CN101289000B - 防护薄膜组件收纳容器及其制造方法 - Google Patents

防护薄膜组件收纳容器及其制造方法 Download PDF

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Publication number
CN101289000B
CN101289000B CN2008100884577A CN200810088457A CN101289000B CN 101289000 B CN101289000 B CN 101289000B CN 2008100884577 A CN2008100884577 A CN 2008100884577A CN 200810088457 A CN200810088457 A CN 200810088457A CN 101289000 B CN101289000 B CN 101289000B
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China
Prior art keywords
protective film
film assembly
assembly container
container member
manufacture method
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CN2008100884577A
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English (en)
Chinese (zh)
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CN101289000A (zh
Inventor
关原一敏
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Shin Etsu Chemical Co Ltd
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Shin Etsu Chemical Co Ltd
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Publication of CN101289000A publication Critical patent/CN101289000A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70983—Optical system protection, e.g. pellicles or removable covers for protection of mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70991—Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Environmental & Geological Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Packaging Frangible Articles (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN2008100884577A 2007-04-20 2008-03-31 防护薄膜组件收纳容器及其制造方法 Active CN101289000B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP111595/07 2007-04-20
JP2007111595A JP4822357B2 (ja) 2007-04-20 2007-04-20 ペリクル収納容器、および、その製造方法

Publications (2)

Publication Number Publication Date
CN101289000A CN101289000A (zh) 2008-10-22
CN101289000B true CN101289000B (zh) 2011-08-31

Family

ID=40033527

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008100884577A Active CN101289000B (zh) 2007-04-20 2008-03-31 防护薄膜组件收纳容器及其制造方法

Country Status (5)

Country Link
JP (1) JP4822357B2 (ja)
KR (1) KR20080094549A (ja)
CN (1) CN101289000B (ja)
HK (1) HK1120471A1 (ja)
TW (1) TW200902400A (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011007827A (ja) * 2009-06-23 2011-01-13 Shin Etsu Polymer Co Ltd 大型精密部材収納容器
WO2011001522A1 (ja) * 2009-07-01 2011-01-06 Hoya株式会社 マスクブランク収納ケース及びマスクブランクの収納方法、並びにマスクブランク収納体
JP2016114733A (ja) * 2014-12-15 2016-06-23 コニカミノルタ株式会社 光学素子の製造方法
CN107003602B (zh) * 2015-02-24 2021-03-12 三井化学株式会社 防护膜组件膜、防护膜组件框体、防护膜组件及其制造方法
KR102186468B1 (ko) * 2018-02-07 2020-12-03 윤세원 전자부품 용기의 제조방법
KR102072286B1 (ko) * 2018-01-29 2020-04-01 윤세원 전자부품 용기의 제조방법

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1451530A (zh) * 2002-04-17 2003-10-29 屠林华 一种超薄软面abs塑料箱包及其生产方法
CN1935939A (zh) * 2005-09-20 2007-03-28 上海新阳电子化学有限公司 一种集成电路封装后处理用去毛刺溶液

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5882741A (ja) * 1981-11-13 1983-05-18 Nippon Denso Co Ltd プラスチツク容器の製造方法
JPS5949920A (ja) * 1982-09-14 1984-03-22 Mitsuboshi Belting Ltd 成形体のバリ除去装置
JP2631729B2 (ja) * 1988-12-13 1997-07-16 株式会社プラコー 合成樹脂ブロー成形品のバリ取り装置
JP2772840B2 (ja) * 1989-11-06 1998-07-09 株式会社プラコー 合成樹脂製成形品のバリ取り方法及びその装置
JP3636820B2 (ja) * 1996-05-24 2005-04-06 積水化学工業株式会社 液体容器の製造方法
JP2000173887A (ja) * 1998-12-02 2000-06-23 Asahi Kasei Denshi Kk ペリクル収納ケース
JP2000296549A (ja) * 1999-04-16 2000-10-24 Seiko Epson Corp トナーカートリッジケースの製造方法
JP3778111B2 (ja) * 2002-03-25 2006-05-24 日産自動車株式会社 中空成形体の成形装置および成形方法
JP4236535B2 (ja) * 2003-07-31 2009-03-11 旭化成エレクトロニクス株式会社 大型ペリクル収納容器
JP4614845B2 (ja) * 2005-08-11 2011-01-19 信越ポリマー株式会社 ペリクル用収納容器
JP2007128030A (ja) * 2005-10-07 2007-05-24 Shin Etsu Polymer Co Ltd ペリクル用収納容器

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1451530A (zh) * 2002-04-17 2003-10-29 屠林华 一种超薄软面abs塑料箱包及其生产方法
CN1935939A (zh) * 2005-09-20 2007-03-28 上海新阳电子化学有限公司 一种集成电路封装后处理用去毛刺溶液

Also Published As

Publication number Publication date
JP2008268570A (ja) 2008-11-06
HK1120471A1 (en) 2009-04-03
KR20080094549A (ko) 2008-10-23
JP4822357B2 (ja) 2011-11-24
TW200902400A (en) 2009-01-16
CN101289000A (zh) 2008-10-22

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