CN101375412A - In焊锡包覆铜箔带状导线及其连接方法 - Google Patents
In焊锡包覆铜箔带状导线及其连接方法 Download PDFInfo
- Publication number
- CN101375412A CN101375412A CNA2007800039546A CN200780003954A CN101375412A CN 101375412 A CN101375412 A CN 101375412A CN A2007800039546 A CNA2007800039546 A CN A2007800039546A CN 200780003954 A CN200780003954 A CN 200780003954A CN 101375412 A CN101375412 A CN 101375412A
- Authority
- CN
- China
- Prior art keywords
- copper foil
- scolding tin
- mentioned
- ribbon conductor
- conductor wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 222
- 239000011889 copper foil Substances 0.000 title claims abstract description 211
- 239000004020 conductor Substances 0.000 title claims abstract description 123
- 238000000034 method Methods 0.000 title claims abstract description 82
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 16
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 196
- 239000000758 substrate Substances 0.000 claims abstract description 45
- 239000011521 glass Substances 0.000 claims abstract description 36
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 31
- 238000005476 soldering Methods 0.000 claims abstract description 24
- 229910052709 silver Inorganic materials 0.000 claims abstract description 23
- 229910052738 indium Inorganic materials 0.000 claims abstract description 19
- 229910052742 iron Inorganic materials 0.000 claims abstract description 15
- 239000000203 mixture Substances 0.000 claims abstract description 7
- 239000002184 metal Substances 0.000 claims description 85
- 229910052751 metal Inorganic materials 0.000 claims description 85
- 238000000576 coating method Methods 0.000 claims description 50
- 239000010409 thin film Substances 0.000 claims description 49
- 239000011248 coating agent Substances 0.000 claims description 44
- 238000009434 installation Methods 0.000 claims description 36
- 230000004927 fusion Effects 0.000 claims description 28
- LBSAHBJMEHMJTN-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Zn].[Zn].[Zn] LBSAHBJMEHMJTN-UHFFFAOYSA-N 0.000 claims description 17
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 230000004888 barrier function Effects 0.000 claims description 7
- 238000013459 approach Methods 0.000 claims 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 abstract description 7
- 238000000151 deposition Methods 0.000 abstract 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 abstract 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 abstract 1
- 239000011888 foil Substances 0.000 abstract 1
- 229910052750 molybdenum Inorganic materials 0.000 abstract 1
- 239000011733 molybdenum Substances 0.000 abstract 1
- 239000004332 silver Substances 0.000 abstract 1
- 239000010949 copper Substances 0.000 description 21
- 239000010408 film Substances 0.000 description 17
- 239000000463 material Substances 0.000 description 14
