TWI447938B - An integrated structure of a light emitting diode wafer and a lens and a method of manufacturing the same - Google Patents

An integrated structure of a light emitting diode wafer and a lens and a method of manufacturing the same Download PDF

Info

Publication number
TWI447938B
TWI447938B TW097108712A TW97108712A TWI447938B TW I447938 B TWI447938 B TW I447938B TW 097108712 A TW097108712 A TW 097108712A TW 97108712 A TW97108712 A TW 97108712A TW I447938 B TWI447938 B TW I447938B
Authority
TW
Taiwan
Prior art keywords
lens
group
led
composition
bonded
Prior art date
Application number
TW097108712A
Other languages
English (en)
Chinese (zh)
Other versions
TW200901515A (en
Inventor
Katsuyuki Imazawa
Kinya Kodama
Tsutomu Kashiwagi
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of TW200901515A publication Critical patent/TW200901515A/zh
Application granted granted Critical
Publication of TWI447938B publication Critical patent/TWI447938B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Led Device Packages (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
TW097108712A 2007-03-13 2008-03-12 An integrated structure of a light emitting diode wafer and a lens and a method of manufacturing the same TWI447938B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007062813A JP2008227119A (ja) 2007-03-13 2007-03-13 発光ダイオードチップとレンズとの一体化構造物及びその製造方法

Publications (2)

Publication Number Publication Date
TW200901515A TW200901515A (en) 2009-01-01
TWI447938B true TWI447938B (zh) 2014-08-01

Family

ID=39845391

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097108712A TWI447938B (zh) 2007-03-13 2008-03-12 An integrated structure of a light emitting diode wafer and a lens and a method of manufacturing the same

Country Status (4)

Country Link
JP (1) JP2008227119A (ko)
KR (1) KR101392635B1 (ko)
CN (1) CN101312184A (ko)
TW (1) TWI447938B (ko)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5107886B2 (ja) * 2008-12-24 2012-12-26 日東電工株式会社 光半導体装置の製造方法
EP2412734A1 (en) 2009-03-23 2012-02-01 FUJIFILM Corporation Curable resin composition for cemented lenses, image pick-up lens, and process for produciton of image pick-up lens
CN101852384B (zh) * 2009-03-31 2013-08-28 光宝科技股份有限公司 形成发光二极管的透镜结构的方法及其相关架构
JP2010245477A (ja) * 2009-04-10 2010-10-28 Dow Corning Toray Co Ltd 光デバイス及びその製造方法
JP5310536B2 (ja) * 2009-12-25 2013-10-09 豊田合成株式会社 発光装置の製造方法
US8771577B2 (en) * 2010-02-16 2014-07-08 Koninklijke Philips N.V. Light emitting device with molded wavelength converting layer
TWI456802B (zh) * 2010-08-11 2014-10-11 Interlight Optotech Corp 自成型之發光二極體透鏡之製作方法
JP5767062B2 (ja) * 2010-09-30 2015-08-19 日東電工株式会社 発光ダイオード封止材、および、発光ダイオード装置の製造方法
DE102010047454A1 (de) * 2010-10-04 2012-04-05 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung einer Silikonfolie, Silikonfolie und optoelektronisches Halbleiterbauteil mit einer Silikonfolie
TW201238099A (en) * 2011-03-02 2012-09-16 E Pin Optical Industry Co Ltd LED with primary optical lens packing method and LED assembly thereof
JP5562273B2 (ja) * 2011-03-02 2014-07-30 Ｔｏｗａ株式会社 光電子部品の製造方法及び製造装置
US8480267B2 (en) * 2011-06-28 2013-07-09 Osram Sylvania Inc. LED lighting apparatus, systems and methods of manufacture
JP2013230618A (ja) 2012-04-27 2013-11-14 Dow Corning Toray Co Ltd 離型フィルム、圧縮成型方法、および圧縮成型装置
JP2013232580A (ja) 2012-05-01 2013-11-14 Dow Corning Toray Co Ltd 熱硬化性フィルム状シリコーン封止材
US8889439B2 (en) * 2012-08-24 2014-11-18 Tsmc Solid State Lighting Ltd. Method and apparatus for packaging phosphor-coated LEDs
JP6070498B2 (ja) * 2012-12-21 2017-02-01 信越化学工業株式会社 蛍光体含有層と白色顔料含有層を有する熱硬化性シリコーン樹脂シート、それを使用する発光装置の製造方法及び封止発光半導体装置
WO2014116035A1 (ko) * 2013-01-23 2014-07-31 주식회사 씨티랩 반도체 소자 구조물을 제조하는 방법 및 이를 이용하는 반도체 소자 구조물
KR101460742B1 (ko) * 2013-01-23 2014-11-13 주식회사 씨티랩 반도체 소자 구조물을 제조하는 방법
KR102277127B1 (ko) 2014-10-17 2021-07-15 삼성전자주식회사 발광소자 패키지
CN112530302B (zh) * 2020-12-10 2022-08-05 康佳集团股份有限公司 一种Micro LED显示模组以及显示设备
CN115877607A (zh) * 2021-09-28 2023-03-31 青岛智动精工电子有限公司 灯板的成型方法、背光模组和显示设备

