ATE446998T1 - Wärmeleitendes silikonelastomer, wärmeleitfähige silikonelastomerzusammensetzung und wärmeleitendes medium - Google Patents
Wärmeleitendes silikonelastomer, wärmeleitfähige silikonelastomerzusammensetzung und wärmeleitendes mediumInfo
- Publication number
- ATE446998T1 ATE446998T1 AT05790291T AT05790291T ATE446998T1 AT E446998 T1 ATE446998 T1 AT E446998T1 AT 05790291 T AT05790291 T AT 05790291T AT 05790291 T AT05790291 T AT 05790291T AT E446998 T1 ATE446998 T1 AT E446998T1
- Authority
- AT
- Austria
- Prior art keywords
- heat
- silicone elastomer
- conductive
- thermoconductive
- conductive silicone
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2005/018482 WO2007037019A1 (en) | 2005-09-29 | 2005-09-29 | Thermoconductive silicone elastomer, thermoconductive silicone elastomer composition and thermoconductive medium |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE446998T1 true ATE446998T1 (de) | 2009-11-15 |
Family
ID=36353891
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT05790291T ATE446998T1 (de) | 2005-09-29 | 2005-09-29 | Wärmeleitendes silikonelastomer, wärmeleitfähige silikonelastomerzusammensetzung und wärmeleitendes medium |
Country Status (7)
Country | Link |
---|---|
US (1) | US7999033B2 (de) |
EP (1) | EP1928970B1 (de) |
KR (1) | KR101224371B1 (de) |
CN (1) | CN101273106B (de) |
AT (1) | ATE446998T1 (de) |
DE (1) | DE602005017437D1 (de) |
WO (1) | WO2007037019A1 (de) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8334592B2 (en) | 2007-09-11 | 2012-12-18 | Dow Corning Corporation | Thermal interface material, electronic device containing the thermal interface material, and methods for their preparation and use |
WO2010127215A1 (en) * | 2009-05-01 | 2010-11-04 | Lord Corporation | Highly conductive thermal interface, no pump-out thermal interface greases and method for producing them |
JP5367656B2 (ja) * | 2010-07-29 | 2013-12-11 | 日東電工株式会社 | フリップチップ型半導体裏面用フィルム及びその用途 |
CN102516930B (zh) * | 2011-12-13 | 2014-01-01 | 烟台德邦科技有限公司 | 一种高温固化单组份导热阻燃电子灌封胶及其制备方法 |
WO2013131330A1 (en) * | 2012-06-05 | 2013-09-12 | Dow Corning Corporation | Soft tacky gel for use in power converters |
CN103215010B (zh) * | 2013-04-28 | 2014-09-03 | 深圳市新亚新材料有限公司 | 一种单组份脱醇型导热阻燃固定胶及其制备方法 |
CN104017537A (zh) * | 2014-06-26 | 2014-09-03 | 轻工业部南京电光源材料科学研究所 | 一种用于led灯具封装的导热胶及其制备方法 |
DE102015222657A1 (de) | 2015-11-17 | 2016-05-04 | Schaeffler Technologies AG & Co. KG | Wärmeleitfähige Elastomermischung mit guten Gleiteigenschaften und Dichtung aus einer derartigen Elastomermischung |
JP6515860B2 (ja) * | 2016-04-13 | 2019-05-22 | 信越化学工業株式会社 | 熱伝導性含フッ素接着剤組成物及び電気・電子部品 |
US10384441B2 (en) * | 2016-07-28 | 2019-08-20 | Xerox Corporation | Fluorosilicone composite and formulation process for imaging plate |
CN109689791B (zh) * | 2016-08-08 | 2022-09-16 | 道康宁东丽株式会社 | 固化性粒状硅组合物、由其构成的半导体用构件及其成型方法 |
KR102370817B1 (ko) * | 2016-08-08 | 2022-03-08 | 듀폰 도레이 스페셜티 머티리얼즈 가부시키가이샤 | 경화성 입상 실리콘 조성물, 이것으로 이루어지는 광반사재 및 이의 제조 방법 |
JP7275473B2 (ja) * | 2017-03-03 | 2023-05-18 | 住友ベークライト株式会社 | エラストマーおよび成形体 |
CN108010924A (zh) * | 2017-12-06 | 2018-05-08 | 京东方科技集团股份有限公司 | 一种阵列基板及制作方法、显示面板 |
CN111117558B (zh) * | 2019-05-15 | 2022-07-08 | 浙江天易新材料有限公司 | 一种低密度导热型有机硅电子灌封胶及其制备方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US606920A (en) * | 1898-07-05 | Stop-gate | ||
JPS562349A (en) | 1979-06-21 | 1981-01-12 | Toshiba Silicone Co Ltd | Molded rubber article for heat dissipation |
JPS58219259A (ja) * | 1982-06-14 | 1983-12-20 | Toray Silicone Co Ltd | 熱伝導性シリコ−ンゴム組成物 |
DE3478603D1 (en) * | 1983-08-31 | 1989-07-13 | Uniroyal Chem Co Inc | Catalyst for alpha-olefin polymerization |
US4604424A (en) * | 1986-01-29 | 1986-08-05 | Dow Corning Corporation | Thermally conductive polyorganosiloxane elastomer composition |
JPS63251466A (ja) * | 1987-04-06 | 1988-10-18 | Shin Etsu Chem Co Ltd | 熱伝導性液状シリコ−ンゴム組成物 |
US5801332A (en) * | 1995-08-31 | 1998-09-01 | Minnesota Mining And Manufacturing Company | Elastically recoverable silicone splice cover |
US6069201A (en) * | 1997-09-12 | 2000-05-30 | Shin-Etsu Chemical Co., Ltd. | Zinc oxide-filled addition-curable silicone rubber compositions |
JP2001011402A (ja) | 1999-04-27 | 2001-01-16 | Tokai Rubber Ind Ltd | プラズマディスプレイ |
US7195720B2 (en) * | 2002-02-20 | 2007-03-27 | Kaneka Corporation | Curable composition for heat conductive material |
US7013965B2 (en) * | 2003-04-29 | 2006-03-21 | General Electric Company | Organic matrices containing nanomaterials to enhance bulk thermal conductivity |
US20050049350A1 (en) * | 2003-08-25 | 2005-03-03 | Sandeep Tonapi | Thin bond-line silicone adhesive composition and method for preparing the same |
JP5015436B2 (ja) | 2004-08-30 | 2012-08-29 | 東レ・ダウコーニング株式会社 | 熱伝導性シリコーンエラストマー、熱伝導媒体および熱伝導性シリコーンエラストマー組成物 |
-
2005
- 2005-09-29 AT AT05790291T patent/ATE446998T1/de not_active IP Right Cessation
- 2005-09-29 KR KR1020087010157A patent/KR101224371B1/ko active IP Right Grant
- 2005-09-29 CN CN200580051720XA patent/CN101273106B/zh active Active
- 2005-09-29 US US12/088,586 patent/US7999033B2/en not_active Expired - Fee Related
- 2005-09-29 EP EP20050790291 patent/EP1928970B1/de not_active Not-in-force
- 2005-09-29 WO PCT/JP2005/018482 patent/WO2007037019A1/en active Application Filing
- 2005-09-29 DE DE602005017437T patent/DE602005017437D1/de active Active
Also Published As
Publication number | Publication date |
---|---|
KR101224371B1 (ko) | 2013-01-21 |
EP1928970B1 (de) | 2009-10-28 |
CN101273106A (zh) | 2008-09-24 |
DE602005017437D1 (de) | 2009-12-10 |
US7999033B2 (en) | 2011-08-16 |
WO2007037019A1 (en) | 2007-04-05 |
CN101273106B (zh) | 2012-09-26 |
EP1928970A1 (de) | 2008-06-11 |
KR20080063795A (ko) | 2008-07-07 |
US20090191414A1 (en) | 2009-07-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |