TWI397555B - Thermally conductive silicone elastomers, heat transfer media and thermally conductive silicone elastomer compositions - Google Patents

Thermally conductive silicone elastomers, heat transfer media and thermally conductive silicone elastomer compositions Download PDF

Info

Publication number
TWI397555B
TWI397555B TW094129689A TW94129689A TWI397555B TW I397555 B TWI397555 B TW I397555B TW 094129689 A TW094129689 A TW 094129689A TW 94129689 A TW94129689 A TW 94129689A TW I397555 B TWI397555 B TW I397555B
Authority
TW
Taiwan
Prior art keywords
heat
weight
group
thermally conductive
molecule
Prior art date
Application number
TW094129689A
Other languages
English (en)
Chinese (zh)
Other versions
TW200621892A (en
Inventor
関場一廣
Original Assignee
道康寧特雷股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 道康寧特雷股份有限公司 filed Critical 道康寧特雷股份有限公司
Publication of TW200621892A publication Critical patent/TW200621892A/zh
Application granted granted Critical
Publication of TWI397555B publication Critical patent/TWI397555B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2170/00—Compositions for adhesives
    • C08G2170/40—Compositions for pressure-sensitive adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2330/00—Thermal insulation material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW094129689A 2004-08-30 2005-08-30 Thermally conductive silicone elastomers, heat transfer media and thermally conductive silicone elastomer compositions TWI397555B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004251098 2004-08-30
JP2005238279A JP5015436B2 (ja) 2004-08-30 2005-08-19 熱伝導性シリコーンエラストマー、熱伝導媒体および熱伝導性シリコーンエラストマー組成物

Publications (2)

Publication Number Publication Date
TW200621892A TW200621892A (en) 2006-07-01
TWI397555B true TWI397555B (zh) 2013-06-01

Family

ID=35285469

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094129689A TWI397555B (zh) 2004-08-30 2005-08-30 Thermally conductive silicone elastomers, heat transfer media and thermally conductive silicone elastomer compositions

Country Status (9)

Country Link
US (1) US7956121B2 (enExample)
EP (1) EP1791911B9 (enExample)
JP (1) JP5015436B2 (enExample)
KR (1) KR101261250B1 (enExample)
CN (1) CN101098936B (enExample)
AT (1) ATE444337T1 (enExample)
DE (1) DE602005016948D1 (enExample)
TW (1) TWI397555B (enExample)
WO (1) WO2006025552A1 (enExample)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5015436B2 (ja) * 2004-08-30 2012-08-29 東レ・ダウコーニング株式会社 熱伝導性シリコーンエラストマー、熱伝導媒体および熱伝導性シリコーンエラストマー組成物
JP4880615B2 (ja) 2004-12-23 2012-02-22 ダウ・コーニング・コーポレイション 架橋可能なサッカライド−シロキサン組成物、ならびにこれから形成された網目状構造体、コーティング、および製品
KR101261256B1 (ko) 2005-05-23 2013-05-07 다우 코닝 코포레이션 사카라이드-실록산 공중합체를 포함하는 퍼스널 케어조성물
WO2007037019A1 (en) 2005-09-29 2007-04-05 Dow Corning Toray Co., Ltd. Thermoconductive silicone elastomer, thermoconductive silicone elastomer composition and thermoconductive medium
JP5163489B2 (ja) 2006-03-31 2013-03-13 株式会社ニコン 画像処理方法、画像処理プログラム、および画像処理装置
CN101478973B (zh) 2006-05-23 2013-08-28 陶氏康宁公司 用于递送活性成分的新型硅氧烷成膜剂
JP2008016727A (ja) 2006-07-07 2008-01-24 Tokyo Electron Ltd 伝熱構造体及び基板処理装置
CN101605843B (zh) * 2007-02-09 2012-07-11 陶氏康宁公司 塑料再循环的方法
US8247357B2 (en) 2007-02-20 2012-08-21 Dow Corning Corporation Filler treating agents based on hydrogen bonding polyorganosiloxanes
JP2008239719A (ja) * 2007-03-26 2008-10-09 Dow Corning Toray Co Ltd シリコーンエラストマー組成物およびシリコーンエラストマー
CN101835830B (zh) * 2007-08-31 2013-02-20 卡伯特公司 热界面材料
EP2188834A4 (en) * 2007-09-11 2014-03-19 Dow Corning COMPOSITE, THERMAL INTERMEDIATE MATERIAL WITH THE COMPOSITE AND METHOD FOR ITS MANUFACTURE AND USE
EP2188836A2 (en) * 2007-09-11 2010-05-26 Dow Corning Corporation Thermal interface material, electronic device containing the thermal interface material, and methods for their preparation and use
JP5367656B2 (ja) * 2010-07-29 2013-12-11 日東電工株式会社 フリップチップ型半導体裏面用フィルム及びその用途
EP2609138B1 (en) 2010-08-23 2017-05-17 Dow Corning Corporation Saccharide siloxanes stable in aqueous environments and methods for the preparation and use of such saccharide siloxanes
KR101570753B1 (ko) * 2012-06-05 2015-11-20 다우 코닝 (차이나) 홀딩 코포레이션., 엘티디. 전력 컨버터에서 사용하기 위한 연성 점착성 겔
JP6268086B2 (ja) * 2012-06-15 2018-01-24 株式会社カネカ 放熱構造体
TWI639165B (zh) 2013-06-14 2018-10-21 美商道康寧公司 用於電源轉換器之軟黏凝膠
CN103740110A (zh) * 2013-12-23 2014-04-23 华为技术有限公司 一种定向柔性导热材料及其成型工艺和应用
CN104017537A (zh) * 2014-06-26 2014-09-03 轻工业部南京电光源材料科学研究所 一种用于led灯具封装的导热胶及其制备方法
DE102015222657A1 (de) 2015-11-17 2016-05-04 Schaeffler Technologies AG & Co. KG Wärmeleitfähige Elastomermischung mit guten Gleiteigenschaften und Dichtung aus einer derartigen Elastomermischung
WO2017143508A1 (en) 2016-02-23 2017-08-31 Dow Corning Corporation Curable high hardness silicone composition and composite articles made thereof
KR101872199B1 (ko) * 2016-12-13 2018-06-28 비엔비머티리얼 주식회사 천연흑연, 알루미나 및 질화알루미늄을 포함하는 실리콘 복합조성물 및 이를 사용한 열전도 구리스 제조방법
TWI798326B (zh) * 2018-01-12 2023-04-11 美商陶氏有機矽公司 添加劑有機聚矽氧烷組成物、可固化組成物、及膜
US20220089855A1 (en) 2019-01-15 2022-03-24 Cosmo Oil Lubricants Co., Ltd. Curable Composition and Cured Material
CN114989610A (zh) * 2022-06-01 2022-09-02 深圳市华天启科技有限公司 一种可塑阻燃导热材料及其制备方法
CN119894982A (zh) * 2022-10-10 2025-04-25 美国陶氏有机硅公司 导热硅酮组合物
JP2024084555A (ja) * 2022-12-13 2024-06-25 信越化学工業株式会社 熱伝導性複合シリコーンゴムシート
WO2024234368A1 (en) * 2023-05-18 2024-11-21 Henkel Ag & Co. Kgaa Composition for high-resilient thermally conductive gap pad
WO2025105432A1 (ja) * 2023-11-15 2025-05-22 大阪有機化学工業株式会社 硬化性樹脂組成物、硬化物、及び、ギャップフィラー

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS562349A (en) * 1979-06-21 1981-01-12 Toshiba Silicone Co Ltd Molded rubber article for heat dissipation

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58219259A (ja) 1982-06-14 1983-12-20 Toray Silicone Co Ltd 熱伝導性シリコ−ンゴム組成物
US4604424A (en) * 1986-01-29 1986-08-05 Dow Corning Corporation Thermally conductive polyorganosiloxane elastomer composition
JPS63251466A (ja) * 1987-04-06 1988-10-18 Shin Etsu Chem Co Ltd 熱伝導性液状シリコ−ンゴム組成物
CN1020826C (zh) * 1990-01-24 1993-05-19 阎宝连 导热绝缘硅板及其制法
JP2691823B2 (ja) * 1991-01-24 1997-12-17 信越化学工業株式会社 硬化性シリコーン組成物およびその硬化物
US5365267A (en) * 1992-06-19 1994-11-15 Linvatec Corporation White balance target
US5801332A (en) * 1995-08-31 1998-09-01 Minnesota Mining And Manufacturing Company Elastically recoverable silicone splice cover
JP3597277B2 (ja) * 1995-10-17 2004-12-02 東レ・ダウコーニング・シリコーン株式会社 熱伝導性シリコーンゴムおよびその組成物
JP2001011402A (ja) 1999-04-27 2001-01-16 Tokai Rubber Ind Ltd プラズマディスプレイ
JP3803058B2 (ja) * 2001-12-11 2006-08-02 信越化学工業株式会社 熱伝導性シリコーン組成物、その硬化物及び敷設方法並びにそれを用いた半導体装置の放熱構造体
JP3920746B2 (ja) * 2002-09-02 2007-05-30 信越化学工業株式会社 熱伝導性複合シートおよびその製造方法
JP4162955B2 (ja) * 2002-09-13 2008-10-08 信越化学工業株式会社 放熱部材用粘着性シリコーン組成物
JP4572056B2 (ja) * 2002-10-04 2010-10-27 信越化学工業株式会社 熱伝導性シリコーンゴム複合シート
US7013965B2 (en) * 2003-04-29 2006-03-21 General Electric Company Organic matrices containing nanomaterials to enhance bulk thermal conductivity
US20050049350A1 (en) * 2003-08-25 2005-03-03 Sandeep Tonapi Thin bond-line silicone adhesive composition and method for preparing the same
JP5015436B2 (ja) * 2004-08-30 2012-08-29 東レ・ダウコーニング株式会社 熱伝導性シリコーンエラストマー、熱伝導媒体および熱伝導性シリコーンエラストマー組成物

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS562349A (en) * 1979-06-21 1981-01-12 Toshiba Silicone Co Ltd Molded rubber article for heat dissipation

Also Published As

Publication number Publication date
US7956121B2 (en) 2011-06-07
ATE444337T1 (de) 2009-10-15
KR20070051929A (ko) 2007-05-18
JP5015436B2 (ja) 2012-08-29
CN101098936A (zh) 2008-01-02
JP2006096986A (ja) 2006-04-13
TW200621892A (en) 2006-07-01
KR101261250B1 (ko) 2013-05-07
DE602005016948D1 (de) 2009-11-12
EP1791911A1 (en) 2007-06-06
WO2006025552A1 (en) 2006-03-09
EP1791911B9 (en) 2010-05-19
US20090275688A1 (en) 2009-11-05
EP1791911B1 (en) 2009-09-30
CN101098936B (zh) 2011-01-12

Similar Documents

Publication Publication Date Title
TWI397555B (zh) Thermally conductive silicone elastomers, heat transfer media and thermally conductive silicone elastomer compositions
KR102692945B1 (ko) 열전도성 점착층을 갖는 열전도성 실리콘 고무 시트
CN100402626C (zh) 导热性组合物及使用其的腻子状散热片和散热结构体
JP4144998B2 (ja) 放熱用部材
TWI477559B (zh) Thermally conductive silicone oxygen elastomer and method of manufacturing the same
TW583275B (en) A heat radiating component
JP2004130646A (ja) 熱伝導性シート
CN101273106B (zh) 导热有机硅弹性体、导热有机硅弹性体组合物和导热介质
JP6314915B2 (ja) 放熱パテシート
TWI814766B (zh) 熱傳導性薄膜狀硬化物及其製造方法，以及熱傳導性構件
JP7478704B2 (ja) 熱伝導性複合シート及び発熱性電子部品の実装方法
CN107399115B (zh) 导热性复合片材
CN112714784B (zh) 导热性有机硅组合物及其固化物
JP2004051968A (ja) 熱伝導性硬化性液状ポリマー組成物および半導体装置
TW201116615A (en) Thermally conductive composition
JP2022078110A (ja) 熱伝導性粘着層を有する熱伝導性シリコーンゴムシート
JP2005042096A (ja) 熱伝導性組成物及びこれを用いたパテ状放熱シートと放熱構造体
WO2025264732A1 (en) Thermal interface materials

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees