CN101151741B - 柔性led阵列 - Google Patents

柔性led阵列 Download PDF

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Publication number
CN101151741B
CN101151741B CN2006800106635A CN200680010663A CN101151741B CN 101151741 B CN101151741 B CN 101151741B CN 2006800106635 A CN2006800106635 A CN 2006800106635A CN 200680010663 A CN200680010663 A CN 200680010663A CN 101151741 B CN101151741 B CN 101151741B
Authority
CN
China
Prior art keywords
led
cooling pad
pads
leds
conductive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2006800106635A
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English (en)
Chinese (zh)
Other versions
CN101151741A (zh
Inventor
M·A·德萨姆伯
M·西肯斯
H·J·埃金克
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Publication of CN101151741A publication Critical patent/CN101151741A/zh
Application granted granted Critical
Publication of CN101151741B publication Critical patent/CN101151741B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional radiating surfaces
    • H05B33/26—Light sources with substantially two-dimensional radiating surfaces characterised by the composition or arrangement of the conductive material used as an electrode
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8585—Means for heat extraction or cooling being an interconnection

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
CN2006800106635A 2005-03-30 2006-03-22 柔性led阵列 Expired - Fee Related CN101151741B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP05102491.7 2005-03-30
EP05102491 2005-03-30
PCT/IB2006/050877 WO2006103596A2 (en) 2005-03-30 2006-03-22 Flexible led array

Publications (2)

Publication Number Publication Date
CN101151741A CN101151741A (zh) 2008-03-26
CN101151741B true CN101151741B (zh) 2010-06-23

Family

ID=37053756

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2006800106635A Expired - Fee Related CN101151741B (zh) 2005-03-30 2006-03-22 柔性led阵列

Country Status (7)

Country Link
US (1) US8622578B2 (enExample)
EP (1) EP1875519A2 (enExample)
JP (1) JP2008535233A (enExample)
KR (1) KR101249230B1 (enExample)
CN (1) CN101151741B (enExample)
TW (1) TW200644290A (enExample)
WO (1) WO2006103596A2 (enExample)

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DE102007004304A1 (de) * 2007-01-29 2008-07-31 Osram Opto Semiconductors Gmbh Dünnfilm-Leuchtdioden-Chip und Verfahren zur Herstellung eines Dünnfilm-Leuchtdioden-Chips
JP4718504B2 (ja) 2007-03-07 2011-07-06 株式会社沖データ 表示装置
JP2008300544A (ja) * 2007-05-30 2008-12-11 Sharp Corp 発光装置およびその製造方法
JP5140368B2 (ja) * 2007-10-01 2013-02-06 ローム株式会社 照明装置
DE102007059133B4 (de) * 2007-12-07 2023-04-06 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Substrat für ein LED-Submount, LED-Submount und LED-Lichtquelle
GB2458972B (en) 2008-08-05 2010-09-01 Photonstar Led Ltd Thermally optimised led chip-on-board module
FI122908B (fi) * 2008-09-26 2012-08-31 Kone Corp Järjestely ja menetelmä LED -valonlähteen jäähdyttämiseksi, kuljetusjärjestelmän valaistusjärjestely sekä LED -valaisin
GB2464102A (en) * 2008-10-01 2010-04-07 Optovate Ltd Illumination apparatus comprising multiple monolithic subarrays
EP2425179B1 (en) * 2009-04-28 2015-02-25 Koninklijke Philips N.V. Lighting unit
KR101709082B1 (ko) 2010-03-16 2017-02-23 삼성디스플레이 주식회사 발광 소자를 포함하는 회로 기판 및 표시장치
GB2484713A (en) 2010-10-21 2012-04-25 Optovate Ltd Illumination apparatus
KR101066471B1 (ko) * 2011-01-11 2011-09-21 주식회사 루맥스바이오 가변형 ｌｅｄ 패키지 및 이것을 이용한 조립구조체
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KR101188747B1 (ko) * 2012-07-18 2012-10-10 지스마트 주식회사 투명전광판 및 그 제조방법
JP6060578B2 (ja) 2012-09-14 2017-01-18 日亜化学工業株式会社 発光装置
JP6079159B2 (ja) 2012-11-16 2017-02-15 日亜化学工業株式会社 発光装置
DE102013007641A1 (de) * 2013-05-06 2014-11-06 Paulmann Licht Gmbh Beleuchtungsanordnung
JP2016527530A (ja) * 2013-05-17 2016-09-08 エロギア インコーポレイテッド ファブリック封入ライトアレイおよび衣類に画像を表示するシステム
CN103390614B (zh) * 2013-08-14 2016-08-17 中国科学院长春光学精密机械与物理研究所 高发光均匀性的微型柔性led面阵器件
CN103400850B (zh) * 2013-08-14 2016-01-20 中国科学院长春光学精密机械与物理研究所 用于微显示与照明的柔性led阵列器件及制作方法
CN103400924B (zh) * 2013-08-14 2015-11-25 中国科学院长春光学精密机械与物理研究所 微型柔性led阵列器件及制备方法
US9642566B2 (en) * 2013-10-04 2017-05-09 General Electric Company Flexible embedded sensor arrays and methods of making the same
US20150133753A1 (en) * 2013-11-14 2015-05-14 General Electric Company Arrays of emitters for pulse oximetry devices and methods of making the same
US10692843B2 (en) 2013-12-04 2020-06-23 3M Innovative Properties Company Flexible light emitting semiconductor device with large area conduit
KR102164488B1 (ko) * 2013-12-10 2020-10-12 삼성전자주식회사 디스플레이 장치
CN106461167A (zh) 2014-03-10 2017-02-22 长寿灯泡有限责任公司 具有内部柔性散热器和电路的led灯泡
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FI128468B (en) * 2014-11-24 2020-06-15 Flexbright Oy Flexible illuminating multilayer structure
CN110061027B (zh) * 2015-02-13 2024-01-19 首尔伟傲世有限公司 发光元件
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CN114725272B (zh) * 2016-03-24 2025-03-11 索尼公司 显示装置、发光装置以及照明装置
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JP2017212384A (ja) * 2016-05-27 2017-11-30 ソニー株式会社 発光素子及び表示装置
CN106129225A (zh) * 2016-08-26 2016-11-16 常州市武进区半导体照明应用技术研究院 一种形状可调的柔性led光源及其制作方法
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Also Published As

Publication number Publication date
KR20070117692A (ko) 2007-12-12
EP1875519A2 (en) 2008-01-09
TW200644290A (en) 2006-12-16
JP2008535233A (ja) 2008-08-28
KR101249230B1 (ko) 2013-04-01
US8622578B2 (en) 2014-01-07
WO2006103596A3 (en) 2007-03-15
CN101151741A (zh) 2008-03-26
US20080225523A1 (en) 2008-09-18
WO2006103596A2 (en) 2006-10-05

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