CN100596266C - 电子部件的安装装置和安装方法 - Google Patents

电子部件的安装装置和安装方法 Download PDF

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Publication number
CN100596266C
CN100596266C CN200680026381A CN200680026381A CN100596266C CN 100596266 C CN100596266 C CN 100596266C CN 200680026381 A CN200680026381 A CN 200680026381A CN 200680026381 A CN200680026381 A CN 200680026381A CN 100596266 C CN100596266 C CN 100596266C
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CN
China
Prior art keywords
substrate
electronic unit
mentioned
aforesaid substrate
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN200680026381A
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English (en)
Chinese (zh)
Other versions
CN101223840A (zh
Inventor
广濑圭刚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Publication of CN101223840A publication Critical patent/CN101223840A/zh
Application granted granted Critical
Publication of CN100596266C publication Critical patent/CN100596266C/zh
Active legal-status Critical Current
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75743—Suction holding means
    • H01L2224/75745—Suction holding means in the upper part of the bonding apparatus, e.g. in the bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/758—Means for moving parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)
CN200680026381A 2005-08-24 2006-08-10 电子部件的安装装置和安装方法 Active CN100596266C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP243085/2005 2005-08-24
JP2005243085 2005-08-24
PCT/JP2006/315844 WO2007023692A1 (ja) 2005-08-24 2006-08-10 電子部品の実装装置及び実装方法

Publications (2)

Publication Number Publication Date
CN101223840A CN101223840A (zh) 2008-07-16
CN100596266C true CN100596266C (zh) 2010-03-24

Family

ID=37771443

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200680026381A Active CN100596266C (zh) 2005-08-24 2006-08-10 电子部件的安装装置和安装方法

Country Status (5)

Country Link
JP (1) JP4664366B2 (enExample)
KR (1) KR101014292B1 (enExample)
CN (1) CN100596266C (enExample)
TW (1) TW200715436A (enExample)
WO (1) WO2007023692A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4829813B2 (ja) * 2007-03-01 2011-12-07 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法
KR101095189B1 (ko) * 2007-05-25 2011-12-16 시바우라 메카트로닉스 가부시끼가이샤 전자 부품의 실장 장치 및 실장 방법
JP4937857B2 (ja) * 2007-08-03 2012-05-23 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法
JP4918015B2 (ja) * 2007-11-01 2012-04-18 パナソニック株式会社 部品実装方法
JP4852513B2 (ja) * 2007-11-01 2012-01-11 パナソニック株式会社 部品実装システム
US8319831B2 (en) * 2009-03-25 2012-11-27 Fuji Xerox Co., Ltd. Component manipulating method, component extracting method, component assembling method, component manipulating apparatus, component extracting apparatus, and component assembling apparatus
JP2011035028A (ja) * 2009-07-30 2011-02-17 Juki Corp 電子部品実装装置
KR101096460B1 (ko) 2010-10-01 2011-12-20 다래비젼주식회사 기판 부착물 부착장치를 이용한 기판 부착물 부착방법
DE102015106224B4 (de) * 2015-04-22 2022-09-01 Asm Assembly Systems Gmbh & Co. Kg Verfahren zum wiederholten Vermessen eines in einem Bestückbereich eines Bestückautomaten befindlichen Bauelementeträgers sowie Bestückautomat und Computerprogramm zur Durchführung dieses Verfahrens
JP6675356B2 (ja) * 2016-08-16 2020-04-01 芝浦メカトロニクス株式会社 電子部品実装装置
WO2018150573A1 (ja) * 2017-02-20 2018-08-23 株式会社Ｆｕｊｉ 部品実装システムおよび部品実装方法
JP7285303B2 (ja) * 2017-09-28 2023-06-01 芝浦メカトロニクス株式会社 電子部品の実装装置と表示用部材の製造方法
TWI871033B (zh) * 2022-09-29 2025-01-21 日商芝浦機械電子裝置股份有限公司 安裝裝置及基板製造裝置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1153451A (zh) * 1995-10-10 1997-07-02 Lg产电株式会社 表面安装器件安装机的器件识别方法和装置
CN1162195A (zh) * 1996-01-29 1997-10-15 三星航空产业株式会社 元件装配装置
CN1501770A (zh) * 2002-11-13 2004-06-02 ��ʿ��е������ʽ���� 电子部件安装装置的校正方法及装置
JP2005123372A (ja) * 2003-10-16 2005-05-12 Matsushita Electric Ind Co Ltd ワークの装着装置およびワークの装着方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10284891A (ja) * 1997-04-02 1998-10-23 Matsushita Electric Ind Co Ltd 部品実装方法及びその装置
JP2000277991A (ja) * 1999-03-25 2000-10-06 Shibaura Mechatronics Corp 部品実装装置およびその方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1153451A (zh) * 1995-10-10 1997-07-02 Lg产电株式会社 表面安装器件安装机的器件识别方法和装置
CN1162195A (zh) * 1996-01-29 1997-10-15 三星航空产业株式会社 元件装配装置
CN1501770A (zh) * 2002-11-13 2004-06-02 ��ʿ��е������ʽ���� 电子部件安装装置的校正方法及装置
JP2005123372A (ja) * 2003-10-16 2005-05-12 Matsushita Electric Ind Co Ltd ワークの装着装置およびワークの装着方法

Also Published As

Publication number Publication date
KR101014292B1 (ko) 2011-02-16
JP4664366B2 (ja) 2011-04-06
CN101223840A (zh) 2008-07-16
TW200715436A (en) 2007-04-16
WO2007023692A1 (ja) 2007-03-01
JPWO2007023692A1 (ja) 2009-02-26
KR20080046614A (ko) 2008-05-27
TWI311792B (enExample) 2009-07-01

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