CN101202211B - 基板处理装置和基板搬送方法 - Google Patents

基板处理装置和基板搬送方法 Download PDF

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Publication number
CN101202211B
CN101202211B CN2007101670532A CN200710167053A CN101202211B CN 101202211 B CN101202211 B CN 101202211B CN 2007101670532 A CN2007101670532 A CN 2007101670532A CN 200710167053 A CN200710167053 A CN 200710167053A CN 101202211 B CN101202211 B CN 101202211B
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China
Prior art keywords
substrate
temperature
treatment chamber
reference position
carrying device
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CN2007101670532A
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Chinese (zh)
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CN101202211A (zh
Inventor
天野健次
冈部星儿
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
CN2007101670532A 2006-12-12 2007-10-31 基板处理装置和基板搬送方法 Active CN101202211B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006334176 2006-12-12
JP2006-334176 2006-12-12
JP2006334176A JP5036290B2 (ja) 2006-12-12 2006-12-12 基板処理装置および基板搬送方法、ならびにコンピュータプログラム

Publications (2)

Publication Number Publication Date
CN101202211A CN101202211A (zh) 2008-06-18
CN101202211B true CN101202211B (zh) 2013-05-22

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ID=39517287

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CN2007101670532A Active CN101202211B (zh) 2006-12-12 2007-10-31 基板处理装置和基板搬送方法

Country Status (4)

Country Link
JP (1) JP5036290B2 (ja)
KR (1) KR100951149B1 (ja)
CN (1) CN101202211B (ja)
TW (1) TWI427728B (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5173699B2 (ja) * 2008-09-25 2013-04-03 株式会社日立ハイテクノロジーズ 有機ｅｌデバイス製造装置
JP5208800B2 (ja) * 2009-02-17 2013-06-12 東京エレクトロン株式会社 基板処理システム及び基板搬送方法
JP5595202B2 (ja) * 2010-09-28 2014-09-24 東京エレクトロン株式会社 処理装置およびそのメンテナンス方法
CN105097408B (zh) * 2015-07-21 2017-09-26 深圳市华星光电技术有限公司 一种干法刻蚀机台及其使用方法
JP6285411B2 (ja) * 2015-12-25 2018-02-28 株式会社日立国際電気 基板処理装置、半導体装置の製造方法及びプログラム
US10184183B2 (en) * 2016-06-21 2019-01-22 Applied Materials, Inc. Substrate temperature monitoring
JP7008609B2 (ja) * 2018-10-18 2022-01-25 東京エレクトロン株式会社 基板処理装置、及び搬送位置補正方法
CN112447548A (zh) * 2019-09-03 2021-03-05 中微半导体设备(上海)股份有限公司 一种半导体处理设备及腔室间传送口结构
JP7362505B2 (ja) * 2020-02-20 2023-10-17 東京エレクトロン株式会社 基板液処理装置及び液体吐出評価方法
JP7493362B2 (ja) * 2020-03-25 2024-05-31 東京エレクトロン株式会社 基板の処理方法及び基板処理装置
JP2022041221A (ja) * 2020-08-31 2022-03-11 東京エレクトロン株式会社 基板搬送システムの制御方法及び基板搬送システム
JP7216752B2 (ja) * 2021-02-08 2023-02-01 キヤノントッキ株式会社 計測装置、インライン型蒸着装置および調整方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1624871A (zh) * 2003-12-02 2005-06-08 大日本网目版制造株式会社 基板处理装置及基板处理方法
CN1650416A (zh) * 2002-05-23 2005-08-03 安内华株式会社 基板处理装置及处理方法
US7079370B2 (en) * 2003-04-28 2006-07-18 Air Products And Chemicals, Inc. Apparatus and method for removal of surface oxides via fluxless technique electron attachment and remote ion generation

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2908227B2 (ja) * 1993-12-29 1999-06-21 日本電気株式会社 半導体製造装置
US6213704B1 (en) * 1998-05-20 2001-04-10 Applied Komatsu Technology, Inc. Method and apparatus for substrate transfer and processing
JP2000286324A (ja) * 1999-03-31 2000-10-13 Kokusai Electric Co Ltd 基板処理装置
JP2002261154A (ja) * 2001-03-02 2002-09-13 Anelva Corp 基板処理装置における基板のアライメント方法及び基板処理装置
JP4884621B2 (ja) * 2001-09-28 2012-02-29 株式会社日立国際電気 半導体製造装置、半導体製造方法、半導体製造装置のメンテナンス方法
JP3950698B2 (ja) * 2002-02-08 2007-08-01 キヤノン株式会社 半導体露光装置
JP2005191494A (ja) * 2003-12-26 2005-07-14 Canon Inc 露光装置、デバイスの製造方法
JP4330467B2 (ja) * 2004-02-26 2009-09-16 東京エレクトロン株式会社 プロセス装置及び該プロセス装置内のパーティクル除去方法
JP2005262367A (ja) * 2004-03-18 2005-09-29 Tokyo Electron Ltd 搬送ロボットの搬送ズレ確認方法及び処理装置
JP2006155169A (ja) * 2004-11-29 2006-06-15 Omron Corp 温度制御方法、温度調節器および熱処理システム

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1650416A (zh) * 2002-05-23 2005-08-03 安内华株式会社 基板处理装置及处理方法
US7079370B2 (en) * 2003-04-28 2006-07-18 Air Products And Chemicals, Inc. Apparatus and method for removal of surface oxides via fluxless technique electron attachment and remote ion generation
CN1624871A (zh) * 2003-12-02 2005-06-08 大日本网目版制造株式会社 基板处理装置及基板处理方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开2005-93587A 2005.04.07

Also Published As

Publication number Publication date
JP2008147483A (ja) 2008-06-26
CN101202211A (zh) 2008-06-18
KR100951149B1 (ko) 2010-04-07
KR20080054362A (ko) 2008-06-17
TW200834792A (en) 2008-08-16
TWI427728B (zh) 2014-02-21
JP5036290B2 (ja) 2012-09-26

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