TWI397555B - Thermally conductive silicone elastomers, heat transfer media and thermally conductive silicone elastomer compositions - Google Patents

Thermally conductive silicone elastomers, heat transfer media and thermally conductive silicone elastomer compositions Download PDF

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Publication number
TWI397555B
TWI397555B TW094129689A TW94129689A TWI397555B TW I397555 B TWI397555 B TW I397555B TW 094129689 A TW094129689 A TW 094129689A TW 94129689 A TW94129689 A TW 94129689A TW I397555 B TWI397555 B TW I397555B
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TW
Taiwan
Prior art keywords
heat
weight
group
thermally conductive
molecule
Prior art date
Application number
TW094129689A
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English (en)
Chinese (zh)
Other versions
TW200621892A (en
Inventor
関場一廣
Original Assignee
道康寧特雷股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 道康寧特雷股份有限公司 filed Critical 道康寧特雷股份有限公司
Publication of TW200621892A publication Critical patent/TW200621892A/zh
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Publication of TWI397555B publication Critical patent/TWI397555B/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2170/00—Compositions for adhesives
    • C08G2170/40—Compositions for pressure-sensitive adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2330/00—Thermal insulation material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW094129689A 2004-08-30 2005-08-30 Thermally conductive silicone elastomers, heat transfer media and thermally conductive silicone elastomer compositions TWI397555B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004251098 2004-08-30
JP2005238279A JP5015436B2 (ja) 2004-08-30 2005-08-19 熱伝導性シリコーンエラストマー、熱伝導媒体および熱伝導性シリコーンエラストマー組成物

Publications (2)

Publication Number Publication Date
TW200621892A TW200621892A (en) 2006-07-01
TWI397555B true TWI397555B (zh) 2013-06-01

Family

ID=35285469

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094129689A TWI397555B (zh) 2004-08-30 2005-08-30 Thermally conductive silicone elastomers, heat transfer media and thermally conductive silicone elastomer compositions

Country Status (9)

Country Link
US (1) US7956121B2 (enExample)
EP (1) EP1791911B9 (enExample)
JP (1) JP5015436B2 (enExample)
KR (1) KR101261250B1 (enExample)
CN (1) CN101098936B (enExample)
AT (1) ATE444337T1 (enExample)
DE (1) DE602005016948D1 (enExample)
TW (1) TWI397555B (enExample)
WO (1) WO2006025552A1 (enExample)

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JP5015436B2 (ja) * 2004-08-30 2012-08-29 東レ・ダウコーニング株式会社 熱伝導性シリコーンエラストマー、熱伝導媒体および熱伝導性シリコーンエラストマー組成物
WO2006071772A2 (en) 2004-12-23 2006-07-06 Dow Corning Corporation Crosslinkable saccharide-siloxane compositions, and networks, coatings and articles formed therefrom
US8877216B2 (en) 2005-05-23 2014-11-04 Dow Corning Corporation Cosmetic and skin-care compositions comprising saccharide-siloxane copolymers
EP1928970B1 (en) 2005-09-29 2009-10-28 Dow Corning Toray Co., Ltd. Thermoconductive silicone elastomer, thermoconductive silicone elastomer composition and thermoconductive medium
JP5163489B2 (ja) 2006-03-31 2013-03-13 株式会社ニコン 画像処理方法、画像処理プログラム、および画像処理装置
WO2007139812A2 (en) 2006-05-23 2007-12-06 Dow Corning Corporation Novel silicone film former for delivery of actives
JP2008016727A (ja) 2006-07-07 2008-01-24 Tokyo Electron Ltd 伝熱構造体及び基板処理装置
CN101605843B (zh) * 2007-02-09 2012-07-11 陶氏康宁公司 塑料再循环的方法
WO2008103219A1 (en) 2007-02-20 2008-08-28 Dow Corning Coration Filler treating agents based on hydrogen bonding polyorganosiloxanes
JP2008239719A (ja) * 2007-03-26 2008-10-09 Dow Corning Toray Co Ltd シリコーンエラストマー組成物およびシリコーンエラストマー
WO2009032212A1 (en) * 2007-08-31 2009-03-12 Cabot Corporation Thermal interface materials
CN101803010B (zh) * 2007-09-11 2014-01-29 陶氏康宁公司 热界面材料，包含该热界面材料的电子器件和其制备和使用的方法
WO2009035906A2 (en) * 2007-09-11 2009-03-19 Dow Corning Corporation Composite, thermal interface material containing the composite, and methods for their preparation and use
JP5367656B2 (ja) * 2010-07-29 2013-12-11 日東電工株式会社 フリップチップ型半導体裏面用フィルム及びその用途
US8853372B2 (en) 2010-08-23 2014-10-07 Dow Corning Corporation Saccharide siloxanes stable in aqueous environments and methods for the preparation and use of such saccharide siloxanes
KR101570753B1 (ko) * 2012-06-05 2015-11-20 다우 코닝 (차이나) 홀딩 코포레이션., 엘티디. 전력 컨버터에서 사용하기 위한 연성 점착성 겔
US10356946B2 (en) 2012-06-15 2019-07-16 Kaneka Corporation Heat dissipation structure
TWI639165B (zh) 2013-06-14 2018-10-21 美商道康寧公司 用於電源轉換器之軟黏凝膠
CN103740110A (zh) * 2013-12-23 2014-04-23 华为技术有限公司 一种定向柔性导热材料及其成型工艺和应用
CN104017537A (zh) * 2014-06-26 2014-09-03 轻工业部南京电光源材料科学研究所 一种用于led灯具封装的导热胶及其制备方法
DE102015222657A1 (de) 2015-11-17 2016-05-04 Schaeffler Technologies AG & Co. KG Wärmeleitfähige Elastomermischung mit guten Gleiteigenschaften und Dichtung aus einer derartigen Elastomermischung
WO2017143508A1 (en) 2016-02-23 2017-08-31 Dow Corning Corporation Curable high hardness silicone composition and composite articles made thereof
KR101872199B1 (ko) * 2016-12-13 2018-06-28 비엔비머티리얼 주식회사 천연흑연, 알루미나 및 질화알루미늄을 포함하는 실리콘 복합조성물 및 이를 사용한 열전도 구리스 제조방법
TWI798326B (zh) * 2018-01-12 2023-04-11 美商陶氏有機矽公司 添加劑有機聚矽氧烷組成物、可固化組成物、及膜
JP7460552B2 (ja) 2019-01-15 2024-04-02 コスモ石油ルブリカンツ株式会社 硬化性組成物及び硬化物
CN114989610A (zh) * 2022-06-01 2022-09-02 深圳市华天启科技有限公司 一种可塑阻燃导热材料及其制备方法
KR20250086678A (ko) * 2022-10-10 2025-06-13 다우 실리콘즈 코포레이션 열 전도성 실리콘 조성물
JP7824869B2 (ja) * 2022-12-13 2026-03-05 信越化学工業株式会社 熱伝導性複合シリコーンゴムシート
CN121128321A (zh) * 2023-05-18 2025-12-12 汉高股份有限及两合公司 用于高弹性导热间隙垫的组合物
WO2025105432A1 (ja) * 2023-11-15 2025-05-22 大阪有機化学工業株式会社 硬化性樹脂組成物、硬化物、及び、ギャップフィラー

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JPS562349A (en) * 1979-06-21 1981-01-12 Toshiba Silicone Co Ltd Molded rubber article for heat dissipation

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Also Published As

Publication number Publication date
EP1791911B1 (en) 2009-09-30
TW200621892A (en) 2006-07-01
US7956121B2 (en) 2011-06-07
CN101098936B (zh) 2011-01-12
DE602005016948D1 (de) 2009-11-12
EP1791911A1 (en) 2007-06-06
JP2006096986A (ja) 2006-04-13
EP1791911B9 (en) 2010-05-19
US20090275688A1 (en) 2009-11-05
JP5015436B2 (ja) 2012-08-29
KR101261250B1 (ko) 2013-05-07
WO2006025552A1 (en) 2006-03-09
KR20070051929A (ko) 2007-05-18
CN101098936A (zh) 2008-01-02
ATE444337T1 (de) 2009-10-15

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