CN101056758B - 覆金属箔层叠体及其制造方法 - Google Patents
覆金属箔层叠体及其制造方法 Download PDFInfo
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- CN101056758B CN101056758B CN2005800383953A CN200580038395A CN101056758B CN 101056758 B CN101056758 B CN 101056758B CN 2005800383953 A CN2005800383953 A CN 2005800383953A CN 200580038395 A CN200580038395 A CN 200580038395A CN 101056758 B CN101056758 B CN 101056758B
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- Prior art keywords
- liquid crystal
- crystal polymer
- metal
- film
- thermoplastic liquid
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
- B32B37/20—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of continuous webs only
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/44—Joining a heated non plastics element to a plastics element
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
- B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
- B29C66/45—Joining of substantially the whole surface of the articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B29C66/9161—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the heat or the thermal flux, i.e. the heat flux
- B29C66/91641—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the heat or the thermal flux, i.e. the heat flux the heat or the thermal flux being non-constant over time
- B29C66/91643—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the heat or the thermal flux, i.e. the heat flux the heat or the thermal flux being non-constant over time following a heat-time profile
- B29C66/91645—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the heat or the thermal flux, i.e. the heat flux the heat or the thermal flux being non-constant over time following a heat-time profile by steps
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B29C66/919—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges
- B29C66/9192—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams
- B29C66/91921—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature
- B29C66/91931—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature in explicit relation to the fusion temperature or melting point of the material of one of the parts to be joined
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C66/91931—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature in explicit relation to the fusion temperature or melting point of the material of one of the parts to be joined
- B29C66/91933—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature in explicit relation to the fusion temperature or melting point of the material of one of the parts to be joined higher than said fusion temperature
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
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- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0036—Heat treatment
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
- C09K2323/06—Substrate layer characterised by chemical composition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0141—Liquid crystal polymer [LCP]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
Applications Claiming Priority (3)
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JP326086/2004 | 2004-11-10 | ||
JP2004326086A JP2006137011A (ja) | 2004-11-10 | 2004-11-10 | 金属張積層体およびその製造方法 |
PCT/JP2005/019781 WO2006051693A1 (ja) | 2004-11-10 | 2005-10-27 | 金属張積層体およびその製造方法 |
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CN101056758B true CN101056758B (zh) | 2012-07-04 |
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CN111196050A (zh) * | 2018-11-16 | 2020-05-26 | 佳胜科技股份有限公司 | 液晶聚合物薄膜的加工方法及其装置 |
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JP3968068B2 (ja) * | 2003-09-30 | 2007-08-29 | 株式会社クラレ | 液晶ポリマーフィルムの製造方法 |
JP4383487B2 (ja) | 2007-03-19 | 2009-12-16 | 古河電気工業株式会社 | 金属張積層体及び金属張積層体の製造方法 |
US9117602B2 (en) | 2008-01-17 | 2015-08-25 | Harris Corporation | Three-dimensional liquid crystal polymer multilayer circuit board including membrane switch and related methods |
US8778124B2 (en) * | 2008-01-17 | 2014-07-15 | Harris Corporation | Method for making three-dimensional liquid crystal polymer multilayer circuit boards |
CA2741742C (en) | 2008-10-29 | 2017-02-28 | Kci Licensing, Inc. | Modular, reduced-pressure, wound-closure systems and methods |
JP5962298B2 (ja) * | 2012-07-27 | 2016-08-03 | 住友ベークライト株式会社 | 硬化体の製造方法 |
JP6306369B2 (ja) * | 2014-02-25 | 2018-04-04 | 住友化学株式会社 | フィルムの製造方法 |
JP6632541B2 (ja) * | 2014-11-07 | 2020-01-22 | 株式会社クラレ | 回路基板およびその製造方法 |
JP2016107507A (ja) * | 2014-12-05 | 2016-06-20 | 株式会社クラレ | 金属張積層板およびその製造方法 |
WO2016170779A1 (ja) * | 2015-04-20 | 2016-10-27 | 株式会社クラレ | 金属張積層板の製造方法およびこれを用いた金属張積層板 |
KR102304510B1 (ko) | 2016-03-03 | 2021-09-23 | 주식회사 쿠라레 | 금속 클래드 적층판 및 그 제조방법 |
CN113580690B (zh) | 2016-03-08 | 2023-12-08 | 株式会社可乐丽 | 覆金属层叠板 |
JP6880723B2 (ja) | 2016-12-27 | 2021-06-02 | 住友金属鉱山株式会社 | 両面金属積層板、両面金属積層板の製造方法、及びパターンの画像転写方法 |
KR102635625B1 (ko) * | 2017-04-07 | 2024-02-13 | 주식회사 쿠라레 | 금속 피복 적층판 및 그 제조 방법 |
CN111328424B (zh) * | 2017-11-15 | 2022-01-11 | 株式会社村田制作所 | 薄膜电容器以及金属化薄膜 |
JP6764049B1 (ja) * | 2018-11-08 | 2020-09-30 | 株式会社クラレ | 熱可塑性液晶ポリマーフィルムおよびそれを用いた回路基板 |
TWI705995B (zh) * | 2018-11-16 | 2020-10-01 | 佳勝科技股份有限公司 | 液晶聚合物薄膜的加工方法及其裝置 |
CN113329871B (zh) * | 2019-01-25 | 2023-07-04 | 电化株式会社 | 两面覆金属层叠体和其制造方法、绝缘膜及电子电路基板 |
KR102323921B1 (ko) * | 2021-06-09 | 2021-11-08 | 에스케이넥실리스 주식회사 | 동박 제조장치 |
CN114361463A (zh) * | 2021-12-17 | 2022-04-15 | 合肥国轩高科动力能源有限公司 | 一种复合集流体的制备方法 |
WO2023162662A1 (ja) * | 2022-02-28 | 2023-08-31 | 富士フイルム株式会社 | メタマテリアル用基材、メタマテリアル、積層体及びメタマテリアルの製造方法 |
CN117183347B (zh) * | 2023-11-06 | 2024-02-20 | 紫晶电子材料(杭州)有限公司 | 液晶聚合物薄膜及其制造方法及柔性电路板 |
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CN1181139C (zh) * | 1999-11-30 | 2004-12-22 | 大塚化学株式会社 | 树脂组合物和挠性印刷电路板 |
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- 2005-10-27 WO PCT/JP2005/019781 patent/WO2006051693A1/ja active Application Filing
- 2005-10-27 KR KR1020077012843A patent/KR101202233B1/ko active IP Right Grant
- 2005-10-27 CN CN2005800383953A patent/CN101056758B/zh active Active
- 2005-10-27 US US11/718,843 patent/US7811408B2/en active Active
- 2005-11-09 TW TW094139211A patent/TWI359076B/zh active
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EP0507332A2 (en) * | 1991-04-05 | 1992-10-07 | Kuraray Co., Ltd. | Laminate |
US5529740A (en) * | 1994-09-16 | 1996-06-25 | Jester; Randy D. | Process for treating liquid crystal polymer film |
US6616796B1 (en) * | 1999-03-29 | 2003-09-09 | Kuraray Co., Ltd. | Metal laminate for a circuit board |
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TW200621480A (en) | 2006-07-01 |
US9096049B2 (en) | 2015-08-04 |
TWI359076B (en) | 2012-03-01 |
US20100323210A1 (en) | 2010-12-23 |
US7811408B2 (en) | 2010-10-12 |
KR20070085861A (ko) | 2007-08-27 |
WO2006051693A1 (ja) | 2006-05-18 |
JP2006137011A (ja) | 2006-06-01 |
KR101202233B1 (ko) | 2012-11-16 |
CN101056758A (zh) | 2007-10-17 |
US20080107833A1 (en) | 2008-05-08 |
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