CN101311113B - 高纯度多晶硅的制造装置及制造方法 - Google Patents
高纯度多晶硅的制造装置及制造方法 Download PDFInfo
- Publication number
- CN101311113B CN101311113B CN200810084016XA CN200810084016A CN101311113B CN 101311113 B CN101311113 B CN 101311113B CN 200810084016X A CN200810084016X A CN 200810084016XA CN 200810084016 A CN200810084016 A CN 200810084016A CN 101311113 B CN101311113 B CN 101311113B
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- China
- Prior art keywords
- zinc
- silicon
- pipe
- silicon chloride
- hermetically sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910021420 polycrystalline silicon Inorganic materials 0.000 title claims abstract description 68
- 229920005591 polysilicon Polymers 0.000 title claims description 42
- 238000002360 preparation method Methods 0.000 title 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 103
- 239000011701 zinc Substances 0.000 claims abstract description 103
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 103
- FDNAPBUWERUEDA-UHFFFAOYSA-N silicon tetrachloride Chemical compound Cl[Si](Cl)(Cl)Cl FDNAPBUWERUEDA-UHFFFAOYSA-N 0.000 claims abstract description 56
- 238000004519 manufacturing process Methods 0.000 claims abstract description 41
- 239000007787 solid Substances 0.000 claims abstract description 40
- 238000010438 heat treatment Methods 0.000 claims abstract description 20
- 230000002093 peripheral effect Effects 0.000 claims abstract description 16
- 230000006698 induction Effects 0.000 claims abstract description 10
- 239000007789 gas Substances 0.000 claims description 88
- 238000009434 installation Methods 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 28
- 238000001704 evaporation Methods 0.000 claims description 23
- 230000008020 evaporation Effects 0.000 claims description 23
- 238000002309 gasification Methods 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 15
- 238000002844 melting Methods 0.000 claims description 12
- 230000008018 melting Effects 0.000 claims description 12
- 230000008676 import Effects 0.000 claims description 9
- 238000007599 discharging Methods 0.000 claims description 8
- 238000006243 chemical reaction Methods 0.000 claims description 6
- 239000011261 inert gas Substances 0.000 claims description 6
- 238000002791 soaking Methods 0.000 claims description 5
- 238000005728 strengthening Methods 0.000 claims description 5
- 239000006200 vaporizer Substances 0.000 abstract 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 27
- 229910052710 silicon Inorganic materials 0.000 description 27
- 239000010703 silicon Substances 0.000 description 27
- 239000003638 chemical reducing agent Substances 0.000 description 15
- 239000002994 raw material Substances 0.000 description 12
- 239000008187 granular material Substances 0.000 description 10
- 238000001816 cooling Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- VXEGSRKPIUDPQT-UHFFFAOYSA-N 4-[4-(4-methoxyphenyl)piperazin-1-yl]aniline Chemical compound C1=CC(OC)=CC=C1N1CCN(C=2C=CC(N)=CC=2)CC1 VXEGSRKPIUDPQT-UHFFFAOYSA-N 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000005049 silicon tetrachloride Substances 0.000 description 5
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 4
- ZDHXKXAHOVTTAH-UHFFFAOYSA-N trichlorosilane Chemical compound Cl[SiH](Cl)Cl ZDHXKXAHOVTTAH-UHFFFAOYSA-N 0.000 description 4
- 239000005052 trichlorosilane Substances 0.000 description 4
- 238000011144 upstream manufacturing Methods 0.000 description 4
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- 238000006722 reduction reaction Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- 230000033228 biological regulation Effects 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 239000012267 brine Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- SLLGVCUQYRMELA-UHFFFAOYSA-N chlorosilicon Chemical compound Cl[Si] SLLGVCUQYRMELA-UHFFFAOYSA-N 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000007790 scraping Methods 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- HPALAKNZSZLMCH-UHFFFAOYSA-M sodium;chloride;hydrate Chemical compound O.[Na+].[Cl-] HPALAKNZSZLMCH-UHFFFAOYSA-M 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 2
- 235000005074 zinc chloride Nutrition 0.000 description 2
- 239000011592 zinc chloride Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 229910003902 SiCl 4 Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 235000019628 coolness Nutrition 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- MROCJMGDEKINLD-UHFFFAOYSA-N dichlorosilane Chemical compound Cl[SiH2]Cl MROCJMGDEKINLD-UHFFFAOYSA-N 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000012266 salt solution Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000007669 thermal treatment Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 150000003751 zinc Chemical class 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/02—Silicon
- C01B33/021—Preparation
- C01B33/027—Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material
- C01B33/033—Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material by reduction of silicon halides or halosilanes with a metal or a metallic alloy as the only reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Silicon Compounds (AREA)
Abstract
Description
Claims (5)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007071076 | 2007-03-19 | ||
JP2007-071076 | 2007-03-19 | ||
JP2007071076 | 2007-03-19 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101311113A CN101311113A (zh) | 2008-11-26 |
CN101311113B true CN101311113B (zh) | 2013-01-09 |
Family
ID=39719706
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200810084016XA Expired - Fee Related CN101311113B (zh) | 2007-03-19 | 2008-03-18 | 高纯度多晶硅的制造装置及制造方法 |
Country Status (6)
Country | Link |
---|---|
US (2) | US7785546B2 (zh) |
JP (1) | JP5040716B2 (zh) |
KR (1) | KR101366659B1 (zh) |
CN (1) | CN101311113B (zh) |
DE (1) | DE102008013543A1 (zh) |
TW (1) | TWI417241B (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102006050901A1 (de) * | 2005-11-17 | 2007-05-31 | Solarworld Industries Deutschland Gmbh | Verfahren zum Herstellen eines Halbleiterkörpers und zum Herstellen einer Halbleitervorrichtung |
US7922814B2 (en) * | 2005-11-29 | 2011-04-12 | Chisso Corporation | Production process for high purity polycrystal silicon and production apparatus for the same |
US20100034526A1 (en) * | 2008-08-07 | 2010-02-11 | Martin Kleemann | Steam generator |
JP2012520759A (ja) * | 2009-03-20 | 2012-09-10 | スソンテック カンパニー リミテッド | 熱変換反応密閉容器 |
EP2481707A1 (en) * | 2009-09-25 | 2012-08-01 | JX Nippon Oil & Energy Corporation | Method for manufacturing silicon tetrachloride and method for manufacturing silicon for use in a solar cell |
JPWO2012073712A1 (ja) * | 2010-11-30 | 2014-05-19 | Jnc株式会社 | 亜鉛ガスの供給方法および供給装置 |
CN103466634B (zh) * | 2013-09-03 | 2015-07-15 | 新特能源股份有限公司 | 一种多晶硅生产中原料混合氯硅烷节能回收工艺 |
CN106861557B (zh) * | 2017-04-24 | 2023-03-10 | 中国科学技术大学 | 一种用于cvd固态源的挥发装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3041145A (en) * | 1957-07-15 | 1962-06-26 | Robert S Aries | Production of pure silicon |
CN1204298A (zh) * | 1996-10-14 | 1999-01-06 | 川崎制铁株式会社 | 多晶硅的制造方法和装置以及太阳能电池用硅基片的制造方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60161327A (ja) | 1984-01-31 | 1985-08-23 | Ube Ind Ltd | 高純度マグネシア微粉末の製造法 |
JP2867306B2 (ja) | 1991-11-15 | 1999-03-08 | 三菱マテリアルポリシリコン株式会社 | 半導体級多結晶シリコンの製造方法とその装置 |
JP3958092B2 (ja) * | 2001-06-05 | 2007-08-15 | 株式会社トクヤマ | シリコン生成用反応装置 |
JP2003034519A (ja) | 2001-07-18 | 2003-02-07 | Yutaka Kamaike | シリコンの製造方法 |
JP2003342016A (ja) | 2002-05-24 | 2003-12-03 | Takayuki Shimamune | 多結晶シリコンの製造方法 |
JP4462839B2 (ja) * | 2003-03-19 | 2010-05-12 | 株式会社キノテック・ソーラーエナジー | シリコンの製造装置及び製造方法 |
WO2004035472A1 (ja) * | 2002-09-12 | 2004-04-29 | Takayuki Shimamune | 高純度シリコンの製造方法及び装置 |
JP2007051026A (ja) * | 2005-08-18 | 2007-03-01 | Sumco Solar Corp | シリコン多結晶の鋳造方法 |
JP4692247B2 (ja) * | 2005-11-29 | 2011-06-01 | チッソ株式会社 | 高純度多結晶シリコンの製造方法 |
US7922814B2 (en) * | 2005-11-29 | 2011-04-12 | Chisso Corporation | Production process for high purity polycrystal silicon and production apparatus for the same |
JP4983276B2 (ja) * | 2007-01-29 | 2012-07-25 | Jnc株式会社 | 金属の溶融蒸発装置 |
-
2008
- 2008-02-20 JP JP2008038880A patent/JP5040716B2/ja not_active Expired - Fee Related
- 2008-03-11 DE DE102008013543A patent/DE102008013543A1/de not_active Withdrawn
- 2008-03-17 US US12/049,641 patent/US7785546B2/en not_active Expired - Fee Related
- 2008-03-17 KR KR1020080024290A patent/KR101366659B1/ko not_active IP Right Cessation
- 2008-03-18 TW TW097109489A patent/TWI417241B/zh not_active IP Right Cessation
- 2008-03-18 CN CN200810084016XA patent/CN101311113B/zh not_active Expired - Fee Related
-
2010
- 2010-07-22 US US12/841,452 patent/US8273317B2/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3041145A (en) * | 1957-07-15 | 1962-06-26 | Robert S Aries | Production of pure silicon |
CN1204298A (zh) * | 1996-10-14 | 1999-01-06 | 川崎制铁株式会社 | 多晶硅的制造方法和装置以及太阳能电池用硅基片的制造方法 |
Also Published As
Publication number | Publication date |
---|---|
US20080233037A1 (en) | 2008-09-25 |
TWI417241B (zh) | 2013-12-01 |
KR20080085716A (ko) | 2008-09-24 |
US8273317B2 (en) | 2012-09-25 |
JP5040716B2 (ja) | 2012-10-03 |
JP2008260675A (ja) | 2008-10-30 |
CN101311113A (zh) | 2008-11-26 |
US7785546B2 (en) | 2010-08-31 |
KR101366659B1 (ko) | 2014-02-25 |
US20100284886A1 (en) | 2010-11-11 |
TW200838799A (en) | 2008-10-01 |
DE102008013543A1 (de) | 2008-10-02 |
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SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: JNC CORPORATION Free format text: FORMER OWNER: CHISSO CORPORATION Effective date: 20111102 |
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C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20111102 Address after: Japan Tokyo Chiyoda Otemachi two chome 2 No. 1 Applicant after: JNC Corporation Address before: Japan Osaka Osaka North Island in the three chome 3 No. 23 Applicant before: Chisso Corporation |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130109 Termination date: 20160318 |