ATE444337T1 - Wärmeleitendes silikonelastomer, wärmeleitfähige silikonelastomerzusammensetzung und wärmeleitendes medium - Google Patents
Wärmeleitendes silikonelastomer, wärmeleitfähige silikonelastomerzusammensetzung und wärmeleitendes mediumInfo
- Publication number
- ATE444337T1 ATE444337T1 AT05776836T AT05776836T ATE444337T1 AT E444337 T1 ATE444337 T1 AT E444337T1 AT 05776836 T AT05776836 T AT 05776836T AT 05776836 T AT05776836 T AT 05776836T AT E444337 T1 ATE444337 T1 AT E444337T1
- Authority
- AT
- Austria
- Prior art keywords
- heat
- conductive
- silicone elastomer
- thermoconductive
- conductive silicone
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2170/00—Compositions for adhesives
- C08G2170/40—Compositions for pressure-sensitive adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2330/00—Thermal insulation material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004251098 | 2004-08-30 | ||
JP2005238279A JP5015436B2 (ja) | 2004-08-30 | 2005-08-19 | 熱伝導性シリコーンエラストマー、熱伝導媒体および熱伝導性シリコーンエラストマー組成物 |
PCT/JP2005/016170 WO2006025552A1 (en) | 2004-08-30 | 2005-08-29 | Thermoconductive silicone elastomer, thermoconductive silicone elastomer composition and thermoconductive medium |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE444337T1 true ATE444337T1 (de) | 2009-10-15 |
Family
ID=35285469
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT05776836T ATE444337T1 (de) | 2004-08-30 | 2005-08-29 | Wärmeleitendes silikonelastomer, wärmeleitfähige silikonelastomerzusammensetzung und wärmeleitendes medium |
Country Status (9)
Country | Link |
---|---|
US (1) | US7956121B2 (de) |
EP (1) | EP1791911B9 (de) |
JP (1) | JP5015436B2 (de) |
KR (1) | KR101261250B1 (de) |
CN (1) | CN101098936B (de) |
AT (1) | ATE444337T1 (de) |
DE (1) | DE602005016948D1 (de) |
TW (1) | TWI397555B (de) |
WO (1) | WO2006025552A1 (de) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5015436B2 (ja) * | 2004-08-30 | 2012-08-29 | 東レ・ダウコーニング株式会社 | 熱伝導性シリコーンエラストマー、熱伝導媒体および熱伝導性シリコーンエラストマー組成物 |
JP4880615B2 (ja) | 2004-12-23 | 2012-02-22 | ダウ・コーニング・コーポレイション | 架橋可能なサッカライド−シロキサン組成物、ならびにこれから形成された網目状構造体、コーティング、および製品 |
EP1885331A2 (de) | 2005-05-23 | 2008-02-13 | Dow Corning Corporation | Körperpflegezusammensetzungen mit saccharid-siloxan-copolymeren |
DE602005017437D1 (de) | 2005-09-29 | 2009-12-10 | Dow Corning Toray Co Ltd | Wärmeleitendes silikonelastomer, wärmeleitfähige silikonelastomerzusammensetzung und wärmeleitendes medium |
JP5163489B2 (ja) | 2006-03-31 | 2013-03-13 | 株式会社ニコン | 画像処理方法、画像処理プログラム、および画像処理装置 |
WO2007139812A2 (en) | 2006-05-23 | 2007-12-06 | Dow Corning Corporation | Novel silicone film former for delivery of actives |
JP2008016727A (ja) | 2006-07-07 | 2008-01-24 | Tokyo Electron Ltd | 伝熱構造体及び基板処理装置 |
JP2010517760A (ja) * | 2007-02-09 | 2010-05-27 | ダウ・コーニング・コーポレイション | プラスチックを再利用する方法 |
JP5197631B2 (ja) | 2007-02-20 | 2013-05-15 | ダウ コーニング コーポレーション | 水素結合性ポリオルガノシロキサンベースの充填材処理剤 |
JP2008239719A (ja) * | 2007-03-26 | 2008-10-09 | Dow Corning Toray Co Ltd | シリコーンエラストマー組成物およびシリコーンエラストマー |
US20090068441A1 (en) * | 2007-08-31 | 2009-03-12 | Swaroop Srinivas H | Thermal interface materials |
US8334592B2 (en) * | 2007-09-11 | 2012-12-18 | Dow Corning Corporation | Thermal interface material, electronic device containing the thermal interface material, and methods for their preparation and use |
US20100328895A1 (en) * | 2007-09-11 | 2010-12-30 | Dorab Bhagwagar | Composite, Thermal Interface Material Containing the Composite, and Methods for Their Preparation and Use |
JP5367656B2 (ja) * | 2010-07-29 | 2013-12-11 | 日東電工株式会社 | フリップチップ型半導体裏面用フィルム及びその用途 |
CN103068887B (zh) | 2010-08-23 | 2015-09-09 | 道康宁公司 | 在水性环境中稳定的糖硅氧烷以及这些糖硅氧烷的制备和使用方法 |
WO2013131330A1 (en) * | 2012-06-05 | 2013-09-12 | Dow Corning Corporation | Soft tacky gel for use in power converters |
CN104350814B (zh) * | 2012-06-15 | 2017-10-13 | 株式会社钟化 | 散热结构体、便携式信息终端、电子设备及电子设备的修理方法 |
TWI639165B (zh) | 2013-06-14 | 2018-10-21 | 美商道康寧公司 | 用於電源轉換器之軟黏凝膠 |
CN103740110A (zh) * | 2013-12-23 | 2014-04-23 | 华为技术有限公司 | 一种定向柔性导热材料及其成型工艺和应用 |
CN104017537A (zh) * | 2014-06-26 | 2014-09-03 | 轻工业部南京电光源材料科学研究所 | 一种用于led灯具封装的导热胶及其制备方法 |
DE102015222657A1 (de) | 2015-11-17 | 2016-05-04 | Schaeffler Technologies AG & Co. KG | Wärmeleitfähige Elastomermischung mit guten Gleiteigenschaften und Dichtung aus einer derartigen Elastomermischung |
WO2017143508A1 (en) * | 2016-02-23 | 2017-08-31 | Dow Corning Corporation | Curable high hardness silicone composition and composite articles made thereof |
KR101872199B1 (ko) * | 2016-12-13 | 2018-06-28 | 비엔비머티리얼 주식회사 | 천연흑연, 알루미나 및 질화알루미늄을 포함하는 실리콘 복합조성물 및 이를 사용한 열전도 구리스 제조방법 |
TWI798326B (zh) * | 2018-01-12 | 2023-04-11 | 美商陶氏有機矽公司 | 添加劑有機聚矽氧烷組成物、可固化組成物、及膜 |
US20220089855A1 (en) | 2019-01-15 | 2022-03-24 | Cosmo Oil Lubricants Co., Ltd. | Curable Composition and Cured Material |
CN114989610A (zh) * | 2022-06-01 | 2022-09-02 | 深圳市华天启科技有限公司 | 一种可塑阻燃导热材料及其制备方法 |
WO2024077435A1 (en) * | 2022-10-10 | 2024-04-18 | Dow Silicones Corporation | Thermally conductive silicone composition |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS562349A (en) * | 1979-06-21 | 1981-01-12 | Toshiba Silicone Co Ltd | Molded rubber article for heat dissipation |
JPS58219259A (ja) | 1982-06-14 | 1983-12-20 | Toray Silicone Co Ltd | 熱伝導性シリコ−ンゴム組成物 |
US4604424A (en) * | 1986-01-29 | 1986-08-05 | Dow Corning Corporation | Thermally conductive polyorganosiloxane elastomer composition |
JPS63251466A (ja) * | 1987-04-06 | 1988-10-18 | Shin Etsu Chem Co Ltd | 熱伝導性液状シリコ−ンゴム組成物 |
CN1020826C (zh) * | 1990-01-24 | 1993-05-19 | 阎宝连 | 导热绝缘硅板及其制法 |
JP2691823B2 (ja) * | 1991-01-24 | 1997-12-17 | 信越化学工業株式会社 | 硬化性シリコーン組成物およびその硬化物 |
US5365267A (en) * | 1992-06-19 | 1994-11-15 | Linvatec Corporation | White balance target |
US5801332A (en) * | 1995-08-31 | 1998-09-01 | Minnesota Mining And Manufacturing Company | Elastically recoverable silicone splice cover |
JP3597277B2 (ja) * | 1995-10-17 | 2004-12-02 | 東レ・ダウコーニング・シリコーン株式会社 | 熱伝導性シリコーンゴムおよびその組成物 |
JP2001011402A (ja) | 1999-04-27 | 2001-01-16 | Tokai Rubber Ind Ltd | プラズマディスプレイ |
JP3803058B2 (ja) * | 2001-12-11 | 2006-08-02 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物、その硬化物及び敷設方法並びにそれを用いた半導体装置の放熱構造体 |
JP3920746B2 (ja) * | 2002-09-02 | 2007-05-30 | 信越化学工業株式会社 | 熱伝導性複合シートおよびその製造方法 |
JP4162955B2 (ja) * | 2002-09-13 | 2008-10-08 | 信越化学工業株式会社 | 放熱部材用粘着性シリコーン組成物 |
JP4572056B2 (ja) * | 2002-10-04 | 2010-10-27 | 信越化学工業株式会社 | 熱伝導性シリコーンゴム複合シート |
US7013965B2 (en) * | 2003-04-29 | 2006-03-21 | General Electric Company | Organic matrices containing nanomaterials to enhance bulk thermal conductivity |
US20050049350A1 (en) * | 2003-08-25 | 2005-03-03 | Sandeep Tonapi | Thin bond-line silicone adhesive composition and method for preparing the same |
JP5015436B2 (ja) * | 2004-08-30 | 2012-08-29 | 東レ・ダウコーニング株式会社 | 熱伝導性シリコーンエラストマー、熱伝導媒体および熱伝導性シリコーンエラストマー組成物 |
-
2005
- 2005-08-19 JP JP2005238279A patent/JP5015436B2/ja active Active
- 2005-08-29 AT AT05776836T patent/ATE444337T1/de not_active IP Right Cessation
- 2005-08-29 DE DE602005016948T patent/DE602005016948D1/de active Active
- 2005-08-29 EP EP05776836A patent/EP1791911B9/de not_active Not-in-force
- 2005-08-29 WO PCT/JP2005/016170 patent/WO2006025552A1/en active Application Filing
- 2005-08-29 KR KR1020077007295A patent/KR101261250B1/ko active IP Right Grant
- 2005-08-29 CN CN200580029110XA patent/CN101098936B/zh active Active
- 2005-08-29 US US11/574,345 patent/US7956121B2/en active Active
- 2005-08-30 TW TW094129689A patent/TWI397555B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP1791911A1 (de) | 2007-06-06 |
KR101261250B1 (ko) | 2013-05-07 |
CN101098936A (zh) | 2008-01-02 |
DE602005016948D1 (de) | 2009-11-12 |
CN101098936B (zh) | 2011-01-12 |
TW200621892A (en) | 2006-07-01 |
WO2006025552A1 (en) | 2006-03-09 |
TWI397555B (zh) | 2013-06-01 |
KR20070051929A (ko) | 2007-05-18 |
US20090275688A1 (en) | 2009-11-05 |
JP2006096986A (ja) | 2006-04-13 |
US7956121B2 (en) | 2011-06-07 |
JP5015436B2 (ja) | 2012-08-29 |
EP1791911B9 (de) | 2010-05-19 |
EP1791911B1 (de) | 2009-09-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |