CN101098936B - 导热硅氧烷弹性体、导热硅氧烷弹性体组合物和导热介质 - Google Patents

导热硅氧烷弹性体、导热硅氧烷弹性体组合物和导热介质 Download PDF

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Publication number
CN101098936B
CN101098936B CN200580029110XA CN200580029110A CN101098936B CN 101098936 B CN101098936 B CN 101098936B CN 200580029110X A CN200580029110X A CN 200580029110XA CN 200580029110 A CN200580029110 A CN 200580029110A CN 101098936 B CN101098936 B CN 101098936B
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China
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methyl
component
polysiloxane
vinyl
conductive silicone
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Expired - Lifetime
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CN101098936A (zh
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关场一广
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DuPont Toray Specialty Materials KK
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Dow Corning Toray Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2170/00—Compositions for adhesives
    • C08G2170/40—Compositions for pressure-sensitive adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2330/00—Thermal insulation material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN200580029110XA 2004-08-30 2005-08-29 导热硅氧烷弹性体、导热硅氧烷弹性体组合物和导热介质 Expired - Lifetime CN101098936B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2004251098 2004-08-30
JP251098/2004 2004-08-30
JP2005238279A JP5015436B2 (ja) 2004-08-30 2005-08-19 熱伝導性シリコーンエラストマー、熱伝導媒体および熱伝導性シリコーンエラストマー組成物
JP238279/2005 2005-08-19
PCT/JP2005/016170 WO2006025552A1 (en) 2004-08-30 2005-08-29 Thermoconductive silicone elastomer, thermoconductive silicone elastomer composition and thermoconductive medium

Publications (2)

Publication Number Publication Date
CN101098936A CN101098936A (zh) 2008-01-02
CN101098936B true CN101098936B (zh) 2011-01-12

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CN200580029110XA Expired - Lifetime CN101098936B (zh) 2004-08-30 2005-08-29 导热硅氧烷弹性体、导热硅氧烷弹性体组合物和导热介质

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Country Link
US (1) US7956121B2 (enExample)
EP (1) EP1791911B9 (enExample)
JP (1) JP5015436B2 (enExample)
KR (1) KR101261250B1 (enExample)
CN (1) CN101098936B (enExample)
AT (1) ATE444337T1 (enExample)
DE (1) DE602005016948D1 (enExample)
TW (1) TWI397555B (enExample)
WO (1) WO2006025552A1 (enExample)

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CN101084275B (zh) 2004-12-23 2011-09-14 陶氏康宁公司 可交联的糖-硅氧烷组合物，和由其形成的网络、涂层和制品
KR101261256B1 (ko) 2005-05-23 2013-05-07 다우 코닝 코포레이션 사카라이드-실록산 공중합체를 포함하는 퍼스널 케어조성물
EP1928970B1 (en) * 2005-09-29 2009-10-28 Dow Corning Toray Co., Ltd. Thermoconductive silicone elastomer, thermoconductive silicone elastomer composition and thermoconductive medium
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PL2121818T3 (pl) * 2007-02-09 2013-01-31 Dow Corning Sposób recyklingu tworzywa sztucznego
JP5197631B2 (ja) 2007-02-20 2013-05-15 ダウ コーニング コーポレーション 水素結合性ポリオルガノシロキサンベースの充填材処理剤
JP2008239719A (ja) * 2007-03-26 2008-10-09 Dow Corning Toray Co Ltd シリコーンエラストマー組成物およびシリコーンエラストマー
CN101835830B (zh) * 2007-08-31 2013-02-20 卡伯特公司 热界面材料
EP2188834A4 (en) * 2007-09-11 2014-03-19 Dow Corning COMPOSITE, THERMAL INTERMEDIATE MATERIAL WITH THE COMPOSITE AND METHOD FOR ITS MANUFACTURE AND USE
KR20100069667A (ko) * 2007-09-11 2010-06-24 다우 코닝 코포레이션 열계면재료, 열계면재료를 포함하는 전자장치, 그리고 이들의 제조방법 및 용도
JP5367656B2 (ja) * 2010-07-29 2013-12-11 日東電工株式会社 フリップチップ型半導体裏面用フィルム及びその用途
WO2012027073A1 (en) 2010-08-23 2012-03-01 Dow Corning Corporation Saccharide siloxanes stable in aqueous environments and methods for the preparation and use of such saccharide siloxanes
KR101570753B1 (ko) * 2012-06-05 2015-11-20 다우 코닝 (차이나) 홀딩 코포레이션., 엘티디. 전력 컨버터에서 사용하기 위한 연성 점착성 겔
EP2863725B1 (en) 2012-06-15 2021-04-28 Kaneka Corporation Heat dissipation structure
TWI639165B (zh) 2013-06-14 2018-10-21 美商道康寧公司 用於電源轉換器之軟黏凝膠
CN103740110A (zh) * 2013-12-23 2014-04-23 华为技术有限公司 一种定向柔性导热材料及其成型工艺和应用
CN104017537A (zh) * 2014-06-26 2014-09-03 轻工业部南京电光源材料科学研究所 一种用于led灯具封装的导热胶及其制备方法
DE102015222657A1 (de) 2015-11-17 2016-05-04 Schaeffler Technologies AG & Co. KG Wärmeleitfähige Elastomermischung mit guten Gleiteigenschaften und Dichtung aus einer derartigen Elastomermischung
WO2017143508A1 (en) * 2016-02-23 2017-08-31 Dow Corning Corporation Curable high hardness silicone composition and composite articles made thereof
KR101872199B1 (ko) * 2016-12-13 2018-06-28 비엔비머티리얼 주식회사 천연흑연, 알루미나 및 질화알루미늄을 포함하는 실리콘 복합조성물 및 이를 사용한 열전도 구리스 제조방법
TWI798326B (zh) * 2018-01-12 2023-04-11 美商陶氏有機矽公司 添加劑有機聚矽氧烷組成物、可固化組成物、及膜
WO2020149193A1 (ja) 2019-01-15 2020-07-23 コスモ石油ルブリカンツ株式会社 硬化性組成物及び硬化物
CN114989610A (zh) * 2022-06-01 2022-09-02 深圳市华天启科技有限公司 一种可塑阻燃导热材料及其制备方法
CN119894982A (zh) * 2022-10-10 2025-04-25 美国陶氏有机硅公司 导热硅酮组合物
JP2024084555A (ja) * 2022-12-13 2024-06-25 信越化学工業株式会社 熱伝導性複合シリコーンゴムシート
CN121128321A (zh) * 2023-05-18 2025-12-12 汉高股份有限及两合公司 用于高弹性导热间隙垫的组合物
WO2025105432A1 (ja) * 2023-11-15 2025-05-22 大阪有機化学工業株式会社 硬化性樹脂組成物、硬化物、及び、ギャップフィラー

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CN1495245A (zh) * 2002-09-02 2004-05-12 ��Խ��ѧ��ҵ��ʽ���� 导热复合片材及其制备方法
CN1497035A (zh) * 2002-10-04 2004-05-19 ��Խ��ѧ��ҵ��ʽ���� 导热硅橡胶复合片材

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Also Published As

Publication number Publication date
DE602005016948D1 (de) 2009-11-12
KR101261250B1 (ko) 2013-05-07
EP1791911A1 (en) 2007-06-06
JP5015436B2 (ja) 2012-08-29
CN101098936A (zh) 2008-01-02
TWI397555B (zh) 2013-06-01
WO2006025552A1 (en) 2006-03-09
EP1791911B9 (en) 2010-05-19
TW200621892A (en) 2006-07-01
EP1791911B1 (en) 2009-09-30
US7956121B2 (en) 2011-06-07
JP2006096986A (ja) 2006-04-13
US20090275688A1 (en) 2009-11-05
ATE444337T1 (de) 2009-10-15
KR20070051929A (ko) 2007-05-18

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