mesh and the second mesh are both oval or racetrack-shaped, and the aperture sizes of the first mesh and the second mesh are different.
  • the mesh structure is in the shape of a spider web.
  • the mesh structure includes a plurality of meshes, and the plurality of meshes are connected together to form a wave-shaped structure.
  • the boundary portion of each of the meshes along the length direction is L-shaped.
  • the mesh structure includes multiple rows of mesh units arranged in a concentric ring;
  • each column of the mesh unit includes a plurality of arc-shaped meshes.
  • the central angles of the plurality of arc meshes are equal.
  • the mesh structure includes a central hole and a plurality of first meshes uniformly arranged around the central hole, a second mesh is arranged between any two adjacent first meshes, and the first mesh The two meshes extend to the edge position of the mesh structure, and a plurality of third meshes are evenly arranged between any two adjacent second meshes.
  • the flatness of the region within 20 ⁇ m from the edge of the mesh structure is less than 25 ⁇ m.
  • a microphone packaging structure includes a housing with an accommodating cavity, and a sound pickup hole is provided on the housing, and the sound pickup hole is used to communicate the inside and the outside of the housing;
  • the dust-proof structure is arranged on the sound pickup hole.
  • the dust-proof structure is located outside the housing.
  • the housing includes a substrate and a packaging cover, and the substrate and the packaging cover surround the containing cavity;
  • the dust-proof structure is contained in the containing cavity
  • the microphone device includes a MEMS chip and a signal amplifier.
  • the sound pickup hole is located on the packaging cover, and the dust-proof structure is fixedly connected to the packaging cover.
  • the sound pickup hole is located on the packaging cover, and the dust-proof structure is fixedly connected to the substrate to cover the MEMS chip.
  • the sound pickup hole is located on the substrate, and the dust-proof structure is fixedly provided on the substrate at a position corresponding to the sound pickup hole.
  • the sound pickup hole is located on the substrate
  • the dustproof structure is fixedly arranged on the substrate at a position corresponding to the sound pickup hole
  • the MEMS chip is arranged on the dustproof structure.
  • an electronic device includes the microphone packaging structure as described in any one of the above.
  • a mesh structure of a predetermined shape is designed on the filter screen, and the opening ratio of the mesh portion is effectively increased by improving the opening design thereof, and at the same time, the filter screen has good rigidity.
  • the dustproof structure of the present invention helps to improve the signal-to-noise ratio SNR of the microphone, so that the microphone has good acoustic performance, and can also block external particles from entering the inside of the microphone packaging structure, and can protect the internal components of the microphone.
  • Fig. 1 is a side view of a dust-proof structure according to an embodiment of the present invention.
  • Fig. 2 is a schematic structural diagram of a filter screen provided according to a first embodiment of the present invention.
  • Fig. 3 is a schematic structural diagram of a filter screen provided according to a second embodiment of the present invention.
  • Fig. 4 is a schematic structural diagram of a filter screen provided according to a third embodiment of the present invention.
  • Fig. 5 is a schematic structural diagram of a filter screen provided according to a fourth embodiment of the present invention.
  • Fig. 6 is a schematic structural diagram of a filter screen provided according to a fifth embodiment of the present invention.
  • Fig. 7 is a schematic structural diagram of a filter screen provided according to a sixth embodiment of the present invention.
  • Fig. 8 is a schematic structural diagram of a filter screen provided according to a seventh embodiment of the present invention.
  • Fig. 9 is a schematic structural diagram of a filter screen provided according to an eighth embodiment of the present invention.
  • Fig. 10 is a schematic structural diagram of a microphone packaging structure according to a first embodiment of the present invention.
  • FIG. 11 is a schematic structural diagram of a microphone packaging structure according to a second embodiment of the present invention.
  • Fig. 12 is a schematic structural diagram of a microphone packaging structure according to a third embodiment of the present invention.
  • FIG. 13 is a schematic structural diagram of a microphone packaging structure according to a fourth embodiment of the present invention.
  • Fig. 14 is a schematic structural diagram of a microphone packaging structure according to a fifth embodiment of the present invention.
  • a dust-proof structure is provided.
  • the dust-proof structure can be applied to, for example, a microphone packaging structure.
  • the dust-proof structure can block external dust, impurities and other particles from entering the inside of the microphone packaging structure through the pickup hole on the microphone packaging structure, and can protect various components inside the microphone.
  • the mesh part of the dust-proof structure provided by the present invention has a higher aperture ratio, which helps to improve the signal-to-noise ratio SNR of the microphone, so that the microphone has good acoustic performance.
  • the dust-proof structure provided by the embodiment of the present invention includes a carrier 1 and a grid portion 2.
  • the carrier 1 has a hollow structure.
  • the grid portion 2 includes a filter mesh 21 and a fixing portion 22 arranged around the filter mesh 21.
  • a mesh structure 211 is formed on the filter screen 21.
  • the ratio of the sum of the area of each mesh on the mesh structure 211 to the area of the mesh portion 2 is the aperture ratio of the mesh portion 2, and the aperture ratio of the mesh portion 2 ⁇ 75%.
  • the grid portion 2 is arranged at one end of the carrier 1 and covers the hollow structure 11.
  • the filter mesh 21 is opposite to the hollow structure 11, and the fixing portion 22 is connected to the carrier 1. As shown in FIG.
  • the dust-proof structure provided by the embodiment of the present invention improves the aperture ratio of the mesh portion 2 to increase the aperture ratio of the mesh portion 2.
  • a special mesh structure 211 is designed on the filter screen 21 of the mesh part 2, which can increase the aperture ratio of the mesh part 2 to 75% or even higher, which is much higher than the isolation mesh in the prior art. The opening rate.
  • the mesh structure 211 can also ensure that the mesh portion 2 has good rigidity and mechanical strength. Based on the higher aperture ratio of the mesh portion 2, after the dustproof structure of the present invention is applied to the microphone packaging structure, the signal-to-noise ratio of the microphone will not be reduced, but it will help to improve the Has good acoustic performance.
  • the dustproof structure provided by the embodiment of the present invention can effectively protect the microphone packaging structure.
  • the mesh portion 2 is provided with a filter mesh 21, which can allow airflow to pass, and the filter mesh 21 can effectively block external particles and foreign matter (for example, dust and impurities) from entering the inside of the microphone packaging structure, thereby enabling Protect the various components inside the microphone packaging structure to avoid affecting the service life of the microphone.
  • the carrier 1 can be made of, for example, metal materials, alloy materials, or organic non-metal materials that are well known to those skilled in the art. Those skilled in the art can flexibly select the material of the carrier 1 according to specific needs, and there is no restriction on this.
  • the mesh part 2 includes a filter mesh 21 and a fixing part 22 provided around the filter mesh 21.
  • the fixing portion 22 is used to connect the grid portion 2 to the carrier 1 so that the grid portion 2 can be stably covered on the carrier 1.
  • the fixing portion 22 of the grid portion 2 is connected to the carrier 1, the fixing portion 22 is actually connected to the edge portion of the carrier 1.
  • the fixing portion 22 of the grid portion 2 and the edge portion of the carrier 1 can be connected together, for example, by means of adhesive bonding.
  • the two can also be connected by fasteners or welding. Or hot pressing and other methods are combined together, and those skilled in the art can flexibly choose according to specific needs, and the present invention does not limit this.
  • the filter 21 is, for example, a metal mesh with a mesh size of not more than 10 ⁇ m, so that the air flow can pass smoothly, and at the same time, it can also block external dust, impurities and other particles (usually particles with a particle size greater than 10 ⁇ m). ) Entry.
  • the metal filter screen has the characteristics of good durability, does not need to be replaced frequently, and has a long service life.
  • the filter mesh 21 can also be made of meshes with other pore sizes and other materials.
  • the shape of the mesh opening of the filter mesh 21 can be, for example, a circle, a square, a triangle, or the like. Those skilled in the art can flexibly adjust according to specific needs, and there is no restriction on this.
  • the shape of the filter 21 itself on the mesh portion 2 may be a regular shape such as a circle, a regular hexagon, a square, or an ellipse, for example.
  • the filter screen 21 may also have other irregular shapes. Those skilled in the art can make adjustments flexibly according to actual needs, and there is no limitation on this.
  • a mesh structure 211 is formed on the filter screen 21, and the shape of the mesh structure 211 is a double helix.
  • the width of the mesh should be controlled to be ⁇ 3 ⁇ m, and the length of the mesh should be controlled to be ⁇ 10 ⁇ m.
  • This design not only helps to increase the aperture ratio of the mesh portion 2, but also prevents the entry of particles with a particle size exceeding 10 ⁇ m.
  • the mesh structure 211 does not affect the rigidity of the entire mesh portion 2.
  • a mesh structure is formed on the filter screen 21, and the mesh structure includes a plurality of meshes 2111 arranged in a matrix.
  • the matrix formed by the arrangement of a plurality of meshes 2111 has a hexagonal structure.
  • each mesh 2111 has a hexagonal shape.
  • the pore size of the mesh 2111 does not exceed 10 ⁇ m.
  • the mesh structure on the filter screen 21 is relatively simple to form, and the opening ratio of the filter screen can be flexibly adjusted according to the number and size of the mesh 2111.
  • the entire mesh structure is equivalent to forming a honeycomb shape, which has good stability and can make the entire mesh portion 2 have good mechanical strength.
  • a mesh structure is formed on the filter screen 21, and the mesh structure 211 is in the shape of an Archimedes spiral. Designing the mesh structure 211 into this shape is also beneficial to increase the aperture ratio of the mesh portion 2.
  • the width of the mesh should be controlled to be ⁇ 3 ⁇ m, and the length of the mesh should be controlled to be ⁇ 10 ⁇ m, which can be used to prevent particles with a particle size exceeding 10 ⁇ m from entering.
  • a mesh structure is formed on the filter screen 21.
  • the mesh structure includes a plurality of first meshes 2112 and a plurality of second meshes 2113, wherein the first The mesh 2112 and the second mesh 2113 are both oval or racetrack-shaped, and the aperture sizes of the first mesh 2112 and the second mesh 2113 are different.
  • it is not limited to only the two sizes of meshes mentioned above, and meshes of more sizes can also be designed as required, but the maximum aperture of the mesh should not exceed 10 ⁇ m.
  • the number of mesh openings can be adjusted according to specific needs to ensure that the filter mesh 21 has a large opening ratio and also has sufficient rigidity to prevent easy damage during production or use.
  • a mesh structure 211 is formed on the filter net 21, and the mesh structure 211 is in the shape of a spider web. Under the mesh structure 211, the filter mesh 2 can maintain a high aperture ratio while also having good mechanical strength.
  • a mesh structure is formed on the filter screen 21.
  • the mesh structure includes a plurality of meshes 2111, and the plurality of meshes 2111 are connected together to form a wave shape. structure.
  • the boundary portion of each mesh 2111 along the length direction is L-shaped.
  • a mesh structure is formed on the filter screen 21, and the mesh structure includes a plurality of rows of mesh units arranged in a concentric ring shape.
  • each column of the mesh unit includes a plurality of arc-shaped meshes 2111.
  • the central angles of all arc-shaped meshes 2111 are equal.
  • the filter mesh 2 can also have good mechanical strength while maintaining a relatively high aperture ratio.
  • a mesh structure is formed on the filter screen 21.
  • the mesh structure includes a central hole 2115 and a plurality of first meshes 2112 evenly arranged around the central hole 2115.
  • a second mesh 2113 is provided between any two adjacent first meshes 2112, and the second mesh 2113 extends to the edge position of the mesh structure, in any two adjacent second meshes
  • a plurality of third meshes 2114 are evenly arranged between 2113.
  • each mesh has a center-symmetric structure with respect to the center of the filter screen 21.
  • the number, shape and size of the first mesh 2112, the second mesh 2113, and the third mesh 2114 can be flexibly adjusted according to the requirements of the aperture ratio, which is not limited in the present invention.
  • the maximum aperture size of the mesh in the mesh structure should not exceed 10 ⁇ m.
  • the width should not exceed 3 ⁇ m, and the length should not exceed 10 ⁇ m. To ensure that it can block foreign particles and foreign objects over 10 ⁇ m.
  • the flatness of the region within 20 ⁇ m from the edge of the mesh structure is less than 25 ⁇ m.
  • the thickness of the mesh portion 2 may be about 0.5 ⁇ m, for example.
  • the height of the carrier 1 may be about 40 ⁇ m, for example. This size is suitable for most microphone packaging structures. Of course, those skilled in the art can also make appropriate adjustments to the size according to specific assembly requirements, and there is no limitation on this.
  • a microphone packaging structure is also provided.
  • the microphone packaging structure can be applied to various types of electronic products such as mobile phones, notebook computers, Ipads, VR devices, and smart wearable devices, and its applications are relatively wide.
  • the microphone packaging structure provided by the embodiment of the present invention includes a housing 3 with a containing cavity, and a sound pickup hole 4 is provided on the housing 3.
  • the sound pickup hole 4 is used to communicate the inside and outside of the housing 3.
  • a microphone device is accommodated and fixed in the accommodating cavity of the housing 3.
  • the microphone packaging structure provided by the present invention further includes the dust-proof structure as described above, and the dust-proof structure is fixedly installed on the sound pickup hole 4.
  • the shape of the sound pickup hole 4 may be, for example, a circle, a square, a triangle, an ellipse, or the like.
  • the sound pickup hole 4 can be set to one or more according to needs.
  • the specific location of the sound pickup hole 4 can also be flexibly adjusted according to the specific situation of the microphone packaging structure, which is not limited in the present invention.
  • the dust-proof structure may be located outside the housing 3. That is, the sound pickup hole 4 is protected from the outside.
  • the dust-proof structure is installed on the outside of the microphone packaging structure to cover the pickup hole 4, and does not occupy the space inside the microphone packaging structure.
  • the position of the dustproof structure can be reasonably installed according to the position of the pickup hole 4, so that the dustproof structure can be aligned with the pickup hole 4, so as to prevent external particles and foreign objects from passing through the pickup hole 4. It is introduced into the microphone packaging structure.
  • the present invention is not limited to disposing the dust-proof structure outside the housing 3, and the dust-proof structure may also be disposed in the containing cavity of the housing 3.
  • the present invention can flexibly adjust the location of the dust-proof structure according to specific needs.
  • the housing 3 has a structure including a substrate 32 and a packaging cover 31, and the substrate 32 and the packaging cover 31 are combined to form the containing cavity.
  • the dust-proof structure is contained in the containing cavity of the housing 3.
  • the microphone device includes a MEMS chip 5 and a signal amplifier 6.
  • the sound pickup hole 4 is located on the packaging cover 31, and the dust-proof structure is fixedly connected to the packaging cover 32.
  • the position of the dust-proof structure corresponds to the sound pickup hole 4, which can prevent external particles and foreign objects from being introduced into the microphone packaging structure through the sound pickup hole 4.
  • the sound pickup hole 4 is located on the packaging cover 31, and the dust-proof structure is fixedly connected to the substrate 32 corresponding to the sound pickup hole 4 At the same time, the dust structure also covers the MEMS chip 5, which can effectively protect the chip in the microphone packaging structure.
  • the sound pickup hole 4 is not limited to being opened on the packaging cover 31 of the housing 3, and may also be opened on the substrate 32.
  • the sound pickup hole 4 is located on the base plate 32, and the dust-proof structure is fixedly provided on the base plate 32 at a position corresponding to the sound pickup hole 4.
  • the sound pickup hole 4 is located on the substrate 32, the dustproof structure is fixedly provided on the substrate 32 at a position corresponding to the sound pickup hole 4, and the MEMS chip 5 is provided On the dust-proof structure.
  • the packaging cover 31 has a dish-like structure as a whole, which has an open end.
  • the material of the packaging cover 31 can be, for example, a metal material, a plastic material, or a PCB board.
  • the shape of the packaging cover 31 may be, for example, a cylindrical shape, a rectangular parallelepiped shape, or the like. Those skilled in the art can flexibly adjust according to actual needs, and there is no restriction on this.
  • the substrate 32 may be a circuit board well-known in the art, for example, a PCB board, etc., which is not limited.
  • the packaging cover 31 and the substrate 32 can be fixed together by, for example, adhesive bonding or solder paste welding. Those skilled in the art can flexibly choose according to their needs, and there is no limitation on this.
  • a microphone device is fixedly accommodated in the accommodating cavity of the housing 3.
  • the microphone device may include, for example, a MEMS chip 5 and a signal amplifier 6.
  • the MEMS chip 5 includes a substrate and a sensing film.
  • the substrate is also a hollow structure.
  • the sensing film is, for example, a piezoelectric element, a capacitive element, a piezoresistive element, and the like.
  • the sensing film is arranged at one end of the substrate and covers the hollow structure of the substrate.
  • the hollow structure forms a back cavity.
  • the MEMS chip 5 can be mounted on the substrate 32.
  • the MEMS chip 5 can also be mounted on the package cover 31, for example, a special adhesive can be used to bond the MEMS chip 5 on the package cover 31.
  • the MEMS chip 5 can also be turned on through the circuit layout in the substrate 32 in a flip-chip manner, which belongs to the common knowledge of those skilled in the art, and the present invention will not be described in detail here.
  • the signal amplifier 6 can be mounted on the package cover 31, of course, can also be mounted on the substrate 32.
  • the signal amplifier 6 can be, for example, an ASIC chip.
  • the ASIC chip is connected to the MEMS chip 5.
  • the electrical signal output by the MEMS chip 5 can be transmitted to the ASIC chip, processed and output by the ASIC chip.
  • the MEMS chip 5 and the ASIC chip 6 can be electrically connected through metal wires (bonding wires) to achieve mutual conduction between the two.
  • the MEMS chip 5 and/or the signal amplifier 6 may also be embedded in the substrate 32 or half embedded in the substrate 32.
  • a conductor is provided in the substrate 32, and a pad is provided on the substrate 32.
  • the conductor is, for example, a metalized through hole provided in the substrate 32.
  • the pad is electrically connected to the MEMS chip 5 and the signal amplifier 6 through a conductor.
  • the MEMS chip 5 and the signal amplifier 6 are buried in the substrate 32, at least one metal layer needs to be provided above and below the MEMS chip 5 and the signal amplifier 6 directly opposite. Ground the metal layer as a shield. A plurality of metal conductors are arranged around the MEMS chip 5 and the signal amplifier 6 to form a shielding structure together with the above-mentioned metal layer.
  • the design of embedding the MEMS chip 5 and the signal amplifier 6 in the substrate 32 eliminates the need to cover the surface of the signal amplifier 6 with protective glue, which can simplify the process and improve the product's resistance to light noise.
  • the present invention also provides an electronic device.
  • the electronic device includes the microphone packaging structure as described above.
  • the electronic device may be a mobile phone, a notebook computer, a tablet computer, a VR device, a smart wearable device, etc., which is not limited in the present invention.

Abstract

本发明公开了一种防尘结构、麦克风封装结构以及电子设备。所述防尘结构包括载体和网格部；所述载体为中空结构；所述网格部包括过滤网和围绕所述过滤网设置的固定部；其中，所述过滤网上形成有网孔结构；定义所述网孔结构上各网孔的面积之和与所述网格部的面积比值为所述网格部的开口率，所述网格部的开口率≥75％；所述网格部设置在所述载体的一端并覆盖所述中空结构，所述过滤网与所述中空结构相对，所述固定部与所述载体连接。本发明的技术效果在于：所述防尘结构有助于改善麦克风的信噪比SNR，还能阻隔外界的颗粒物进入到麦克风封装结构的内部。

Description

防尘结构、麦克风封装结构以及电子设备 技术领域
本发明涉及电声转换技术领域，更具体地，本发明涉及一种防尘结构、麦克风封装结构以及电子设备。
背景技术
随着电声技术的快速发展，各种电声产品层出不穷。麦克风作为一种将声音转换为电信号的换能器，是电声产品中非常重要的器件之一。如今，麦克风已经被广泛的应用于手机、平板电脑、笔记本电脑、VR设备、AR设备、智能手表以及智能穿戴等多种不同类型的电子产品中。近年来，对于麦克风封装结构而言，对其结构的设计成为了本领域技术人员研究的重点和热点。
现有的麦克风封装结构通常为：包括具有容纳腔的外壳，在容纳腔内收容固定有芯片组件(例如，MEMS芯片和ASIC芯片)等元器件；并且，在外壳上还设置有拾音孔。然而，在长期的应用中发现，外界的灰尘、杂质等颗粒物和异物很容易经拾音孔而被引入到麦克风的容纳腔中，而这些外界的颗粒物、异物会对容纳腔中的芯片组件等元器件造成一定的损伤，最终会影响到麦克风的声学性能和使用寿命。
针对上述的问题，目前所采用的解决方案通常是，在麦克风封装结构的拾音孔上设置用于阻挡外界颗粒物、异物等进入的隔离组件。现有的隔离组件通常包括载体和隔离网。为了保证隔离网能够具有足够的刚性，通常在其上开设的孔眼数量是较少的，而这会使隔离网上的开口率较低。将现有的这种隔离组件应用于麦克风封装结构后，基于隔离网上的开口率低会在很大程度上降低麦克风的信噪比(SNR)，从而会影响到麦克风的声学性能。
发明内容
本发明的一个目的是提供一种防尘结构、麦克风封装结构以及电子设备的新技术方案。
根据本发明的第一方面，提供了一种防尘结构，包括载体和网格部；
所述载体为中空结构；
所述网格部包括过滤网和围绕所述过滤网设置的固定部；其中，所述过滤网上形成有网孔结构；定义所述网孔结构上各网孔的面积之和与所述网格部的面积比值为所述网格部的开口率，所述网格部的开口率≥75％；
所述网格部设置在所述载体的一端并覆盖所述中空结构，所述过滤网与所述中空结构相对，所述固定部与所述载体连接。
可选地，所述网孔结构呈双螺旋形状。
可选地，所述网孔结构包括呈矩阵排列的多个网孔，所述矩阵为六边形结构；
其中，每个所述网孔呈六边形。
可选地，所述网孔结构呈阿基米德螺旋线形状。
可选地，所述网孔结构包括多个第一网孔和多个第二网孔；
其中，所述第一网孔和所述第二网孔均呈椭圆形或者跑道形，且所述第一网孔和所述第二网孔的孔径尺寸不同。
可选地，所述网孔结构呈蜘蛛网状。
可选地，所述网孔结构包括多个网孔，所述多个网孔连接在一起，以形成波浪形结构。
可选地，每个所述网孔沿长度方向的边界部均呈L形。
可选地，所述网孔结构包括呈同心环状排列的多列网孔单元；
其中，每列所述网孔单元均包括多个弧形网孔。
可选地，所述多个弧形网孔的圆心角相等。
可选地，所述网孔结构包括中心孔和围绕所述中心孔均匀设置的多个第一网孔，在任两个相邻的第一网孔之间设置有第二网孔，所述第二网孔延伸至所述网孔结构的边缘位置，在任两个相邻的第二网孔之间均匀设置有多个第三网孔。
可选地，在距离所述网孔结构边缘20μm以内的区域平坦度小于25 μm。
根据本发明的第二方面，提供了一种麦克风封装结构。所述麦克风封装结构包括具有容纳腔的外壳，在所述外壳上设置有拾音孔，所述拾音孔用于将所述外壳的内部和外部连通；
还包括麦克风器件，所述麦克风器件固定设置在所述容纳腔内；
还包括如上任意一项所述的防尘结构，所述防尘结构设置在所述拾音孔上。
可选地，所述防尘结构位于所述外壳的外部。
可选地，所述外壳包括基板和封装盖，所述基板和所述封装盖围合成所述容纳腔；
所述防尘结构收容在所述容纳腔内；
所述麦克风器件包括MEMS芯片和信号放大器。
可选地，拾音孔位于所述封装盖上，所述防尘结构与所述封装盖固定连接。
可选地，拾音孔位于所述封装盖上，所述防尘结构固定连接在所述基板上以覆盖住所述MEMS芯片。
可选地，拾音孔位于所述基板上，在所述基板上对应于拾音孔的位置固定设置有所述防尘结构。
可选地，拾音孔位于所述基板上，在所述基板上对应于拾音孔的位置固定设置有所述防尘结构，所述MEMS芯片设置在所述防尘结构上。
根据本发明的第三方面，提供了一种电子设备。所述电子设备包括如上任意一项所述的麦克风封装结构。
本发明实施例提供的防尘结构，在过滤网上设计了预定形状的网孔结构，通过改善其开口设计有效提高了网格部的开口率，同时还能保证过滤网具有良好的刚性。本发明的防尘结构有助于改善麦克风的信噪比SNR，使麦克风具有良好的声学性能，还能阻隔外界的颗粒物等进入到麦克风封装结构的内部，能保护麦克风内部的各个元器件。本发明所要实现的技术任务或者所要解决的技术问题是本领域技术人员从未想到的或者没有预期到的，故本发明是一种新的技术方案。
通过以下参照附图对本发明的示例性实施例的详细描述，本发明的其它特征及其优点将会变得清楚。
附图说明
被结合在说明书中并构成说明书的一部分的附图示出了本发明的实施例，并且连同其说明一起用于解释本发明的原理。
图1是根据本发明一个实施例提供的防尘结构的侧视图。
图2是根据本发明第一个实施例提供的过滤网的结构示意图。
图3是根据本发明第二个实施例提供的过滤网的结构示意图。
图4是根据本发明第三个实施例提供的过滤网的结构示意图。
图5是根据本发明第四个实施例提供的过滤网的结构示意图。
图6是根据本发明第五个实施例提供的过滤网的结构示意图。
图7是根据本发明第六个实施例提供的过滤网的结构示意图。
图8是根据本发明第七个实施例提供的过滤网的结构示意图。
图9是根据本发明第八个实施例提供的过滤网的结构示意图。
图10是根据本发明第一个实施例提供的麦克风封装结构的结构示意图。
图11是根据本发明第二个实施例提供的麦克风封装结构的结构示意图。
图12是根据本发明第三个实施例提供的麦克风封装结构的结构示意图。
图13是根据本发明第四个实施例提供的麦克风封装结构的结构示意图。
图14是根据本发明第五个实施例提供的麦克风封装结构的结构示意图。
附图标记说明：
1-载体，11-中空结构，2-网格部，21-过滤网，211-网孔结构，2111-网孔，2112-第一网孔，2113-第二网孔，2114-第三网孔，2115-中心孔，22-固定部，3-外壳，31-封装盖，32-基板，4-拾音孔，5-MEMS芯片，6-信号 放大器。
具体实施方式
现在将参照附图来详细描述本发明的各种示例性实施例。应注意到：除非另外具体说明，否则在这些实施例中阐述的部件和步骤的相对布置、数字表达式和数值不限制本发明的范围。
以下对至少一个示例性实施例的描述实际上仅仅是说明性的，决不作为对本发明及其应用或使用的任何限制。
对于相关领域普通技术人员已知的技术、方法和设备可能不作详细讨论，但在适当情况下，所述技术、方法和设备应当被视为说明书的一部分。
在这里示出和讨论的所有例子中，任何具体值应被解释为仅仅是示例性的，而不是作为限制。因此，示例性实施例的其它例子可以具有不同的值。
应注意到：相似的标号和字母在下面的附图中表示类似项，因此，一旦某一项在一个附图中被定义，则在随后的附图中不需要对其进行进一步讨论。
根据本发明的一个实施例，提供了一种防尘结构。该防尘结构可应用在例如麦克风封装结构上。该防尘结构能够阻隔外界的灰尘、杂质等颗粒物经麦克风封装结构上的拾音孔而进入到麦克风封装结构的内部，能保护麦克风内部的各个元器件。更重要的是，本发明提供的防尘结构，其网格部具有较高的开口率，这有助于改善麦克风的信噪比SNR，使麦克风具有良好的声学性能。
以下就本发明实施例提供的防尘结构的具体结构进行进一步地说明。本发明实施例提供的防尘结构，如图1所示，包括载体1和网格部2。所述载体1为中空结构。所述网格部2包括过滤网21和围绕所述过滤网21设置的固定部22。其中，如图2-图9所示，在所述过滤网21上形成有网孔结构211。在本发明中定义所述网孔结构211上各网孔的面积之和与所述网格部2的面积比值为所述网格部2的开口率，所述网格部2的开口率≥75％。所述网格部2设置在所述载体1的一端并覆盖所述中空结构11。所 述过滤网21与所述中空结构11相对，所述固定部22与所述载体1连接。
本发明实施例提供的防尘结构，对网格部2的开口率进行了改良，以提高网格部2的开口率。具体来说，在网格部2的过滤网21上设计了特殊的网孔结构211，可以将网格部2的开口率提升到75％甚至更高，这远高于现有技术中隔离网的开口率。与此同时，该网孔结构211还能保证网格部2具有良好的刚度、机械强度。基于网格部2具有较高开口率的特点，将本发明的防尘结构应用于麦克风封装结构后，不会降低麦克风的信噪比，反而有助于改善麦克风的信噪比，以使麦克风具有良好的声学性能。
本发明实施例提供的防尘结构，能对麦克风封装结构进行有效地保护。网格部2上具有过滤网21，该过滤网21可以使气流通过，且该过滤网21还能有效阻隔外界的颗粒物、异物(例如，灰尘和杂质)进入到麦克风封装结构的内部，从而能保护麦克风封装结构内部的各个元器件，以避免影响到麦克风的使用寿命。
本发明中，所述载体1例如可以本领域技术人员熟知的金属材料、合金材料或者有机非金属材料制作。本领域技术人员可以根据具体需要灵活选择载体1的制作材料，对此不作限制。
在本发明中，所述网格部2包括过滤网21和围绕所述过滤网21设置的固定部22。其中，所述固定部22用于将所述网格部2与所述载体1连接，以使所述网格部2能稳定地覆盖在所述载体1上。需要说明的是，当所述网格部2的固定部22与所述载体1连接时，实际是固定部22与载体1的边缘部分相连。具体地，所述网格部2的固定部22与所述载体1的边缘部分之间例如可以通过粘合剂粘接的方式连接在一起，当然二者之间也可以通过紧固件、焊接或者热压等方式结合在一起，本领域技术人员可以根据具体需要灵活选择，本发明对此不作限制。
其中，所述过滤网21例如采用网孔孔径不大于10μm的金属材质的筛网，以使气流能顺利的通过，同时还能阻挡外界的灰尘、杂质等颗粒物(通常是粒径大于10μm的颗粒物)的进入。金属材质的过滤网具有耐用性好的特点，无需频繁更换，具有较长的使用寿命。当然，所述过滤网21也可以采用其它孔径尺寸和其它材质的网布。所述过滤网21上网孔的形状 例如可以为圆形、方形、三角形等形状。本领域技术人员可以根据具体需要灵活的调整，对此不作限制。
此外，需要说明的是，在网格部2上，过滤网21本身的形状例如可以为圆形、正六边形、方形、椭圆形等规则形状。当然，如图5所示，过滤网21也可以为其它不规则形状。本领域技术人员可以根据实际需要灵活进行调整，对此不作限制。
在本发明的一个例子中，如图2所示，在过滤网21上形成有网孔结构211，该网孔结构211的形状为双螺旋状。在该网孔结构211中网孔的宽度应当控制为≤3μm，网孔的长度应当控制为≤10μm。该设计不仅有助于提高网格部2的开口率，同时还能阻止粒径超过10μm的颗粒物进入。并且，该网孔结构211还不会影响到整个网格部2的刚性。
在本发明的一个例子中，如图3所示，在过滤网21上形成有网孔结构，该网孔结构包括呈矩阵排列的多个网孔2111。多个网孔2111排列形成的矩阵为六边形结构。并且，每个网孔2111均呈六边形。其中，网孔2111的孔径均不超过10μm。在本例子中，过滤网21上的网孔结构形成起来比较简单，过滤网的开口率可以根据网孔2111的数量、尺寸等灵活的调整。整个网孔结构相当于形成了一种蜂窝状形态，稳定性好，可以使整个网格部2具有良好的机械强度。
在本发明的一个例子中，如图4所示，在过滤网21上形成有网孔结构，该网孔结构211呈阿基米德螺旋线形状。将网孔结构211设计为该形状，也有利于提高网格部2的开口率。在该网孔结构211中，网孔的宽度应当控制为≤3μm，网孔的长度应当控制为≤10μm，可用于防止粒径超过10μm的颗粒物进入。
在本发明的一个例子中，如图5所示，在过滤网21上形成有网孔结构，该网孔结构包括多个第一网孔2112和多个第二网孔2113，其中，第一网孔2112和第二网孔2113均呈椭圆形或者跑道形，且第一网孔2112和第二网孔2113的孔径尺寸不同。需要说明的是，在本例子中，并不限定只有上述的两种尺寸的网孔，也可以根据需要设计更多尺寸的网孔，但是网孔的最大孔径不应当超过10μm。网孔的设置数量可以根据具体需要进行 调整，以保证过滤网21在具有较大开口率的同时还具有足够的刚性，防止在制作或者使用的过程中容易被破坏。
在本发明的一个例子中，如图6所示，在过滤网21上形成有网孔结构211，该网孔结构211呈蜘蛛网状。在该网孔结构211下，可以使过滤网2在保持较高开口率的同时，也兼具有良好的机械强度。
在本发明的一个例子中，如图7所示，在过滤网21上形成有网孔结构，该网孔结构包括多个网孔2111，且多个网孔2111连接在一起，以形成波浪形结构。其中，每个网孔2111沿长度方向的边界部均呈L形。在该网孔结构下，可以使过滤网2在保持较高开口率的同时，兼具良好的机械强度。
在本发明的一个例子中，如图8所示，在过滤网21上形成有网孔结构，该网孔结构包括呈同心环状排列的多列网孔单元。其中，每列所述网孔单元均包括多个弧形的网孔2111。其中，所有弧形的网孔2111的圆心角相等。在该网孔结构下，也可以使过滤网2在保持较高开口率的同时，还兼具良好的机械强度。
在本发明的一个例子中，如图9所示，在过滤网21上形成有网孔结构，该网孔结构包括中心孔2115和围绕所述中心孔2115均匀设置的多个第一网孔2112，在任两个相邻的第一网孔2112之间设置有第二网孔2113，所述第二网孔2113延伸至所述网孔结构的边缘位置，在任两个相邻的第二网孔2113之间均匀设置有多个第三网孔2114。在本例子中，各个网孔相对于过滤网21的中心形成了一种中心对称结构。其中，第一网孔2112、第二网孔2113和第三网孔2114的设置数量、形状和尺寸等可以根据开口率的需求灵活调整，本发明对此不作限制。
需要说明的是，在上述各例子中，网孔结构中网孔的最大孔径尺寸应当不超超过10μm。对于弧形或者条形的网孔，其宽度不应超过3μm，长度不应超过10μm。以保证能阻挡住超过10μm的外界颗粒物、异物。
本发明中，在距离所述网孔结构边缘20μm以内的区域平坦度小于25μm。
此外，在本发明中，所述网格部2的厚度例如可以为0.5μm左右。 所述载体1的高度例如可以为40μm左右。该尺寸适用于大多数的麦克风封装结构。当然，本领域技术人员也可以根据具体的装配需要对其尺寸进行适当的调整，对此不作限制。
根据本发明的另一个实施例，还提供了一种麦克风封装结构。所述麦克风封装结构可应用于例如手机、笔记本电脑、Ipad、VR设备以及智能穿戴设备等多种类型的电子产品中，其应用较为广泛。
以下就本发明实施例提供的麦克风封装结构的具体结构进行进一步地说明。
如图10-图14所示，本发明实施例提供的麦克风封装结构，其包括具有容纳腔的外壳3，在所述外壳3上设置有拾音孔4。所述拾音孔4用于将所述外壳3的内部和外部连通。在所述外壳3的容纳腔内收容固定有麦克风器件。本发明提供的麦克风封装结构，还包括如上所述的防尘结构，所述防尘结构被固定安装在所述拾音孔4上。
本发明中，所述拾音孔4的形状例如可以为圆形、方形、三角形、椭圆形等。所述拾音孔4可以根据需要设置为一个或者多个。所述拾音孔4的具体设置位置也可以根据麦克风封装结构的具体情况灵活进行调整，本发明对此不作限制。
在本发明一个可选的例子中，如图10所示，所述防尘结构可以位于所述外壳3的外部。即，从外部对拾音孔4进行防护。在本例子中，将防尘结构安装在麦克风封装结构的外部覆盖住拾音孔4，不占用麦克风封装结构内部的空间。在安装防尘结构时，可以根据拾音孔4的位置，合理安装防尘结构的位置，以使防尘结构能对准拾音孔4，从而能避免外界的颗粒物、异物经拾音孔4而引入到麦克风封装结构内部。
当然，本发明中并不限于将防尘结构设置在外壳3的外部，也可以将防尘结构设置在外壳3的容纳腔中。本领域技术人员可以根据具体需要灵活调整防尘结构的设置位置。
本发明的麦克风封装结构，其外壳3的结构为：包括基板32和封装盖31，并由所述基板32和所述封装盖31一起围合成所述容纳腔。所述防尘结构收容在外壳3的容纳腔内。所述麦克风器件包括MEMS芯片5和信号 放大器6。
在本发明一个可选的例子中，如图11所示，拾音孔4位于所述封装盖31上，所述防尘结构与所述封装盖32固定连接。防尘结构的位置对应于拾音孔4，能避免外界的颗粒物、异物经拾音孔4而引入到麦克风封装结构内部。
在本发明一个可选的例子中，如图12所示，拾音孔4位于所述封装盖31上，所述防尘结构固定连接在所述基板32上对应于所述拾音孔4的位置，与此同时，所述尘结构还覆盖住MEMS芯片5上，能对麦克风封装结构内的芯片进行有效的保护。
在本发明中，拾音孔4并不限于开设在外壳3的封装盖31上，也可以开设在基板32上。例如，如图13所示，拾音孔4位于所述基板32上，在所述基板32上对应于拾音孔4的位置固定设置有所述防尘结构。又例如，如图14所示，拾音孔4位于所述基板32上，在所述基板32上对应于拾音孔4的位置固定设置有所述防尘结构，且所述MEMS芯片5设置在所述防尘结构上。需要说明的是，当将拾音孔4开设在基板32上时，本领域技术人员可以根据具体情况调整防尘结构的安装位置，只要能阻止外界的颗粒物、异物进入或者能对内部芯片进行保护即可，对此不作限制。
其中，所述封装盖31整体呈皿状结构，其具有敞开端。所述封装盖31的材质例如可以为金属材料、塑料材料或者PCB板等。所述封装盖31的形状例如可以为圆柱状、长方体状等。本领域技术人员可以根据实际需要灵活调整，对此不作限制。
其中，所述基板32可以采用本领域熟知的电路板，例如可以采用PCB板等，对此不作限制。所述封装盖31与所述基板32之间例如可以通过粘结剂粘接或者锡膏焊接结合固定在一起，本领域技术人员可以根据需要灵活选择，对此不作限制。
本发明提供的麦克风封装结构，在外壳3的容纳腔中固定收容有麦克风器件。具体地，如图10-图14所示，所述麦克风器件例如可以包括有MEMS芯片5和信号放大器6。
其中，所述MEMS芯片5包括有衬底和感应膜。衬底也为中空结构。 感应膜例如为压电元件、电容元件、压阻元件等。感应膜设置在衬底的一端，并覆盖衬底的中空结构。该中空结构形成背腔。在收容腔内固定MEMS芯片5时，MEMS芯片5可以贴装在基板32上。当然，MEMS芯片5也可以贴装在封装盖31上，例如可以采用专门的胶黏剂将MEMS芯片5粘接在封装盖31上。MEMS芯片5也可以采用倒装的方式通过基板32中的电路布图导通，这属于本领域技术人员的公知常识，本发明在此不再具体说明。
其中，所述信号放大器6可以贴装在封装盖31，当然也可以贴装在基板32上。信号放大器6例如可以采用ASIC芯片。ASIC芯片与MEMS芯片5连接。MEMS芯片5输出的电信号可以传输到ASIC芯片中，并被ASIC芯片处理、输出。MEMS芯片5与ASIC芯片6之间可以通过金属导线(焊线)进行电性连接，以实现二者之间的相互导通。
此外，MEMS芯片5和/或信号放大器6也可以埋入到基板32内，或者半埋入基板32内。例如，在基板32内设置导体，并在基板32上设置焊盘。导体例如为设置在基板32内的金属化通孔。焊盘与MEMS芯片5、信号放大器6通过导体电连接。将MEMS芯片5和信号放大器6埋设到基板32内的设计，有助于实现麦克风的小型化。
需要说明的是，当将MEMS芯片5和信号放大器6埋入基板32内时，需要在MEMS芯片5和信号放大器6正对的上方和下方至少各设置一层金属层。将金属层接地作为屏蔽。MEMS芯片5和信号放大器6周围区域布置有多个金属导体，用于与上述金属层一起构成屏蔽结构。将MEMS芯片5和信号放大器6埋入基板32内的设计，使得不必在信号放大器6表面包覆保护胶，这样可以简化工艺，同时提升了产品的光噪声抵抗能力。
另一方面，本发明还提供了一种电子设备。所述电子设备包括如前所述的麦克风封装结构。
其中，所述电子设备可以是手机、笔记本电脑、平板电脑、VR设备、智能穿戴设备等，本发明对此不作限制。
虽然已经通过例子对本发明的一些特定实施例进行了详细说明，但是本领域的技术人员应该理解，以上例子仅是为了进行说明，而不是为了限制本发明的范围。本领域的技术人员应该理解，可在不脱离本发明的范围 和精神的情况下，对以上实施例进行修改。本发明的范围由所附权利要求来限定。

Claims (20)

  1. 一种防尘结构，其特征在于：包括载体和网格部；
    所述载体为中空结构；
    所述网格部包括过滤网和围绕所述过滤网设置的固定部；其中，所述过滤网上形成有网孔结构；定义所述网孔结构上各网孔的面积之和与所述网格部的面积比值为所述网格部的开口率，所述网格部的开口率≥75％；
    所述网格部设置在所述载体的一端并覆盖所述中空结构，所述过滤网与所述中空结构相对，所述固定部与所述载体连接。
  2. 根据权利要求1所述的防尘结构，其特征在于：所述网孔结构呈双螺旋形状。
  3. 根据权利要求1所述的防尘结构，其特征在于：所述网孔结构包括呈矩阵排列的多个网孔，所述矩阵为六边形结构；
    其中，每个所述网孔呈六边形。
  4. 根据权利要求1所述的防尘结构，其特征在于：所述网孔结构呈阿基米德螺旋线形状。
  5. 根据权利要求1所述的防尘结构，其特征在于：所述网孔结构包括多个第一网孔和多个第二网孔；
    其中，所述第一网孔和所述第二网孔均呈椭圆形或者跑道形，且所述第一网孔和所述第二网孔的孔径尺寸不同。
  6. 根据权利要求1所述的防尘结构，其特征在于：所述网孔结构呈蜘蛛网状。
  7. 根据权利要求1所述的防尘结构，其特征在于：所述网孔结构包 括多个网孔，所述多个网孔连接在一起，以形成波浪形结构。
  8. 根据权利要求7所述的防尘结构，其特征在于：每个所述网孔沿长度方向的边界部均呈L形。
  9. 根据权利要求1所述的防尘结构，其特征在于：所述网孔结构包括呈同心环状排列的多列网孔单元；
    其中，每列所述网孔单元均包括多个弧形网孔。
  10. 根据权利要求9所述的防尘结构，其特征在于：所述多个弧形网孔的圆心角相等。
  11. 根据权利要求1所述的防尘结构，其特征在于：所述网孔结构包括中心孔和围绕所述中心孔均匀设置的多个第一网孔，在任两个相邻的第一网孔之间设置有第二网孔，所述第二网孔延伸至所述网孔结构的边缘位置，在任两个相邻的第二网孔之间均匀设置有多个第三网孔。
  12. 根据权利要求1所述的防尘结构，其特征在于：在距离所述网孔结构边缘20μm以内的区域平坦度小于25μm。
  13. 一种麦克风封装结构，其特征在于：包括具有容纳腔的外壳，在所述外壳上设置有拾音孔，所述拾音孔用于将所述外壳的内部和外部连通；
    还包括麦克风器件，所述麦克风器件固定设置在所述容纳腔内；
    还包括如权利要求1-12中任意一项所述的防尘结构，所述防尘结构设置在所述拾音孔上。
  14. 根据权利要求13所述的麦克风封装结构，其特征在于：所述防尘结构位于所述外壳的外部。
  15. 根据权利要求13所述的麦克风封装结构，其特征在于：所述外壳包括基板和封装盖，所述基板和所述封装盖围合成所述容纳腔；
    所述防尘结构收容在所述容纳腔内；
    所述麦克风器件包括MEMS芯片和信号放大器。
  16. 根据权利要求15所述的麦克风封装结构，其特征在于：拾音孔位于所述封装盖上，所述防尘结构与所述封装盖固定连接。
  17. 根据权利要求15所述的麦克风封装结构，其特征在于：拾音孔位于所述封装盖上，所述防尘结构固定连接在所述基板上以覆盖住所述MEMS芯片。
  18. 根据权利要求15所述的麦克风封装结构，其特征在于：拾音孔位于所述基板上，在所述基板上对应于拾音孔的位置固定设置有所述防尘结构。
  19. 根据权利要求15所述的麦克风封装结构，其特征在于：拾音孔位于所述基板上，在所述基板上对应于拾音孔的位置固定设置有所述防尘结构，所述MEMS芯片设置在所述防尘结构上。
  20. 一种电子设备，其特征在于：包括如权利要求13-20中任意一项所述的麦克风封装结构。
PCT/CN2020/099244 2019-12-31 2020-06-30 防尘结构、麦克风封装结构以及电子设备 WO2021135118A1 (zh)

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