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- -1 then Chemical compound 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
- C23C26/02—Coating not provided for in groups C23C2/00 - C23C24/00 applying molten material to the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/43—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/745—Apparatus for manufacturing wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
- H01L31/0508—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module the interconnection means having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
- H01L31/0512—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module made of a particular material or composition of materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/43—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/4501—Shape
- H01L2224/45012—Cross-sectional shape
- H01L2224/45014—Ribbon connectors, e.g. rectangular cross-section
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45025—Plural core members
- H01L2224/4503—Stacked arrangements
- H01L2224/45032—Two-layer arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45147—Copper (Cu) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/4554—Coating
- H01L2224/45565—Single coating layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/4554—Coating
- H01L2224/45599—Material
- H01L2224/456—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45601—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of less than 400°C
- H01L2224/45609—Indium (In) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/4554—Coating
- H01L2224/45599—Material
- H01L2224/456—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45638—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45639—Silver (Ag) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/745—Apparatus for manufacturing wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01042—Molybdenum [Mo]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01049—Indium [In]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0105—Tin [Sn]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/541—CuInSe2 material PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/532—Conductor
Abstract
Description
Claims (12)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP022703/2006 | 2006-01-31 | ||
JP2006022703A JP4993916B2 (ja) | 2006-01-31 | 2006-01-31 | Inハンダ被覆銅箔リボン導線及びその接続方法 |
PCT/JP2007/051497 WO2007088851A1 (ja) | 2006-01-31 | 2007-01-30 | Inハンダ被覆銅箔リボン導線及びその接続方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101375412A true CN101375412A (zh) | 2009-02-25 |
CN101375412B CN101375412B (zh) | 2010-12-08 |
Family
ID=38327423
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007800039546A Expired - Fee Related CN101375412B (zh) | 2006-01-31 | 2007-01-30 | In焊锡包覆的铜箔带状导线及其连接方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20090044966A1 (zh) |
EP (1) | EP1981091A4 (zh) |
JP (1) | JP4993916B2 (zh) |
KR (1) | KR101275653B1 (zh) |