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09102633A (ja) * 1995-10-06 1997-04-15 Sharp Corp Ｌｅｄ表示装置、その製造用金型及びｌｅｄ表示装置の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07231118A (ja) * 1994-02-15 1995-08-29 Mitsubishi Cable Ind Ltd Ｌｅｄ集合体モジュールの電子部品実装方法およびその構造
JP4676735B2 (ja) * 2004-09-22 2011-04-27 東レ・ダウコーニング株式会社 光半導体装置の製造方法および光半導体装置
US7344902B2 (en) * 2004-11-15 2008-03-18 Philips Lumileds Lighting Company, Llc Overmolded lens over LED die
JP4636242B2 (ja) * 2005-04-21 2011-02-23 信越化学工業株式会社 光半導体素子封止材及び光半導体素子
JP5513704B2 (ja) * 2005-08-22 2014-06-04 株式会社朝日ラバー レンズ体

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09102633A (ja) * 1995-10-06 1997-04-15 Sharp Corp Ｌｅｄ表示装置、その製造用金型及びｌｅｄ表示装置の製造方法

Also Published As

Publication number Publication date
TW200901515A (en) 2009-01-01
KR20080084646A (ko) 2008-09-19
CN101312184A (zh) 2008-11-26
KR101392635B1 (ko) 2014-05-07
JP2008227119A (ja) 2008-09-25

Similar Documents

Publication Publication Date Title
TWI447938B (zh) An integrated structure of a light emitting diode wafer and a lens and a method of manufacturing the same
JP5814175B2 (ja) Ｌｅｄのリフレクター用熱硬化性シリコーン樹脂組成物並びにこれを用いたｌｅｄ用リフレクター及び光半導体装置
EP2479206B1 (en) A silicone resin composition and an optical semiconductor device making use of the composition
US8164202B2 (en) Optical semiconductor device encapsulated with silicone resin
US7521813B2 (en) Silicone rubber composition, light-emitting semiconductor embedding/protecting material and light-emitting semiconductor device
TWI434890B (zh) 加成可硬化聚矽氧樹脂組成物及使用彼之聚矽氧鏡片
TW201817815A (zh) 固化性粒狀聚矽氧組合物、由其構成之半導體用構件及其成型方法
US20120126435A1 (en) Curable composition for semiconductor encapsulation
EP2662413B1 (en) Curable composition
JP6643990B2 (ja) 硬化体
EP2662411B1 (en) Curable composition
TW201318227A (zh) 矽氧樹脂片材、硬化片材、發光二極體裝置及其製造方法
JP5623092B2 (ja) 発光ダイオードチップとレンズとの一体化構造物の製造方法
JP6010210B2 (ja) 表面実装型発光装置用樹脂成形体およびそれを用いた発光装置
JP2014199958A (ja) 発光ダイオードチップとレンズとの一体化構造物及びその製造方法
KR101880211B1 (ko) 경화성 조성물
WO2015083446A1 (ja) 付加硬化型シリコーン樹脂組成物、付加硬化型シリコーン樹脂硬化物、及び、光半導体素子封止体
JP2013133428A (ja) 表面実装型発光装置用樹脂成形体およびそれを用いた発光装置
KR20130128646A (ko) 오르가노 폴리실록산 조성물
KR20130095139A (ko) 오르가노 폴리실록산 조성물
JP2009252781A (ja) 樹脂封止型発光ダイオードの製造方法
KR20130095138A (ko) 오르가노 폴리실록산 조성물