CN101295699A - 带引脚的基板、布线基板和半导体器件 - Google Patents
带引脚的基板、布线基板和半导体器件 Download PDFInfo
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Abstract
本发明涉及带引脚的基板、布线基板和半导体器件,带引脚的基板包括引脚和其中形成有连接了引脚的通孔的支撑基板。引脚的头部安置在通孔中。通过把头部按压在通孔中来连接该引脚。
Description
本发明要求2007年4月27日提交到日本专利局的日本专利申请No.2007-119011的优先权。日本专利申请No.2007-119011通过引用整体结合于此。
技术领域
本公开涉及在包括引脚作为外部连接端子的布线基板或者半导体器件中使用的带引脚的基板、使用该带引脚的基板的半导体器件和布线基板。
背景技术
PGA型半导体器件的一个优点是仅通过把引脚插入插座就可以安装该半导体器件,而不需要如BGA型半导体器件中所述的以回流焊来安装的复杂步骤。PGA型半导体器件还具有仅通过重新插入该产品就可对产品进行替换的优点,它被用于各种电子产品中。
在PGA型半导体器件中,一种把通过将引脚直立于基板上而形成的带引脚基板装配来作为内插器的产品已经被提出,用作通过把引脚焊接到布置在布线基板安装侧表面上的用于引脚焊接的焊盘上而构造的产品(专利参考文献1到3)。
在用于这些半导体器件的带引脚的基板中,通过在基板上穿出引脚连接孔(pin attachment hole)并将引脚的杆部插入该引脚连接孔中来构造带引脚的基板。半导体器件是通过采用如焊剂之类的导电材料把与该带引脚的基板相连接的引脚的头部焊接到形成在布线基板上的焊盘来构造的。
[专利文献1]日本专利申请公开No.7-169876
[专利文献2]日本专利申请公开No.9-129778
[专利文献3]日本专利申请公开No.2000-22019
在把使用如上所述的带引脚基板的半导体器件装配作为内插器的产品中,在构造带引脚的基板的情况下首先需要在基板中形成用于插入引脚杆部的通孔。然而,在近年来的半导体器件中引脚直径变得非常细,因此出现了这样的问题,形成用于插入引脚杆部的通孔的工作很复杂而且效率低。在一些半导体器件中,即使是一个基板也必须形成用于插入非常多的引脚的通孔,从而成为半导体器件生产率的大问题。
而且,带引脚的基板具有在引脚与形成于布线基板上的用于引脚连接的焊盘之间的焊接可靠性的问题。
发明内容
本发明的示例实施例提供一种带引脚的基板、使用所述带引脚的基板的布线基板和半导体器件,其中可以容易地制造被用作构成半导体器件的内插器的所述带引脚的基板,并提高了带引脚的基板的生产率,从而可以减少半导体封装或半导体器件的制造成本。
示例实施例包括如下构造。
即,一种布线基板包括基板、形成于基板一侧的表面上的焊盘、电连接到焊盘的引脚、和用于支撑引脚的具有通孔的支撑基板,其中引脚的头部安置在通孔中。
此外,在把引脚容易地和稳妥地支撑在支撑基板中这一方面,将所述头部按压在通孔中是有效的。
在通过把所述头部的顶端从支撑基板的表面突出来改善对布线基板焊盘的焊接这一方面也是有效的。
还有一个优点,通过将头部形成为顶端直径扩展的锥形改善了引脚到支撑基板的连接。
此外,通过在所述头部的外周侧面形成凹槽来以通孔或支撑基板的内周面稳妥地固定头部是有效的。
还可以通过在支撑基板中安装电子元件来把布线基板构成为组合模块。
另外,一种带引脚的基板包括引脚以及引脚连接到其上的具有通孔的支撑基板,其中引脚的头部安置在通孔中。对于带引脚的基板,优选使用的是:把所述头部按压到通孔中而形成的基板,把所述头部的顶端从支撑基板的表面突出而形成的基板,以顶端直径扩展的锥形来形成所述头部而形成的基板,在所述头部的外周侧面形成凹槽而形成的基板,以及在支撑基板中安装电子元件而形成的基板。
另外,一种半导体器件包括半导体元件、具有形成于基板一侧的表面上的第一电极焊盘和形成于基板另一侧的表面上的第二电极焊盘的基板、电连接到第一电极焊盘的引脚、具有与第一电极焊盘的布置对应的通孔的支撑基板,其中引脚的头部安置在通孔中而半导体元件与第二电极焊盘电连接。
此外,把所述头部按压在通孔中、把所述头部的顶端从支撑基板的表面突出、以顶端静止扩展的锥形来形成头部、以及在头部的外周侧面形成凹槽均是有效的。优点是通过在支撑基板中安装电子元件而提供了一种半导体器件作为组合模块。
根据本发明,可以在支撑基板中形成使引脚头部置于其中的通孔,其中该支撑基板通过构造为使得引脚头部置于带引脚基板的通孔中而构成带引脚的基板。因此,通过钻削之类在支撑基板中形成通孔的工作可以变得足够有效。由于通孔的孔径变大,因此还可以执行层压多个支撑基板和形成通孔的操作,并可提高带引脚的基板的生产率,从而可减小带引脚半导体器件或带引脚的基板的制造成本。
从以下详细描述、附图以及权利要求中其它特征和优点将会十分明显。
附图说明
图1A到1C是示出根据本发明的带引脚的基板的构造的剖视图。
图2A和2B是示出带引脚的基板的其它构造的剖视图。
图3A和3B是示出带引脚的基板的又一构造的剖视图。
图4A和4B是示出将带引脚的基板焊接到布线基板的步骤的剖视图。
图5A和5B是示出通过把带引脚的基板焊接到布线基板而形成的半导体产品的构造的剖视图。
图6A和6B是示出带引脚的基板另一构造的剖视图。
图7是示出带引脚的基板26的其它构造的剖视图。
图8A是将图7所示带引脚的基板26焊接至布线基板30的示例。
图8B是一种产品的示例,其中半导体元件35被安装在布线基板30上并且通过倒装焊接电连接至图8A所示的布线基板30。
图9A至图9C是示出带引脚的基板27a、27b和27c的其它构造的剖视图,其中电子元件60被安装在图1C中的支撑基板中。
图10A是将带引脚的基板27a焊接至布线基板30的示例。
图10B是一种产品的示例,其中半导体元件35被安装在布线基板30上并且通过倒装焊接电连接至图10A所示的布线基板30。
具体实施方式
下文将参照附图详细描述本发明优选实施例。
图1A到1C示出了根据本发明的带引脚的基板的构造及其制造步骤。
图1A示出在带引脚的基板中使用的支撑基板10的剖视图。支撑基板10是由具有电绝缘特性的板形主体(比如树脂)制成的基板。支撑基板10支撑用于连接的引脚并具有支撑被焊接到带引脚基板的布线基板的强度以使布线基板不翘曲。例如,可以使用以环氧树脂浸渍到玻璃纤维中的树脂材料。
图1B示出在支撑基板10中钻孔来形成按压并连接了引脚头部的通孔11的状态。与焊接了带引脚的基板的布线基板中的电极焊盘的平面布置对应地形成通孔11。引脚间的布置间距根据产品而不同,例如使用1.00mm、1.27mm、2.53mm的间距。同样,连接到支撑基
板10的引脚的数目根据半导体器件尺寸(平面面积)和引脚间的布置间距而不同。有大量引脚的一种类型在一个布线基板(半导体器件)中具有大约1000个引脚。
通孔11可以通过例如钻削来形成。与用于在基板中形成插入了主体直径比头部直径细的引脚主体的插孔的方法相比,用于在支撑基板10中形成把引脚12的头部12a按压到其中的通孔11的方法具有的优点是能够更有效率地在支撑基板10上钻孔。例如,引脚头部的直径大约为0.5到0.75mm,引脚的引脚主体直径在此情况下大约为0.3mm。因此,按压入头部的通孔11比插入引脚主体的孔具有大得多的直径,从而方便了钻孔,并且还可以将多个支撑基板层叠到一起进行钻削来形成孔。用于形成把引脚头部连接到支撑基板10中的通孔11的方法不取决于引脚主体的直径,因此可以使用引脚主体的直径比从前更细的引脚来构造带引脚的基板。
图1C示出把引脚12连接到形成了通孔11的支撑基板10上来形成带引脚的基板20的状态。
引脚12包括可从插座插拔的引脚主体12b以及形成于引脚主体12b末端处的直径比引脚主体12b的直径大的头部12a。引脚12被连接来使得头部12a按压到形成于支撑基板10中的通孔11中,引脚主体12b相对于支撑基板10的基板表面垂直直立,并且引脚主体12b从支撑基板10延伸。
用在本实施例的带引脚的基板20中的引脚12是头部12a的端面形成为平坦表面的引脚。在把头部12a按压到支撑基板10的通孔11中并且头部12a的端面暴露在支撑基板10的外表面上的状态下,头部12a的端面(顶部表面)与支撑基板10的一个表面(在将带引脚的基板焊接到布线基板上的情况下,与布线基板相对的一侧的表面)齐平,同样,支撑基板10的一个表面整体形成为一个平坦表面。引脚12的引脚主体12b从支撑基板10的另一表面延伸。
在该实施例中,引脚12的头部12a的厚度等于支撑基板10的厚度,头部12a被设置为使得在把引脚12的头部12a按压到通孔11中的状态下时刚好嵌入支撑基板10的通孔11中。在头部直径为0.5到0.75mm的引脚中,头部12a的厚度大约是0.3mm。在该示例中,厚度为0.3mm的基板用作支撑基板10。
当如本实施例所述引脚12的头部12a的厚度等于支撑基板10的厚度时,可以不损失引脚12的连接强度而使得支撑基板10的厚度最小化。
当为了加固并支撑布线基板而必须使用具有一定厚度的支撑基板时,还可以使用厚度比引脚12的头部12a更厚的支撑基板来形成带引脚的基板。图2A示出使用了厚度比引脚12的头部12a更厚的支撑基板10a所形成的带引脚的基板。
在支撑基板10a中形成通孔11并且将引脚12的头部12a按压在通孔11中从而连接该引脚12的这种构造与前述图1C所示的带引脚的基板20的构造类似。引脚12的头部12a的端面与支撑基板10a的一个表面齐平并暴露在带引脚的基板21的外表面上。
另一方面,当引脚的头部比构成带引脚的基板的支撑基板厚时,头部从支撑基板的基板表面突出。图2B示出的是这样的示例,把头部13a按压在通孔11中使得头部13a的端面(顶部表面)与支撑基板10b的一个表面齐平,并且在此情况下引脚13的头部13a的引脚主体侧的部分从支撑基板10b的另一表面突出。
在前述所有带引脚的基板20、21、22中,引脚12、13连接来使得头部12a、13a的端面与支撑基板中与带引脚的基板20、21、22的布线基板相对的一个表面齐平。为了使头部12a、13a的端面与带引脚的基板20、21、22的焊接面齐平,在把引脚12、13按压到支撑基板10、10a、10b中的情况下可以在用夹具支撑该支撑基板的同时按压引脚12、13,其中夹具的夹持表面为平整的表面。
引脚12、13的头部12a、13a的侧面与引脚12、13截面形状的轴线方向平行地形成。形成于支撑基板10、10a、10b中的通孔11的侧面与引脚12、13截面形状的轴线方向平行地形成,并具有比头部12a、13a的外直径略小的内直径。引脚12、13构造来使得在按压引脚12、13时被牢牢固定住。
图3A和3B示出:把引脚14连接到支撑基板10c所形成的带引脚的基板23作为带引脚的基板的另一构造示例,其中引脚14包括了外周侧面形成为锥形的头部14a。在前述带引脚的基板的实施例中使用的两种引脚12、13的头部12a、13a的侧面与引脚12、13的截面形状的轴线方向平行地被形成的同时,在该实施例中使用的引脚14的头部14a的侧面被形成为圆台形,其中端面(顶部)侧的直径扩展并朝向引脚14的截面形状的轴线方向倾斜。
在使用其头部14a形成为圆台形的引脚14的情况下,引脚14连接到支撑基板10c使得头部14a从该头部14a的直径缩短侧被按压到形成于支撑基板10c中的通孔11中,如图3B所示。由于头部14a的横截面形成为锥形,因此当引脚14按压到通孔11中时,形成于支撑基板10c中的通孔11被挤压从而连接了引脚14。在把引脚14连接到支撑基板10c时可以通过调整压入引脚14的力、通孔11的内直径和在引脚14中形成的头部14a的外周侧面的圆锥角来调整引脚14的位置。图3B示出了以引脚14的端面(顶部表面)略微突出于支撑基板10c的表面的状态来连接引脚14的情况。
因此,带引脚的基板可以形成来使得引脚头部的端面(顶部表面)略微突出于支撑基板的表面。在一些情况下,还可以形成在头部端面从支撑基板表面略微进入支撑基板的位置处。
为了确保引脚对支撑基板的连接,还可以通过在头部的外周侧面中形成凹槽或以粗糙表面形成头部的外周侧面来改进支撑基板或通孔11与头部外周侧面之间的接合,把引脚稳妥地连接到支撑基板上。图7示出通过把引脚17连接到支撑基板10d所形成的带引脚的基板26作为带引脚的基板的另一构造示例,其中引脚17包括在外周侧面上具有凹槽17c的头部17a。当把引脚17按压到形成于支撑基板10d中的通孔11中时,支撑基板10d的一部分被挤入头部17a的凹槽17c中,从而把引脚17稳妥地连接到支撑基板10d上。在此实施例中,头部17a具有形成在沿头部外周的方向上的一个凹槽17c,但不限于此。例如,头部可以具有多个凹槽。此外,凹槽可以形成为平行于引脚主体17b的轴。
另外,作为使用于带引脚的基板中的引脚,可以使用在引脚外表面上执行了适当的保护镀(如镀镍处理或镀金处理)的引脚。适当的材料如铜或铁镍钴合金可用作引脚的材料。
通过使用焊剂之类的导电材料把上述带引脚的基板焊接到布线基板来作为半导体产品。图4A和4B示出用于通过把带引脚的基板焊接到布线基板上来把半导体器件形成为半导体产品的方法。
图4A示出作为用焊剂将带引脚的基板焊接到布线基板的前一步骤而把焊剂40提供到用于布线基板30引脚连接的焊盘32上的情况。例如通过印制法(print method)来提供焊剂40。
布线基板30的构造类似于相关技术中包括了用于引脚连接的焊盘的布线基板的构造。在布线基板30的引脚所焊接的一侧表面上形成用于焊接引脚的焊盘32,并在布线基板30的另一侧表面形成半导体元件安装部件。
与半导体元件电连接的电极焊盘形成在布置于布线基板30的半导体元件安装部件上,这些电极焊盘通过倒装焊或丝焊与半导体元件电连接。图4A示出通过倒装焊安装半导体元件35的示例。
在本实施例中,示出了在把半导体元件35安装到布线基板30上之后把带引脚的基板20焊接到布线基板30上的示例,但是显然可以在把带引脚的基板20焊接到布线基板30之后再安装半导体元件35。
图4B示出以回流焊步骤把带引脚的基板20焊接到布线基板30的状态。在回流焊步骤中,带引脚的基板20和布线基板30由支撑夹具50夹持并通过回流焊炉而被焊剂焊接。带引脚的基板20和布线基板30由连接到带引脚的基板20上与用于布线基板30连接的焊盘32相对的头部12a来支撑。由于连接到带引脚的基板20的引脚12的头部12a被预制成使平面排布位置与形成于布线基板30上用于连接的焊盘32相匹配,因此,通过把布线基板30与支撑夹具50夹持的带引脚的基板20进行对准,以把引脚12的头部12a定位来与布线基板30的焊盘32一一对应。
如图4B所示,带引脚的基板20和布线基板30由支撑夹具50以与焊接表面相互抵靠的状态来夹持并通过回流焊炉。因此,焊剂40熔化,连接到基板20的引脚12的头部12a被焊剂焊接到布线基板30的焊盘32上。
图5A是用焊剂把带引脚的基板20焊接到布线基板30上的状态。连接到带引脚的基板20上的引脚12的头部12a每个都由焊剂40焊接到布线基板30的焊盘32上。图5B是一种安装在布线基板30上的半导体元件通过丝焊与布线基板30电连接并由树脂36密封的产品的示例,以及示出了使用厚度比图5A的带引脚的基板20的厚度稍厚的支撑基板10a作为带引脚的基板21的示例。图8A和图8B示出了使用图7中的带引脚基板26来代替图5A中的带引脚基板20的示例,并且图8A是将带引脚的基板26焊接到布线基板30的示例,图8B是一种产品的示例,其中半导体元件35被安装在布线基板30上并且通过倒装焊接电连接至图8A中的布线基板。
根据如本实施例所述用于通过把与布线基板30分开地形成的带引脚的基板20焊接到布线基板30来形成半导体产品的方法,优点是能够用作布线基板30而不会改变相关技术的用于引脚连接的焊盘的布置,并且在用焊剂把引脚12的头部12a焊接到焊盘32的前提下可以设计焊盘32的排列或焊盘32的尺寸。因此,能以比从前更高的密度来排列焊盘32。
此外,在带引脚的基板20中,引脚12支撑在支撑基板10中,因此在回流焊步骤中不必如相关技术的用于支撑引脚的支撑夹具那样由夹具来导引和支撑每个引脚12,并且从支撑夹具50中拾取产品的操作也很简单。另外,可以避免基板变形或在从支撑夹具中取出引脚时不能取出引脚的情况。还可以简化支撑夹具50的构造,并且只要布线基板具有相同的外形尺寸,支撑夹具50就可以通用。
带引脚的基板20还具有加固布线基板30的预定强度,因此用焊剂把带引脚的基板20焊接到布线基板30上,从而加固了布线基板30并且抑制了布线基板30翘曲变形。即使在布线基板30很薄且没有足够的形状保持性时,也可以提供通过焊接带引脚的基板20来避免布线基板30变形的焊接了带引脚的基板的布线基板或者半导体器件。此外,在用焊剂把带引脚的基板20焊接到布线基板30上之后,还可以通过采用用于加固的树脂填充带引脚的基板20与布线基板30之间的焊接部分的间隙来实现半导体产品的加固。
如上所述,最后通过焊剂把带引脚的基板20焊接到布线基板30上,构成了半导体器件。用焊剂把连接到带引脚的基板20上的引脚12焊接到布线基板30上,得到从插座插拔所需的焊接强度。因此,当引脚12连接到带引脚的基板20时,必须对引脚12支撑到使得在处理把带引脚的基板20焊接到布线基板30的时候引脚12不会移动或从支撑基板10脱落的程度。在如上所述把引脚12按压到支撑基板10中从而连接引脚12的操作中,保证了这种程度的引脚12的连接能力。
另外,已经通过仅将引脚连接到支撑基板来形成本实施例的带引脚的基板,但是还可以通过构造这样的支撑基板来构造带引脚的基板,即通过除了用于连接的引脚之外还在支撑基板上安装电阻器或电容器之类的电子元件(电路元件)并把引脚连接到支撑基板上而被模块化的支撑基板,还可通过把带引脚的基板焊接到布线基板来形成组合模块化半导体产品(图9A至图9C和图10A至图10B)。图9A至图9C示出带引脚的基板27a、27b和27c,其中电子元件60安装在支撑基板10上。图10A是将带引脚的基板27a焊接至布线基板30的示例,图10B是一种产品的示例,其中半导体元件35被安装在布线基板30上并且通过倒装焊接电连接至图10A中的布线基板30。在这种情况下,还可以把带引脚的基板形成来大于布线基板以得到安装电路元件的空间。还可以构成来使得在支撑基板上形成与电子元件电连接的布线图案并通过布线图案把电子元件电连接到头部。
而且,还可以把用于将焊接到焊盘32的电极布置在支撑基板上、将用于把电极电连接到引脚头部的布线图案布置在支撑基板上以及通过焊剂之类的导电材料把焊盘32电焊接到电极上的方法用来作为把连接到带引脚的基板上的引脚与布置在布线基板30上的焊盘32电连接的方法。
图6A和6B示出连接到支撑基板10的引脚的另一示例。在上述实施例中,在所有的引脚12、13、14中,头部12a、13a、14a的端面(顶部表面)形成为平整的表面,但是如图6A和6B所示,还可以使用这样的引脚,其中头部的端面形成为如球形或圆锥形表面之类的曲线表面,或者顶端形成为尖锐的形状。
图6A是通过把头部15a端面侧(焊接表面侧)形成为球面的引脚15连接到支撑基板10而形成的带引脚的基板24的示例,图6B是通过把头部16a端面侧形成为圆锥面的引脚16连接到支撑基板10而形成的带引脚的基板25的示例。
当引脚15、16的头部15a、16a的端面形成为如这些带引脚的基板24、25中所示的外凸形状时,优点是在带引脚的基板24、25与布线基板30对准时头部15a、16a的端面抵靠到焊盘上,从而容易对准,并且优点是增加了焊剂接合情况下的气孔排出动作(voidrelease action)以及焊剂与引脚头部端面间的焊接区域,提高了引脚15、16与焊盘32之间的焊接强度。
已经采用有限的实施例描述了本发明,从本公开中获益的本领域所属技术人员将会理解还可以设计出不脱离这里公开的本发明的范围的其它实施例。因此,本发明的范围应当仅由所附权利要求限定。
Claims (18)
1.一种布线基板,包括:
基板;
在所述基板一侧的表面上形成的焊盘;
与所述焊盘电连接的引脚;和
用于支撑所述引脚的具有通孔的支撑基板,
其中所述引脚的头部安置在所述通孔中。
2.如权利要求1所述的布线基板,其中所述头部被按压在通孔中。
3.如权利要求1或2所述的布线基板,其中所述头部的顶端从所述支撑基板的表面突出。
4.如权利要求1或2所述的布线基板,其中所述头部被形成为顶端直径扩展的锥形。
5.如权利要求1或2所述的布线基板,其中在所述头部的外周侧面中形成有凹槽。
6.如权利要求1或2所述的布线基板,其中在所述支撑基板中安装了电子元件。
7.一种带引脚的基板,包括:
引脚;和
具有连接了所述引脚的通孔的支撑基板,
其中所述引脚的头部安置在通孔中。
8.如权利要求7所述的基板,其中所述头部被按压在所述通孔中。
9.如权利要求7或8所述的基板,其中所述头部的顶端从所述支撑基板的表面突出。
10.如权利要求7或8所述的基板,其中所述头部被形成为顶端直径扩展的锥形。
11.如权利要求7或8所述的基板,其中在所述头部的外周侧面中形成有凹槽。
12.如权利要求7或8所述的基板,其中在所述支撑基板中安装了电子元件。
13.一种半导体器件,包括:
半导体元件;
基板,该基板具有形成于所述基板一侧的表面上的第一电极焊盘和形成于所述基板另一侧的表面上的第二电极焊盘;
电连接到所述第一电极焊盘的引脚;和
具有与所述第一电极焊盘的布置对应的通孔的支撑基板,
其中所述引脚的头部安置在所述通孔中,并且所述半导体元件电连接到所述第二电极焊盘。
14.如权利要求13所述半导体器件,其中所述头部被按压在所述通孔中。
15.如权利要求13或14所述的半导体器件,其中所述头部的顶端从所述支撑基板的表面突出。
16.如权利要求13或14所述的半导体器件,其中所述头部被形成为顶端直径扩展的锥形。
17.如权利要求13或14所述的半导体器件,其中在所述头部的外周侧面中形成有凹槽。
18.如权利要求13或14所述的半导体器件,其中在所述支撑基板中安装了电子元件。
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Application Number | Priority Date | Filing Date | Title |
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JP2007119011A JP2008277525A (ja) | 2007-04-27 | 2007-04-27 | ピン付き基板並びに配線基板および半導体装置 |
JP2007-119011 | 2007-04-27 |
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CN101295699A true CN101295699A (zh) | 2008-10-29 |
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US (1) | US20080265398A1 (zh) |
JP (1) | JP2008277525A (zh) |
KR (1) | KR20080096434A (zh) |
CN (1) | CN101295699A (zh) |
TW (1) | TW200843046A (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105762126A (zh) * | 2016-03-30 | 2016-07-13 | 南通明芯微电子有限公司 | 一种激光二极管 |
CN110009083A (zh) * | 2018-01-04 | 2019-07-12 | 三星电子株式会社 | 存储卡和包括该存储卡的电子设备 |
Families Citing this family (9)
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JP5281346B2 (ja) * | 2008-09-18 | 2013-09-04 | 新光電気工業株式会社 | 半導体装置及びその製造方法 |
JP5160390B2 (ja) * | 2008-12-15 | 2013-03-13 | 新光電気工業株式会社 | リードピン付配線基板及びその製造方法 |
KR20120069443A (ko) * | 2010-12-20 | 2012-06-28 | 삼성전기주식회사 | 패키지 기판용 리드핀과 상기 패키지 기판용 리드핀을 포함하는 반도체 패키지 인쇄회로기판 |
JP5679827B2 (ja) * | 2011-01-07 | 2015-03-04 | 京セラ株式会社 | 配線基板および多数個取り配線基板 |
JP2012164965A (ja) * | 2011-01-21 | 2012-08-30 | Ngk Spark Plug Co Ltd | 配線基板及びその製造方法 |
US9253936B2 (en) | 2011-02-25 | 2016-02-02 | Telefonaktiebolaget L M Ericsson | Method for mounting connection pins in a component carrier, a die tool for mounting connection pins, a component carrier forming a module for an electronic assembly, and such an assembly |
EP2679080B1 (en) | 2011-02-25 | 2019-07-24 | Telefonaktiebolaget LM Ericsson (publ) | A connection pin for mounting in a component carrier, a method for producing an electronic assembly comprising a motherboard with stackable modules comprising a component carrier, and such an electronic assembly |
CN103385040A (zh) | 2011-02-25 | 2013-11-06 | 瑞典爱立信有限公司 | 连接引脚和将连接引脚安装于电子组件的部件载体中的方法、以及这种包括连接引脚的部件载体 |
DE102013103090B4 (de) * | 2013-03-26 | 2016-07-14 | Borgwarner Ludwigsburg Gmbh | Glühkerzensteuergerät |
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JPS63194349A (ja) * | 1987-01-28 | 1988-08-11 | テキサス インスツルメンツ インコーポレイテッド | ピン・グリッド接触器 |
FR2618254B1 (fr) * | 1987-07-16 | 1990-01-05 | Thomson Semiconducteurs | Procede et structure de prise de contact sur des plots de circuit integre. |
US4871317A (en) * | 1987-12-02 | 1989-10-03 | A. O. Smith Corporation | Surface mounted component adaptor for interconnecting of surface mounted circuit components |
JPH0756887B2 (ja) * | 1988-04-04 | 1995-06-14 | 株式会社日立製作所 | 半導体パッケージ及びそれを用いたコンピュータ |
US5155905A (en) * | 1991-05-03 | 1992-10-20 | Ltv Aerospace And Defense Company | Method and apparatus for attaching a circuit component to a printed circuit board |
JPH07169876A (ja) * | 1993-04-13 | 1995-07-04 | Shinko Electric Ind Co Ltd | 半導体装置及び半導体装置用実装キャリア |
JP3813767B2 (ja) * | 1999-07-21 | 2006-08-23 | 日本特殊陶業株式会社 | 樹脂製配線基板及びその製造方法 |
US6448106B1 (en) * | 1999-11-09 | 2002-09-10 | Fujitsu Limited | Modules with pins and methods for making modules with pins |
-
2007
- 2007-04-27 JP JP2007119011A patent/JP2008277525A/ja active Pending
-
2008
- 2008-04-25 TW TW097115261A patent/TW200843046A/zh unknown
- 2008-04-25 CN CNA2008100892376A patent/CN101295699A/zh active Pending
- 2008-04-25 US US12/109,919 patent/US20080265398A1/en not_active Abandoned
- 2008-04-25 KR KR1020080038570A patent/KR20080096434A/ko not_active Application Discontinuation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105762126A (zh) * | 2016-03-30 | 2016-07-13 | 南通明芯微电子有限公司 | 一种激光二极管 |
CN110009083A (zh) * | 2018-01-04 | 2019-07-12 | 三星电子株式会社 | 存储卡和包括该存储卡的电子设备 |
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TW200843046A (en) | 2008-11-01 |
US20080265398A1 (en) | 2008-10-30 |
JP2008277525A (ja) | 2008-11-13 |
KR20080096434A (ko) | 2008-10-30 |
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