CN (1) | CN101375412B (zh) |
TW (1) | TW200810642A (zh) |
WO (1) | WO2007088851A1 (zh) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102856428A (zh) * | 2011-06-29 | 2013-01-02 | 国立屏东科技大学 | 具有活性焊料涂层的导线及其使用方法 |
CN103843155A (zh) * | 2011-09-02 | 2014-06-04 | 弗劳恩霍弗实用研究促进协会 | 用于连接太阳能电池的方法以及太阳能模块 |
CN103858240A (zh) * | 2011-09-29 | 2014-06-11 | 陶氏环球技术有限责任公司 | 光伏电池互连 |
CN105391589A (zh) * | 2015-12-15 | 2016-03-09 | 京信通信技术(广州)有限公司 | 一种报文传输的方法及装置 |
CN106356424A (zh) * | 2016-09-20 | 2017-01-25 | 哈尔滨工业大学 | 太阳能电池Si片Al背电极与Cu电极引线绿色环保钎焊的方法 |
CN106935680A (zh) * | 2010-10-22 | 2017-07-07 | 葛迪恩实业公司 | 改善的光伏模块和/或制作其的方法 |
CN108615689A (zh) * | 2018-05-17 | 2018-10-02 | 哈尔滨理工大学 | 一种用于功率器件封装的全Cu3Sn化合物接头的制备方法 |
CN111299802A (zh) * | 2018-12-11 | 2020-06-19 | 华夏易能(海南)新能源科技有限公司 | 扁平电缆与钼层的连接方法、焊接结构件和cigs太阳能电池 |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010016320A (ja) * | 2008-04-15 | 2010-01-21 | Hitachi Cable Ltd | 太陽電池用リード線およびその製造方法並びにそれを用いた太陽電池 |
JP5407061B2 (ja) * | 2008-04-15 | 2014-02-05 | 日立金属株式会社 | 太陽電池用リード線およびその製造方法並びにそれを用いた太陽電池 |
US8348139B2 (en) * | 2010-03-09 | 2013-01-08 | Indium Corporation | Composite solder alloy preform |
DE102010042526A1 (de) * | 2010-10-15 | 2012-04-19 | Continental Automotive Gmbh | Kontaktelement |
JP2012109423A (ja) * | 2010-11-18 | 2012-06-07 | Nippon Avionics Co Ltd | 薄膜太陽電池モジュールのインターコネクタのはんだ付け方法およびはんだ付け装置 |
JP2012158828A (ja) * | 2011-02-03 | 2012-08-23 | Furukawa Electric Co Ltd:The | 表面処理銅箔及びその製造方法 |
KR101251841B1 (ko) * | 2011-11-28 | 2013-04-09 | 엘지이노텍 주식회사 | 태양광 발전장치 및 이의 제조방법 |
KR20170017776A (ko) * | 2015-08-05 | 2017-02-15 | 엘지전자 주식회사 | 태양 전지 패널용 리본 및 이의 제조 방법, 그리고 태양 전지 패널 |
JP6307131B2 (ja) * | 2015-09-08 | 2018-04-04 | エルジー エレクトロニクス インコーポレイティド | 太陽電池モジュール及びその製造方法 |
GB2537701B (en) * | 2015-10-22 | 2017-10-11 | Strip Tinning Ltd | Busbar assembly |
CN116636019A (zh) | 2020-12-21 | 2023-08-22 | 出光兴产株式会社 | 太阳能电池的电极结构和制造方法 |
CN116648794A (zh) | 2020-12-21 | 2023-08-25 | 出光兴产株式会社 | 太阳能电池的电极结构和制造方法 |
CN113930763B (zh) * | 2021-10-14 | 2023-11-07 | 华能新能源股份有限公司 | 一种在太阳能电池基底表面制备电极膜层的方法 |
CN114959534B (zh) * | 2022-05-27 | 2023-11-21 | 成都芯辰新能源科技有限公司 | 一种用于在极细铜丝表面进行低熔点金属均匀包覆的结构 |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3437977A (en) * | 1967-03-22 | 1969-04-08 | Schjeldahl Co G T | Demountable electrical contact arrangement |
US3771211A (en) * | 1970-09-18 | 1973-11-13 | Ppg Industries Inc | Method of fabricating transparent electroconductive window |
JPS54149334A (en) * | 1978-05-17 | 1979-11-22 | Nisshin Steel Co Ltd | One side lead*other side zinc plated steel plate and production thereof |
JPS6177278A (ja) * | 1984-09-21 | 1986-04-19 | 日立化成工業株式会社 | 回路の接続部材 |
JPS61206235A (ja) * | 1985-03-11 | 1986-09-12 | Hitachi Ltd | パツケ−ジ構造体及びその製法 |
US4735662A (en) * | 1987-01-06 | 1988-04-05 | The Standard Oil Company | Stable ohmic contacts to thin films of p-type tellurium-containing II-VI semiconductors |
JPS642330A (en) * | 1987-06-25 | 1989-01-06 | Nippon Mining Co Ltd | Film carrier and manufacture thereof |
JPH03239377A (ja) * | 1990-02-16 | 1991-10-24 | Canon Inc | 太陽電池モジュール |
US5296043A (en) * | 1990-02-16 | 1994-03-22 | Canon Kabushiki Kaisha | Multi-cells integrated solar cell module and process for producing the same |
JPH04276665A (ja) * | 1991-03-04 | 1992-10-01 | Canon Inc | 集積型太陽電池 |
JP3291887B2 (ja) * | 1994-02-03 | 2002-06-17 | 日立工機株式会社 | 金−錫半田めっき層の形成方法及びその接合方法 |
JP3040929B2 (ja) * | 1995-02-06 | 2000-05-15 | 松下電器産業株式会社 | はんだ材料 |
KR19990028259A (ko) * | 1995-06-20 | 1999-04-15 | 모리시따요오이 찌 | 땜납 및 납땜에 의해 실장되는 전자 부품과 전자 회로 기판 |
JPH0968713A (ja) * | 1995-08-31 | 1997-03-11 | Sanyo Electric Co Ltd | 表示装置および表示器の駆動基板 |
JP3874031B2 (ja) * | 1995-11-29 | 2007-01-31 | 内橋エステック株式会社 | 無鉛はんだ合金 |
JP2002263880A (ja) * | 2001-03-06 | 2002-09-17 | Hitachi Cable Ltd | Pbフリー半田、およびこれを使用した接続用リード線ならびに電気部品 |
JP4493238B2 (ja) * | 2001-06-06 | 2010-06-30 | 本田技研工業株式会社 | 太陽電池のモジュール化方法 |
JP2003142703A (ja) * | 2001-11-06 | 2003-05-16 | Sony Corp | 集積型太陽電池の製造方法 |
JP4136845B2 (ja) * | 2002-08-30 | 2008-08-20 | 富士電機ホールディングス株式会社 | 半導体モジュールの製造方法 |
US6974976B2 (en) * | 2002-09-30 | 2005-12-13 | Miasole | Thin-film solar cells |
JP4565650B2 (ja) * | 2003-05-22 | 2010-10-20 | 株式会社Neomaxマテリアル | 電極線材およびその製造方法並びに前記電極線材によって形成された接続用リード線を備えた太陽電池 |
JP4329532B2 (ja) * | 2003-07-15 | 2009-09-09 | 日立電線株式会社 | 平角導体及びその製造方法並びにリード線 |
CN1943030A (zh) * | 2003-09-08 | 2007-04-04 | 霍尼韦尔国际公司 | 用于电互连的掺杂合金、其制造方法及其用途 |
JP2005129660A (ja) * | 2003-10-22 | 2005-05-19 | Kyocera Corp | 太陽電池素子とその形成方法 |
JP2005197424A (ja) * | 2004-01-07 | 2005-07-21 | Canon Inc | 太陽電池モジュール設置構造体および太陽電池モジュール設置構造体の施工方法 |
US20050247340A1 (en) * | 2004-04-19 | 2005-11-10 | Zeira Eitan C | All printed solar cell array |
KR101091505B1 (ko) * | 2009-11-03 | 2011-12-08 | 엘지이노텍 주식회사 | 태양전지 및 이의 제조방법 |
-
2006
- 2006-01-31 JP JP2006022703A patent/JP4993916B2/ja not_active Expired - Fee Related
-
2007
- 2007-01-30 CN CN2007800039546A patent/CN101375412B/zh not_active Expired - Fee Related
- 2007-01-30 EP EP07707715A patent/EP1981091A4/en not_active Withdrawn
- 2007-01-30 US US12/162,576 patent/US20090044966A1/en not_active Abandoned
- 2007-01-30 WO PCT/JP2007/051497 patent/WO2007088851A1/ja active Application Filing
- 2007-01-31 TW TW096103463A patent/TW200810642A/zh unknown
-
2008
- 2008-07-30 KR KR1020087018821A patent/KR101275653B1/ko not_active IP Right Cessation
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106935680A (zh) * | 2010-10-22 | 2017-07-07 | 葛迪恩实业公司 | 改善的光伏模块和/或制作其的方法 |
CN102856428B (zh) * | 2011-06-29 | 2015-08-05 | 国立屏东科技大学 | 具有活性焊料涂层的导线及其使用方法 |
CN102856428A (zh) * | 2011-06-29 | 2013-01-02 | 国立屏东科技大学 | 具有活性焊料涂层的导线及其使用方法 |
CN103843155B (zh) * | 2011-09-02 | 2017-05-03 | 弗劳恩霍弗实用研究促进协会 | 用于连接太阳能电池的方法以及太阳能模块 |
CN103843155A (zh) * | 2011-09-02 | 2014-06-04 | 弗劳恩霍弗实用研究促进协会 | 用于连接太阳能电池的方法以及太阳能模块 |
CN103858240A (zh) * | 2011-09-29 | 2014-06-11 | 陶氏环球技术有限责任公司 | 光伏电池互连 |
CN103858240B (zh) * | 2011-09-29 | 2016-12-28 | 陶氏环球技术有限责任公司 | 光伏电池互连 |
CN105391589B (zh) * | 2015-12-15 | 2018-09-25 | 京信通信系统(中国)有限公司 | 一种报文传输的方法及装置 |
CN105391589A (zh) * | 2015-12-15 | 2016-03-09 | 京信通信技术(广州)有限公司 | 一种报文传输的方法及装置 |
CN106356424A (zh) * | 2016-09-20 | 2017-01-25 | 哈尔滨工业大学 | 太阳能电池Si片Al背电极与Cu电极引线绿色环保钎焊的方法 |
CN106356424B (zh) * | 2016-09-20 | 2019-03-29 | 哈尔滨工业大学 | 太阳能电池Si片Al背电极与Cu电极引线绿色环保钎焊的方法 |
CN108615689A (zh) * | 2018-05-17 | 2018-10-02 | 哈尔滨理工大学 | 一种用于功率器件封装的全Cu3Sn化合物接头的制备方法 |
CN111299802A (zh) * | 2018-12-11 | 2020-06-19 | 华夏易能(海南)新能源科技有限公司 | 扁平电缆与钼层的连接方法、焊接结构件和cigs太阳能电池 |
Also Published As
Publication number | Publication date |
---|---|
US20090044966A1 (en) | 2009-02-19 |
EP1981091A1 (en) | 2008-10-15 |
KR101275653B1 (ko) | 2013-06-14 |
JP4993916B2 (ja) | 2012-08-08 |
CN101375412B (zh) | 2010-12-08 |
TW200810642A (en) | 2008-02-16 |
WO2007088851A1 (ja) | 2007-08-09 |
KR20080100175A (ko) | 2008-11-14 |
JP2007207861A (ja) | 2007-08-16 |
EP1981091A4 (en) | 2012-03-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101375412B (zh) | In焊锡包覆的铜箔带状导线及其连接方法 | |
JP6440756B2 (ja) | 電気的接続部材及び補償プレートを備えた板ガラス、板ガラスの製造方法および板ガラスの使用 | |
AU767171B2 (en) | Electric connection of electrochemical and photoelectrochemical cells | |
JP5252472B2 (ja) | 太陽電池、太陽電池の製造方法、太陽電池モジュールの製造方法および太陽電池モジュール | |
CN102316664B (zh) | 柔性电路板及其制作方法 | |
EP2455435A1 (en) | Anisotropic conductive adhesive for ultrasonic wave adhesion, and electronic parts connection method using same | |
CN100464617C (zh) | 导电配线之连接构造及连接方法 | |
KR20110110353A (ko) | 태양 전지 셀의 접속 방법 및 태양 전지 모듈 | |
JP2001210843A (ja) | 光発電パネルおよびその製造方法 | |
JPS63271867A (ja) | 電気導線付母線組立体 | |
KR20120101627A (ko) | 태양 전지 탭을 태양 전지 버스바에 접속하는 방법 및 이 방법으로 제조된 태양 전지 | |
CN1132931A (zh) | 连接一个电子元件的端子到另一个电子元件的端子的方法 | |
US5299726A (en) | Connection for glazings having an electroconductive layer | |
JP2015091601A (ja) | ソーラモジュールのためのはんだ付け用支持部位および半導体デバイス | |
CN110121790A (zh) | 使用uv压印技术制造透明发光装置的方法和透明发光装置 | |
KR20130012134A (ko) | 태양 전지 모듈, 태양 전지 모듈의 제조 방법 | |
EP1198162A2 (en) | Electronic component mounted member and repair method thereof | |
CN2569298Y (zh) | 一种表面贴装用高分子热敏电阻器 | |
CN101772257A (zh) | 印刷电路板 | |
KR101157599B1 (ko) | 이방성 도전 필름용 도전 입자 및 이를 포함하는 이방성 도전 필름 | |
CN100416624C (zh) | 键合电极与电路板电极的键合结构及平面显示装置 | |
JP2005294092A (ja) | 発熱体 | |
JP7415638B2 (ja) | 給電機構および調光体 | |
CN210015857U (zh) | 氮化铝陶瓷板结构 | |
JPH11186689A (ja) | 配線基板の接続構造 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SOLAR FRONTIER K. K. Free format text: FORMER OWNER: SHOWA SHELL SEKIYU K.K. Effective date: 20150302 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20150302 Address after: Tokyo, Japan Patentee after: Showa Shell Sekiyu K.K. Address before: Tokyo, Japan, Japan Patentee before: Showa Shell Sekiyu K. K. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101208 Termination date: 20180130 |
|
CF01 | Termination of patent right due to non-payment of annual fee |