TW200626675A - Thermally-conductive silicone elastomer and thermally-conductive silicone elastomer composition - Google Patents

Thermally-conductive silicone elastomer and thermally-conductive silicone elastomer composition

Info

Publication number
TW200626675A
TW200626675A TW094133551A TW94133551A TW200626675A TW 200626675 A TW200626675 A TW 200626675A TW 094133551 A TW094133551 A TW 094133551A TW 94133551 A TW94133551 A TW 94133551A TW 200626675 A TW200626675 A TW 200626675A
Authority
TW
Taiwan
Prior art keywords
thermally
silicone elastomer
conductive silicone
heat
conductive
Prior art date
Application number
TW094133551A
Other languages
Chinese (zh)
Other versions
TWI477559B (en
Inventor
Kazuhiro Sekiba
Original Assignee
Dow Corning Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Publication of TW200626675A publication Critical patent/TW200626675A/en
Application granted granted Critical
Publication of TWI477559B publication Critical patent/TWI477559B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

To provide a thermally-conductive silicone elastomer capable of being interposed between a heat-generating member and a heat-radiating member, even when not subjected to screwing, bolting, or the like, and capable of being drawn and peeled from a space between the heat-generating member and the heat-radiating member, and to provide a thermally-conductive silicone elastomer composition capable of being used for the elastomer. This thermally-conductive silicone elastomer comprises a silicone elastomer comprising a cured product of a hydrosilylation reaction curable organopolysiloxane composition, a reinforcing silica fine powder dispersed in the elastomer, a thermally-conductive inorganic powder, and a nonreactive organopolysiloxane existing as a liquid at ordinary temperature. The hydrosilylation reaction curable thermally-conductive silicone elastomer composition comprises the hydrosilylation reaction curable organopolysiloxane composition, the reinforcing silica fine powder, the thermally-conductive inorganic powder, and the nonreactive organopolysiloxane existing as the liquid at the ordinary temperature.
TW094133551A 2004-09-27 2005-09-27 Thermally conductive silicone oxygen elastomer and method of manufacturing the same TWI477559B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004279231A JP2006089675A (en) 2004-09-27 2004-09-27 Thermally-conductive silicone elastomer and thermally-conductive silicone elastomer composition

Publications (2)

Publication Number Publication Date
TW200626675A true TW200626675A (en) 2006-08-01
TWI477559B TWI477559B (en) 2015-03-21

Family

ID=36230956

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094133551A TWI477559B (en) 2004-09-27 2005-09-27 Thermally conductive silicone oxygen elastomer and method of manufacturing the same

Country Status (2)

Country Link
JP (1) JP2006089675A (en)
TW (1) TWI477559B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI510917B (en) * 2009-11-18 2015-12-01 Insyde Software Corp Server management system and method thereof
TWI808186B (en) * 2018-05-31 2023-07-11 日商信越化學工業股份有限公司 Low heat resistance silicone composition
TWI821340B (en) * 2018-09-20 2023-11-11 美商陶氏有機矽公司 Curable silicone composition, and light diffusion material formed thereby

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101479342B (en) * 2006-06-26 2011-08-17 陶氏康宁公司 Preparation of silicone rubber elastomers
JP5283346B2 (en) * 2007-04-10 2013-09-04 信越化学工業株式会社 Thermally conductive cured product and method for producing the same
KR101261443B1 (en) * 2010-10-13 2013-05-10 주식회사 에이치앤에스 Heat-dissipating device of tv set-top box
JP5418620B2 (en) * 2012-02-16 2014-02-19 信越化学工業株式会社 Thermal conduction member
KR101464271B1 (en) * 2012-09-19 2014-11-24 주식회사 케이씨씨 Heat Curable silicone composition and the light emitting device using the same
KR101804047B1 (en) * 2016-04-19 2017-12-01 주식회사 케이씨씨 Organic-silicon composites containing metal and curable organopolysiloxane composition comprising thereof
CN109456602B (en) * 2018-11-19 2021-06-15 华田信科（廊坊）电子科技有限公司 Heat conducting material for microelectronic chip packaging and preparation method thereof
US11373921B2 (en) 2019-04-23 2022-06-28 Honeywell International Inc. Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing
WO2022049902A1 (en) * 2020-09-03 2022-03-10 富士高分子工業株式会社 Thermally conductive silicone heat dissipation material
JP6988023B1 (en) * 2020-09-03 2022-01-05 富士高分子工業株式会社 Thermally conductive silicone heat dissipation material
CN112812741B (en) * 2021-01-27 2023-04-28 湖南柯盛新材料有限公司 Double-component irreversible color-changing sealing silica gel and preparation method thereof
JP7082724B1 (en) * 2021-02-15 2022-06-08 富士高分子工業株式会社 Thermally conductive silicone composition
WO2022172547A1 (en) * 2021-02-15 2022-08-18 富士高分子工業株式会社 Heat-conductive silicone composition
KR20230150791A (en) * 2021-02-26 2023-10-31 세키수이 폴리머텍 가부시키가이샤 Thermal conductive composition, thermally conductive member, battery module
CN114213851A (en) * 2021-07-22 2022-03-22 苏州桐力光电股份有限公司 Organosilicon network in-situ intercalation stacked aluminum oxide material and preparation method thereof

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4446514B2 (en) * 1999-06-15 2010-04-07 電気化学工業株式会社 Thermally conductive silicone molded body heat dissipation member
JP2001139818A (en) * 1999-11-12 2001-05-22 Dow Corning Toray Silicone Co Ltd Thermally conductive silicone rubber composition
JP2004010691A (en) * 2002-06-05 2004-01-15 Shin Etsu Chem Co Ltd Thermally conductive silicone rubber molding
JP4232469B2 (en) * 2003-01-27 2009-03-04 信越化学工業株式会社 Silicone rubber composition, fixing roll and fixing belt

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI510917B (en) * 2009-11-18 2015-12-01 Insyde Software Corp Server management system and method thereof
TWI808186B (en) * 2018-05-31 2023-07-11 日商信越化學工業股份有限公司 Low heat resistance silicone composition
TWI821340B (en) * 2018-09-20 2023-11-11 美商陶氏有機矽公司 Curable silicone composition, and light diffusion material formed thereby

Also Published As

Publication number Publication date
JP2006089675A (en) 2006-04-06
TWI477559B (en) 2015-03-21

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees