ATE446998T1 - Wärmeleitendes silikonelastomer, wärmeleitfähige silikonelastomerzusammensetzung und wärmeleitendes medium - Google Patents

Wärmeleitendes silikonelastomer, wärmeleitfähige silikonelastomerzusammensetzung und wärmeleitendes medium

Info

Publication number
ATE446998T1
ATE446998T1 AT05790291T AT05790291T ATE446998T1 AT E446998 T1 ATE446998 T1 AT E446998T1 AT 05790291 T AT05790291 T AT 05790291T AT 05790291 T AT05790291 T AT 05790291T AT E446998 T1 ATE446998 T1 AT E446998T1
Authority
AT
Austria
Prior art keywords
heat
silicone elastomer
conductive
thermoconductive
conductive silicone
Prior art date
Application number
AT05790291T
Other languages
English (en)
Inventor
Kazuhiro Sekiba
Original Assignee
Dow Corning Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Application granted granted Critical
Publication of ATE446998T1 publication Critical patent/ATE446998T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
AT05790291T 2005-09-29 2005-09-29 Wärmeleitendes silikonelastomer, wärmeleitfähige silikonelastomerzusammensetzung und wärmeleitendes medium ATE446998T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2005/018482 WO2007037019A1 (en) 2005-09-29 2005-09-29 Thermoconductive silicone elastomer, thermoconductive silicone elastomer composition and thermoconductive medium

Publications (1)

Publication Number Publication Date
ATE446998T1 true ATE446998T1 (de) 2009-11-15

Family

ID=36353891

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05790291T ATE446998T1 (de) 2005-09-29 2005-09-29 Wärmeleitendes silikonelastomer, wärmeleitfähige silikonelastomerzusammensetzung und wärmeleitendes medium

Country Status (7)

Country Link
US (1) US7999033B2 (de)
EP (1) EP1928970B1 (de)
KR (1) KR101224371B1 (de)
CN (1) CN101273106B (de)
AT (1) ATE446998T1 (de)
DE (1) DE602005017437D1 (de)
WO (1) WO2007037019A1 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101803010B (zh) 2007-09-11 2014-01-29 陶氏康宁公司 热界面材料，包含该热界面材料的电子器件和其制备和使用的方法
WO2010127215A1 (en) * 2009-05-01 2010-11-04 Lord Corporation Highly conductive thermal interface, no pump-out thermal interface greases and method for producing them
JP5367656B2 (ja) * 2010-07-29 2013-12-11 日東電工株式会社 フリップチップ型半導体裏面用フィルム及びその用途
CN102516930B (zh) * 2011-12-13 2014-01-01 烟台德邦科技有限公司 一种高温固化单组份导热阻燃电子灌封胶及其制备方法
CN103582921B (zh) * 2012-06-05 2016-06-22 道康宁公司 用于电源转换器中的发粘软凝胶
CN103215010B (zh) * 2013-04-28 2014-09-03 深圳市新亚新材料有限公司 一种单组份脱醇型导热阻燃固定胶及其制备方法
CN104017537A (zh) * 2014-06-26 2014-09-03 轻工业部南京电光源材料科学研究所 一种用于led灯具封装的导热胶及其制备方法
DE102015222657A1 (de) 2015-11-17 2016-05-04 Schaeffler Technologies AG & Co. KG Wärmeleitfähige Elastomermischung mit guten Gleiteigenschaften und Dichtung aus einer derartigen Elastomermischung
JP6515860B2 (ja) * 2016-04-13 2019-05-22 信越化学工業株式会社 熱伝導性含フッ素接着剤組成物及び電気・電子部品
US10384441B2 (en) * 2016-07-28 2019-08-20 Xerox Corporation Fluorosilicone composite and formulation process for imaging plate
US11136437B2 (en) * 2016-08-08 2021-10-05 Dow Toray Co., Ltd. Curable particulate silicone composition, semiconductor member comprising curable particulate silicone composition, and method for molding semiconductor member
KR102370817B1 (ko) * 2016-08-08 2022-03-08 듀폰 도레이 스페셜티 머티리얼즈 가부시키가이샤 경화성 입상 실리콘 조성물, 이것으로 이루어지는 광반사재 및 이의 제조 방법
JP7275473B2 (ja) * 2017-03-03 2023-05-18 住友ベークライト株式会社 エラストマーおよび成形体
CN108010924A (zh) * 2017-12-06 2018-05-08 京东方科技集团股份有限公司 一种阵列基板及制作方法、显示面板
CN111117558B (zh) * 2019-05-15 2022-07-08 浙江天易新材料有限公司 一种低密度导热型有机硅电子灌封胶及其制备方法
TWI866369B (zh) * 2023-08-03 2024-12-11 聚燁科技股份有限公司 導熱基板

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US606920A (en) * 1898-07-05 Stop-gate
JPS562349A (en) 1979-06-21 1981-01-12 Toshiba Silicone Co Ltd Molded rubber article for heat dissipation
JPS58219259A (ja) * 1982-06-14 1983-12-20 Toray Silicone Co Ltd 熱伝導性シリコ−ンゴム組成物
EP0134079B1 (de) * 1983-08-31 1990-08-29 UNIROYAL CHEMICAL COMPANY, Inc. Verfahren zur Herstellung von Poly-(alpha)-Olefinen
US4604424A (en) * 1986-01-29 1986-08-05 Dow Corning Corporation Thermally conductive polyorganosiloxane elastomer composition
JPS63251466A (ja) * 1987-04-06 1988-10-18 Shin Etsu Chem Co Ltd 熱伝導性液状シリコ−ンゴム組成物
US5801332A (en) * 1995-08-31 1998-09-01 Minnesota Mining And Manufacturing Company Elastically recoverable silicone splice cover
US6069201A (en) * 1997-09-12 2000-05-30 Shin-Etsu Chemical Co., Ltd. Zinc oxide-filled addition-curable silicone rubber compositions
JP2001011402A (ja) 1999-04-27 2001-01-16 Tokai Rubber Ind Ltd プラズマディスプレイ
US7195720B2 (en) * 2002-02-20 2007-03-27 Kaneka Corporation Curable composition for heat conductive material
US7013965B2 (en) * 2003-04-29 2006-03-21 General Electric Company Organic matrices containing nanomaterials to enhance bulk thermal conductivity
US20050049350A1 (en) * 2003-08-25 2005-03-03 Sandeep Tonapi Thin bond-line silicone adhesive composition and method for preparing the same
JP5015436B2 (ja) * 2004-08-30 2012-08-29 東レ・ダウコーニング株式会社 熱伝導性シリコーンエラストマー、熱伝導媒体および熱伝導性シリコーンエラストマー組成物

Also Published As

Publication number Publication date
KR20080063795A (ko) 2008-07-07
CN101273106B (zh) 2012-09-26
WO2007037019A1 (en) 2007-04-05
KR101224371B1 (ko) 2013-01-21
DE602005017437D1 (de) 2009-12-10
EP1928970A1 (de) 2008-06-11
CN101273106A (zh) 2008-09-24
US7999033B2 (en) 2011-08-16
US20090191414A1 (en) 2009-07-30
EP1928970B1 (de) 2009-10-28

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