CN101312184A - 发光二极管芯片和透镜的整体结构物及其制造方法 - Google Patents

发光二极管芯片和透镜的整体结构物及其制造方法 Download PDF

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Publication number
CN101312184A
CN101312184A CNA2008101428162A CN200810142816A CN101312184A CN 101312184 A CN101312184 A CN 101312184A CN A2008101428162 A CNA2008101428162 A CN A2008101428162A CN 200810142816 A CN200810142816 A CN 200810142816A CN 101312184 A CN101312184 A CN 101312184A
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China
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mentioned
composition
die cavity
intermediate layer
supporting structure
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English (en)
Chinese (zh)
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今泽克之
儿玉欣也
柏木努
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Shin Etsu Chemical Co Ltd
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Shin Etsu Chemical Co Ltd
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Publication of CN101312184A publication Critical patent/CN101312184A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Led Device Packages (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
CNA2008101428162A 2007-03-13 2008-03-13 发光二极管芯片和透镜的整体结构物及其制造方法 Pending CN101312184A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007062813 2007-03-13
JP2007062813A JP2008227119A (ja) 2007-03-13 2007-03-13 発光ダイオードチップとレンズとの一体化構造物及びその製造方法

Publications (1)

Publication Number Publication Date
CN101312184A true CN101312184A (zh) 2008-11-26

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Country Link
JP (1) JP2008227119A (ko)
KR (1) KR101392635B1 (ko)
CN (1) CN101312184A (ko)
TW (1) TWI447938B (ko)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102376828A (zh) * 2010-08-11 2012-03-14 英特明光能股份有限公司 自成型的发光二极管透镜的制作方法
CN102388090A (zh) * 2009-04-10 2012-03-21 道康宁东丽株式会社 光学器件及其制造方法
CN102655200A (zh) * 2011-03-02 2012-09-05 一品光学工业股份有限公司 发光二极管一次光学镜片封装方法及其发光二极管组件
CN102655189A (zh) * 2011-03-02 2012-09-05 东和株式会社 光电部件制造方法、光电部件制造系统和光电部件
CN102763231A (zh) * 2010-02-16 2012-10-31 皇家飞利浦电子股份有限公司 具有模制波长转换层的发光装置
CN103649627A (zh) * 2011-06-28 2014-03-19 奥斯兰姆施尔凡尼亚公司 Led照明设备、系统和制造方法
CN104284764A (zh) * 2012-04-27 2015-01-14 道康宁东丽株式会社 离型膜、压缩模塑方法以及压缩模塑设备
CN112530302A (zh) * 2020-12-10 2021-03-19 康佳集团股份有限公司 一种Micro LED显示模组以及显示设备
CN115877607A (zh) * 2021-09-28 2023-03-31 青岛智动精工电子有限公司 灯板的成型方法、背光模组和显示设备

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5107886B2 (ja) * 2008-12-24 2012-12-26 日東電工株式会社 光半導体装置の製造方法
EP2412734A1 (en) 2009-03-23 2012-02-01 FUJIFILM Corporation Curable resin composition for cemented lenses, image pick-up lens, and process for produciton of image pick-up lens
CN101852384B (zh) * 2009-03-31 2013-08-28 光宝科技股份有限公司 形成发光二极管的透镜结构的方法及其相关架构
JP5310536B2 (ja) * 2009-12-25 2013-10-09 豊田合成株式会社 発光装置の製造方法
JP5767062B2 (ja) * 2010-09-30 2015-08-19 日東電工株式会社 発光ダイオード封止材、および、発光ダイオード装置の製造方法
DE102010047454A1 (de) * 2010-10-04 2012-04-05 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung einer Silikonfolie, Silikonfolie und optoelektronisches Halbleiterbauteil mit einer Silikonfolie
JP2013232580A (ja) 2012-05-01 2013-11-14 Dow Corning Toray Co Ltd 熱硬化性フィルム状シリコーン封止材
US8889439B2 (en) * 2012-08-24 2014-11-18 Tsmc Solid State Lighting Ltd. Method and apparatus for packaging phosphor-coated LEDs
JP6070498B2 (ja) * 2012-12-21 2017-02-01 信越化学工業株式会社 蛍光体含有層と白色顔料含有層を有する熱硬化性シリコーン樹脂シート、それを使用する発光装置の製造方法及び封止発光半導体装置
WO2014116035A1 (ko) * 2013-01-23 2014-07-31 주식회사 씨티랩 반도체 소자 구조물을 제조하는 방법 및 이를 이용하는 반도체 소자 구조물
KR101460742B1 (ko) * 2013-01-23 2014-11-13 주식회사 씨티랩 반도체 소자 구조물을 제조하는 방법
KR102277127B1 (ko) 2014-10-17 2021-07-15 삼성전자주식회사 발광소자 패키지

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07231118A (ja) * 1994-02-15 1995-08-29 Mitsubishi Cable Ind Ltd Ｌｅｄ集合体モジュールの電子部品実装方法およびその構造
JP3234905B2 (ja) * 1995-10-06 2001-12-04 シャープ株式会社 Ｌｅｄ表示装置、その製造用金型及びｌｅｄ表示装置の製造方法
JP4676735B2 (ja) * 2004-09-22 2011-04-27 東レ・ダウコーニング株式会社 光半導体装置の製造方法および光半導体装置
US7344902B2 (en) * 2004-11-15 2008-03-18 Philips Lumileds Lighting Company, Llc Overmolded lens over LED die
JP4636242B2 (ja) * 2005-04-21 2011-02-23 信越化学工業株式会社 光半導体素子封止材及び光半導体素子
JP5513704B2 (ja) * 2005-08-22 2014-06-04 株式会社朝日ラバー レンズ体

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102388090A (zh) * 2009-04-10 2012-03-21 道康宁东丽株式会社 光学器件及其制造方法
CN102763231A (zh) * 2010-02-16 2012-10-31 皇家飞利浦电子股份有限公司 具有模制波长转换层的发光装置
CN102763231B (zh) * 2010-02-16 2017-10-27 皇家飞利浦电子股份有限公司 具有模制波长转换层的发光装置
US9847465B2 (en) 2010-02-16 2017-12-19 Koninklijke Philips N.V. Light emitting device with molded wavelength converting layer
CN102376828A (zh) * 2010-08-11 2012-03-14 英特明光能股份有限公司 自成型的发光二极管透镜的制作方法
CN102655200A (zh) * 2011-03-02 2012-09-05 一品光学工业股份有限公司 发光二极管一次光学镜片封装方法及其发光二极管组件
CN102655189A (zh) * 2011-03-02 2012-09-05 东和株式会社 光电部件制造方法、光电部件制造系统和光电部件
CN102655189B (zh) * 2011-03-02 2014-11-05 东和株式会社 光电部件制造方法、光电部件制造系统和光电部件
CN103649627A (zh) * 2011-06-28 2014-03-19 奥斯兰姆施尔凡尼亚公司 Led照明设备、系统和制造方法
CN104284764A (zh) * 2012-04-27 2015-01-14 道康宁东丽株式会社 离型膜、压缩模塑方法以及压缩模塑设备
CN112530302A (zh) * 2020-12-10 2021-03-19 康佳集团股份有限公司 一种Micro LED显示模组以及显示设备
CN115877607A (zh) * 2021-09-28 2023-03-31 青岛智动精工电子有限公司 灯板的成型方法、背光模组和显示设备

Also Published As

Publication number Publication date
TW200901515A (en) 2009-01-01
TWI447938B (zh) 2014-08-01
KR20080084646A (ko) 2008-09-19
KR101392635B1 (ko) 2014-05-07
JP2008227119A (ja) 2008-09-25

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