CN101211812B - 基板处理装置 - Google Patents
基板处理装置 Download PDFInfo
- Publication number
- CN101211812B CN101211812B CN2007103081123A CN200710308112A CN101211812B CN 101211812 B CN101211812 B CN 101211812B CN 2007103081123 A CN2007103081123 A CN 2007103081123A CN 200710308112 A CN200710308112 A CN 200710308112A CN 101211812 B CN101211812 B CN 101211812B
- Authority
- CN
- China
- Prior art keywords
- counter
- retaining member
- substrate
- rotating retaining
- rotating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/067—Sheet handling, means, e.g. manipulators, devices for turning or tilting sheet glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
Abstract
Description
Claims (14)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006-351998 | 2006-12-27 | ||
JP2006351998 | 2006-12-27 | ||
JP2006351998A JP4726776B2 (ja) | 2006-12-27 | 2006-12-27 | 反転装置およびそれを備えた基板処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101211812A CN101211812A (zh) | 2008-07-02 |
CN101211812B true CN101211812B (zh) | 2010-10-13 |
Family
ID=39582204
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007103081123A Active CN101211812B (zh) | 2006-12-27 | 2007-12-27 | 基板处理装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7878213B2 (zh) |
JP (1) | JP4726776B2 (zh) |
KR (1) | KR100934318B1 (zh) |
CN (1) | CN101211812B (zh) |
TW (1) | TWI364088B (zh) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5004612B2 (ja) * | 2007-02-15 | 2012-08-22 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP5201576B2 (ja) * | 2008-03-24 | 2013-06-05 | 株式会社安川電機 | 揺動機構を有するハンド及びそれを備えた基板搬送装置 |
JP5107122B2 (ja) * | 2008-04-03 | 2012-12-26 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP5243569B2 (ja) * | 2011-03-07 | 2013-07-24 | 東京エレクトロン株式会社 | 基板搬送装置、基板搬送方法及びその基板搬送方法を実行させるためのプログラムを記録した記録媒体 |
JP5709592B2 (ja) | 2011-03-08 | 2015-04-30 | 東京エレクトロン株式会社 | 基板搬送方法、その基板搬送方法を実行させるためのプログラムを記録した記録媒体及び基板搬送装置 |
JP5792981B2 (ja) * | 2011-04-05 | 2015-10-14 | 川崎重工業株式会社 | 板状部材反転システム及びその反転移送方法 |
JP5877016B2 (ja) * | 2011-08-26 | 2016-03-02 | 株式会社Screenホールディングス | 基板反転装置および基板処理装置 |
TWI513646B (zh) * | 2012-02-17 | 2015-12-21 | Shibaura Mechatronics Corp | A reversing device for a substrate, a reversing method, and a processing device for a substrate |
JP5283770B2 (ja) * | 2012-05-15 | 2013-09-04 | 大日本スクリーン製造株式会社 | 基板搬送装置およびこれを備えた基板処理装置 |
JP6009832B2 (ja) * | 2012-06-18 | 2016-10-19 | 株式会社Screenホールディングス | 基板処理装置 |
JP5524304B2 (ja) * | 2012-09-27 | 2014-06-18 | 大日本スクリーン製造株式会社 | 基板処理装置における基板搬送方法 |
US9099510B2 (en) * | 2013-03-15 | 2015-08-04 | Genmark Automation, Inc. | Workpiece flipping mechanism for space-constrained environment |
JP5557942B2 (ja) * | 2013-04-04 | 2014-07-23 | 東京エレクトロン株式会社 | 基板搬送装置 |
JP6205182B2 (ja) * | 2013-06-11 | 2017-09-27 | 株式会社ディスコ | スピンナーユニット及び研削洗浄方法 |
JP6181438B2 (ja) * | 2013-06-24 | 2017-08-16 | 株式会社荏原製作所 | 基板保持装置および基板洗浄装置 |
JP6300463B2 (ja) * | 2013-08-07 | 2018-03-28 | 三星ダイヤモンド工業株式会社 | 反転装置 |
CN203602097U (zh) * | 2013-10-28 | 2014-05-21 | 富鼎电子科技(嘉善)有限公司 | 翻面机 |
US10236196B2 (en) | 2013-11-14 | 2019-03-19 | Tokyo Electron Limited | Substrate processing system |
JP5977729B2 (ja) * | 2013-11-14 | 2016-08-24 | 東京エレクトロン株式会社 | 基板処理システム |
JP5977728B2 (ja) * | 2013-11-14 | 2016-08-24 | 東京エレクトロン株式会社 | 基板処理システム |
TWI735438B (zh) * | 2015-03-30 | 2021-08-11 | 日商尼康股份有限公司 | 物體搬運裝置、曝光裝置、平板顯示器的製造方法、元件製造方法、物體搬運方法以及曝光方法 |
KR101800169B1 (ko) * | 2017-01-11 | 2017-12-20 | 주식회사 디이엔티 | 패널 상하 반전 장치 및 그 방법 |
CN106882596B (zh) | 2017-03-23 | 2019-07-16 | 京东方科技集团股份有限公司 | 基板上下料系统、基板上料方法及基板下料方法 |
CN108666232B (zh) * | 2017-03-28 | 2021-11-12 | 雷仲礼 | 基板处理系统、基板翻转装置和方法 |
KR20200093721A (ko) * | 2019-01-28 | 2020-08-06 | 삼성디스플레이 주식회사 | 기판 반전 장치 |
JP2022524886A (ja) * | 2019-03-27 | 2022-05-10 | ヤスカワ ユーロップ テクノロジー リミテッド | 半導体反転装置 |
CN111547504B (zh) * | 2020-05-15 | 2021-09-03 | 苏州精濑光电有限公司 | 一种产品双面全检设备及其检测方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3052105B2 (ja) * | 1992-11-20 | 2000-06-12 | 東京エレクトロン株式会社 | 洗浄処理装置 |
US5518542A (en) * | 1993-11-05 | 1996-05-21 | Tokyo Electron Limited | Double-sided substrate cleaning apparatus |
TW318258B (zh) * | 1995-12-12 | 1997-10-21 | Tokyo Electron Co Ltd | |
JPH10275766A (ja) | 1997-03-28 | 1998-10-13 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
US7108752B2 (en) * | 2000-06-05 | 2006-09-19 | Tokyo Electron Limited | Liquid processing apparatus and liquid processing method |
JP3888608B2 (ja) * | 2001-04-25 | 2007-03-07 | 東京エレクトロン株式会社 | 基板両面処理装置 |
JP4342147B2 (ja) * | 2002-05-01 | 2009-10-14 | 大日本スクリーン製造株式会社 | 基板処理装置 |
TWI262165B (en) * | 2002-10-16 | 2006-09-21 | Sez Ag | Device and method for transporting wafer-shaped articles |
JP2004327674A (ja) * | 2003-04-24 | 2004-11-18 | Dainippon Screen Mfg Co Ltd | 基板反転装置およびそれを備えた基板処理装置 |
JP4467367B2 (ja) * | 2004-06-22 | 2010-05-26 | 大日本スクリーン製造株式会社 | 基板反転装置、基板搬送装置、基板処理装置、基板反転方法、基板搬送方法および基板処理方法 |
-
2006
- 2006-12-27 JP JP2006351998A patent/JP4726776B2/ja active Active
-
2007
- 2007-12-17 TW TW096148183A patent/TWI364088B/zh active
- 2007-12-17 KR KR1020070132047A patent/KR100934318B1/ko active IP Right Grant
- 2007-12-18 US US11/958,996 patent/US7878213B2/en active Active
- 2007-12-27 CN CN2007103081123A patent/CN101211812B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
TW200834784A (en) | 2008-08-16 |
KR20080061282A (ko) | 2008-07-02 |
JP2008166368A (ja) | 2008-07-17 |
KR100934318B1 (ko) | 2009-12-29 |
US20080156357A1 (en) | 2008-07-03 |
CN101211812A (zh) | 2008-07-02 |
TWI364088B (en) | 2012-05-11 |
US7878213B2 (en) | 2011-02-01 |
JP4726776B2 (ja) | 2011-07-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101211812B (zh) | 基板处理装置 | |
CN101246813B (zh) | 基板处理装置 | |
CN101211758B (zh) | 基板处理装置 | |
CN101211757A (zh) | 基板处理装置以及基板处理方法 | |
CN100573820C (zh) | 基板处理装置 | |
EP1624484B1 (en) | Wafer demounting method, wafer demounting device, and wafer demounting and transferring machine | |
JP3510463B2 (ja) | 基板の整列装置及び整列方法 | |
KR100963361B1 (ko) | 기판처리장치 | |
CN210279987U (zh) | 一种晶圆双面清洗装置 | |
CN1983548A (zh) | 批次形成装置、基板处理系统、批次形成方法及存储介质 | |
CN104241185A (zh) | 基板保持装置及基板清洗装置 | |
CN109932873B (zh) | 一种自动曝光机 | |
JP2739413B2 (ja) | 基板搬送用スカラ型ロボット | |
JP4476101B2 (ja) | 基板処理装置及び平流し型基板搬送装置 | |
KR100466296B1 (ko) | 이송 로봇 및 이를 이용한 기판 정렬 시스템 | |
JP4869097B2 (ja) | 基板処理装置 | |
CN113370022A (zh) | 一种单片定位组件、夹爪机构及上下料装置 | |
CN101130189A (zh) | 基底清洁装置 | |
CN101850537A (zh) | 圆形基片的抛光、清洗装置和方法 | |
KR101625620B1 (ko) | 패널 세정 장치 | |
JP2003174075A (ja) | 基板のピッチ変換装置 | |
JP2002016028A (ja) | 基板処理装置 | |
CN114429920A (zh) | 晶片旋转驱动装置及驱动晶片旋转的方法 | |
CN116403941A (zh) | 一种晶圆清洗烘干回收装置 | |
JPH08243971A (ja) | チャック装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: SCREEN GROUP CO., LTD. Free format text: FORMER NAME: DAINIPPON SCREEN MFG. CO., LTD. Owner name: DAINIPPON SCREEN MFG. CO., LTD. Free format text: FORMER NAME: DAINIPPON MESH PLATE MFR. CO., LTD. |
|
CP01 | Change in the name or title of a patent holder |
Address after: Kyoto City, Kyoto, Japan Patentee after: Skilling Group Address before: Kyoto City, Kyoto, Japan Patentee before: DAINIPPON SCREEN MFG Co.,Ltd. Address after: Kyoto City, Kyoto, Japan Patentee after: DAINIPPON SCREEN MFG Co.,Ltd. Address before: Kyoto City, Kyoto, Japan Patentee before: Dainippon Screen Mfg. Co.,Ltd. |